集合電路 的英文怎麼說

中文拼音 [jígědiànlù]
集合電路 英文
aggregate circuit
  • 集 : gatherassemblecollect
  • 合 : 合量詞（容量單位） ge, a unit of dry measure for grain （=1 decilitre）
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 集合 : 1 （聚集） gather; assemble; muster; call together 2 [數學] [自動化] [計算機] assemblage; set; co...
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. The combined toy as right request 3 stated, whose character is : the electronic components electrically or electromagnetically connected with the iron stick or the magnet stick can be resistor, capacitor, inductor, battery, switch, diode, audion, ic ( integrated circuit ), motor, led ( light - emitting diode ), infrared ray receiver, sound circuit and instrument

    如權利要求3所述的組合玩具，其特徵是：和鐵棒或磁鐵棒電連接的電子元器件是可以是電阻、電容、電感、電池、開關、二極體、三極體、集成電路、馬達、發光二極體、紅外線接受器、發聲電路、儀表。
  2. Development of hybrid integrated circuit of high linearphase - locked frequency discriminator

    混合集成電路高線性鎖相鑒頻模塊的研製
  3. Film and hybrid integrated circuits. hermetic packages

    薄模和混合式集成電路.密封外殼
  4. Cpk study of bonding process in hic production

    混合集成電路鍵合工序能力指數探索
  5. Hic hybrid integrated circuit igniter unit

    混合集成電路點火裝置
  6. Hybrid microcircuits. film deposit resistive integrated circuits. general requirements

    混合微電路.薄膜附著電阻集成電路.一般要求
  7. As a new development in the field of electronic oscilloscopes a hand - held digital oscilloscope is a truly integrated test tool, with digital storage oscilloscope ( dso ), multimeter and digital ondometer in one easy - to - use instrument

    =手持式數字示波表是示波器技術的一個新的發展方向。通過使用大規模集成電路和液晶顯示器，它把數字存儲示波器、數字頻率計、數字萬用表組合在一個手持式儀表體內。
  8. Porcelain enameled steel substrate for hybrid integrated circuits

    混合集成電路用被釉鋼基片
  9. The committee has agreed to set up a working group to draw up specific plans for co - operation in four selected areas, namely, automotive parts and accessory systems, radio frequency identification technologies, chinese medicine, and integrated circuit design

    委員會已選定四個范疇，即汽車配件、電子標簽技術、中醫藥及集成電路設計，並同意成立工作小組，制定具體的合作計劃。
  10. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  11. A study on bonding strength of hybrid integrated circuits

    功率混合集成電路鍵合強度控制研究
  12. Nokia will use four chipset suppliers ? texas instruments, broadcom, infineon technologies and stmicroelectronics. chipsets are combinations of integrated circuits that operate together

    諾基亞公司將與四家晶元供應商合作，它們是德州儀器、博通、英飛凌科技公司和意法半導體。晶元組是在一組集成電路的組合。
  13. Strained - soi mosfet, which appears recently, takes both the advantages of soi ( silicon on insulator ) and sige ( silicon germanium ). it has shown advantages over bulk sample in enhanced carriers mobility, as well as higher transconductance, stronger drive capability and reduced parasitic capacitances. these properties make it a promising candidate for improving the performance of microelectronics devices

    Strained - soimosfet是最近幾年才出現的新型器件，它將soi材料和sige材料結合在一起，與傳統體硅器件相比，表現出載流子遷移率高、電流驅動能力強、跨導大、寄生效應小等優勢，特別適用於高性能、高速度、低功耗超大規模集成電路。
  14. Expected that during 2007 - 2011, compound annual growth rate of sales revenue in china ' s integrated circuits industry will arrive to 27. 7 % ; until 2011, the sales revenue of chinese ic industry will exceed rmb 300 billion, at that time, china will become one of the world ' s most important ic manufacturing bases

    預計2007年2011年，中國集成電路產業銷售收入的年均復合增長率將達到27 . 7 ，到2011年，中國集成電路產業銷售收入將突破3000億元，屆時中國將成為世界重要的集成電路製造基地之一。
  15. Gaas crystal is a kind of iii - v group compound semiconductor material with good electrical performance. the semiconductor devices and integrated circuit ( ic ) fabricated on gaas substrate have such advantages of hign - speed information processing that they have drawn the researcher ' s attention

    Gaas晶體是一種電學性能優越的-族化合物半導體材料，以其為襯底製作的半導體器件及集成電路，由於具有信息處理速度快等優點而受到青睞，成為近年來研究的熱點。
  16. Hybrid integrated circuits. detail specification for type hchf01 frequency differencing and channel seperation

    混合集成電路. hchf01型差頻和上下分離電路詳細規范
  17. The macro model of drift region resistance was established based on the solution of poisson ’ s equations and continuity equations. by the combination of spice mos ( level = 3 ) and the macro model, the complete dddmos model was then obtained, which accords well with simulated data. by simulating and comparing different devices of different process parameters, the model is applicable for different bias regions and can be useful in the power integrated circuit research in future

    首先介紹了器件建模的基本原理及相關模擬技術，然後利用工藝模擬軟體生成器件基本結構，並對其基本特性進行了分析;分析了業內和學術界比較通用的高壓器件建模的方法，隨后在模擬實驗的基礎上著重分析了dddmos的物理特性，在求解泊松方程、連續性方程等基本方程的基礎上，建立有物理意義的漂移區電阻的宏模型;隨后結合spicemos （ level = 3 ）模型而得到完整的dddmos模型，此模型與模擬數據符合得比較好，通過對不同工藝參數的器件進行模擬比較，該模型能夠覆蓋不同的工作偏壓范圍，具有較明確的物理意義，對今後的功率集成電路的研發有一定的參考意義。
  18. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - generic specification

    半導體器件.集成電路.混合集成電路和薄膜結構.生產線認證.總規范
  19. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - blank detail specification

    半導體器件.集成電路.混合集成電路和薄膜結構.生產線認證.空白詳細規范
  20. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - procedure for qualification approval

    半導體器件.集成電路.第23 - 5部分:混合集成電路和薄膜結構.生產線認證.合格鑒定規程
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