陶瓷封裝 的英文怎麼說

中文拼音 [táocífēngzhuāng]
陶瓷封裝 英文
ceramic package
  • 陶 : 陶名詞1. （窯） kiln2. （人名用字） a word used in person's name
  • 瓷 : 名詞（用高嶺土、長石、石英等燒製成的材料） porcelain; china
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 陶瓷 : pottery and porcelain; ceramics陶瓷地磚 floor tile; 陶瓷電子管 ceramic tube; 陶瓷電阻器 ceramic r...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Edge of the granule image by video is the key of its image partition, the article tries to carry through a deeper research on image partition at the same time. granule is made up of savageness mater and industry material ( including of rock, sand, earth, atomy, steel, china, concrete, ink powder, magnetism powder, light fine and tiny powder used silicon, cell etc. )

    顆粒是構成天然物質和工業材料（巖石、礦石、沙子、泥土、塵埃、鋼鐵、陶瓷、水泥、墨粉、磁粉、光纖和料封裝材用高純硅微粉、細胞等）的基本單元，顆粒尺寸（粒度）是顆粒的首要特徵和粉體材料的第一指標。
  2. The passing parts of this catena product all adopt fluorine plastics alloy to press, its headmost product of fluorine alloy centrifugal pumps, axis - envelop choose advanced outer - install form moire - pipe machine - airproof, airproof of oppositely abrade have silicon nitride chinaware f4 horniness alloy to choose

    本系列產品過流部件全部採用氟塑料合金模壓成型工藝製造，是國內生產的最早的一代氟合金離心泵產品，軸封選用先進的外裝式波紋管機械密封，對磨的密封面有：碳化矽陶瓷四氟硬質合金可供選擇。
  3. The catena product is in the light of iso international criterion to design and make iso2858, pumpbody adopt metalline crust pad fluorine plastics inside, impeller and pump - cover all adopt metal embed part wrap fluorine plastics alloy outside to press. to make it possess superduper resist impact and eximious resist causticity, axis - envelop choose advanced outer - install form moire - pipe machine - airproof, airproof of oppositely abrade have silicon nitride chinaware f4 horniness alloy to choose. it has ratio of very high capability and price

    本系列產品按國際標準設計製造iso2858 ，泵體採用金屬外殼內襯氟塑料，葉輪及泵蓋均採用金屬嵌件外包氟塑料合金模壓成型，使其具有超強的抗沖擊能力又有卓越的耐腐蝕性能，軸封選用先進的外裝式波紋管機械密封，對磨的密封面有：碳化硅陶瓷四氟硬質合金可供選擇。
  4. By taking the miniature ceramic rod which is easily to machine high accuracy as sensitive structure, and by printing and polarizing six belt - shaped electrodes above it to constitute three pairs of electrodes, this paper designed package and the phase - sensitive detection circuit in the system so that it effectively reduced the sensitive structure size and improved its processing precision to realize the angular rate gyro microminiaturization

    首先採用易於加工成高精度的微型陶瓷棒作為敏感體，在其上印刷成六個帶狀電極並予以極化構成三副電極對，然後設計了封裝及相敏檢波電路，從而有效地減小了敏感結構的尺寸，提高了其加工精度，實現了角速率陀螺微型化。
  5. The pillow block ball bearing is composed of a single row deep groove ball bearings with seals at both sides and spherical outside surface, and a housing, suitable for simple support, widely used in varieties of mechanical equipment, especially for agricultural, metallurgical, textile and printing machinery

    外球面帶座軸承由一個兩面帶密封圈的單列外球面深溝球軸承和一個軸承座組成，適用於簡單支撐，對主機的製造和安裝精度要求低，安裝拆卸方便，廣泛應用於各種機械設備，尤其使用於農業機械、冶金機械、紡織機械及印刷、印染、食品、建材、陶瓷等各種輸送設備。
  6. The pillow block ball bearing is composed of a single row deep groove ball bearing with seals at both sides and spherical outdide surface, and a housing, suitalie for simpie support, widely usedinvarieties of mechanical epuipment, especially for agricultural, metallurgical, teatile and prnting machinery

    外球面帶座軸承由一個兩面帶密封圈的單列外球面深溝球軸承和一個軸承座組成，適用於簡單支承，對主機的製造和安裝精度要求低，安裝拆卸方便，廣泛應用於各種機械設備，尤其適用於農業機械、冶金機械、紡織機械及印刷、印染、食品、建材、陶瓷等各種輸送設備。
  7. A novel low mechanical hysteretic ceramic capacitive pressure transducer has been made, by using of ceramic sealing technology ; integrate circuit ( ic ) technology and thick film plane fixing circuit technology. this transducer is made of a deformable ceramic diaphragm and a ceramic base plate, between which has an air cavum. a coaxial gold electrode was fired onto the diaphragm and the base plate

    本文利用新型陶瓷技術、集成電路技術和厚膜平面安裝電路技術，採用零力學滯后的陶瓷和陶瓷密封材料進行設計製造了一種非充液乾式的電容式壓力傳感器，該壓力傳感器由較厚的陶瓷基體和較薄的陶瓷膜片構成，中間形成一空氣介質腔，在基座和膜片之間內置同軸的雙電極，組成兩個電容，當膜片承受壓力時發生位移，使電容量產生變化，經後置處理電路直接轉換為可輸出的直流電壓信號。
  8. The unstability for steam content in the sealed devices is described, it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature

    摘要簡述了集成電路陶瓷封裝內部水汽含量的不穩定性，主要是由粘接材料導電膠在高溫下分解釋放出的水汽所造成的。
  9. Major producers of electrical and electronic ceramics, engineering ceramics, ceramic thick - film integrated circuits, ceramics molybdenum, manganese, tungsten metal manganese, ceramic packages such as ceramics pieces

    主要生產電子電器陶瓷、工程陶瓷、陶瓷厚膜集成電路、陶瓷鉬錳、鎢錳金屬化、陶瓷封裝外殼等各種陶瓷瓷件。
  10. Ceramic flat package

    陶瓷扁平封裝
  11. With a rugged ceramic body and seal construction, along with an internal reflector, cermax xenon lamps are a safe and compact alternative to conventional quartz lamps

    與普通的石英燈相比， cermax氙燈具有粗糙的陶瓷體及密封結構，並裝有內置反光燈，是一種更安全的產品
  12. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  13. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  14. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  15. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  16. Ease radial leaded, epoxy dippeded multilayer ceramic capacitors are build by superior moisture and shock resistant epoxy coating can be supplied in bulk or taped reel package for automatic insertion in pcb, our rd series capacitors have wide applications in computer, data processing, telecommunication, industrial control and instrumentation equipment, etc

    立式引線，多層陶瓷電容密封于環氧樹脂中，耐溫，耐撞擊，有塑膠袋散裝，編帶圓盤裝幾種包裝， rd系列電容廣泛應用於電腦，數據處理，通訊設備以及各種儀器設備中。
  17. Ceramic substrate packaging, which has better heat resistance and withstand higher and lower temperature and compact

    採用陶瓷封裝，和矽晶晶片膨脹系數較接近散熱性能良好，耐高低溫與沖擊
  18. The lastic, metal, or ceramic container that enclose a ic. ackage rotect the chi and ring the lead from the outside world to the chip

    封住ic所用的塑料、金屬或陶瓷包裝。封裝可以保護晶元，並使晶元與外部世界連接。
  19. The generator represents magnetron, packaged with constant magnets in ceramic - metal execution

    該磁控管採用金屬陶瓷封裝，裝有永磁體。
  20. The generator represents magnetron packaged with constant magnets in the magnetic - shielded ceramic - metal execution

    該磁控管採用金屬陶瓷封裝，內裝有永磁體。
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