集成微電路 的英文怎麼說

中文拼音 [jíchéngwéidiànlù]
集成微電路 英文
integrated microcircuit
  • 集 : gatherassemblecollect
  • 成 : Ⅰ動詞1 （完成; 成功） accomplish; succeed 2 （成為; 變為） become; turn into 3 （成全） help comp...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. On the base of analyzing the development status and trend of the electromagnetic flowmeter technology, this article uses new mcu and ic to design the intelligent electromagnetic flowmeter that has a conversion instrument and a cumulation apparatus

    本文在分析國內外電磁流量計發展現狀和趨勢基礎上，採用新型微處理器和集成電路來開發集轉換器、積算儀於一體的智能電磁流量計。
  2. A major step formed in miniaturization came with the integrated circuit.

    集成電路使微型化過程往前邁進了一大步。
  3. Microcircuits. screening procedures for integrated circuits. general requirements

    微電路.集成電路用屏蔽程序.一般要求
  4. Hybrid microcircuits. film deposit resistive integrated circuits. general requirements

    混合微電路.薄膜附著電阻集成電路.一般要求
  5. Thermionic integrated micromodule circuits

    熱電子集成微模電路
  6. On the other hand, waveguide could compose high quality components but hard to be integrated for their huge volume. substrate integrated waveguide ( siw ) is a new kind of microwave transmission line in these years which can be widely used in microwave and millimeter wave circuit

    基片集成波導（ substrateintegratedwaveguide ，簡稱siw ）是一種近年內出現的新型微波傳輸結構，可以廣泛地應用於微波及毫米波電路中
  7. We now take digital circuit approaches to realize the algorithms, i. e. using microprocessor to calculate harmonic components. so as to overcome disadvantages of analogy circuits, for example, instable circuit parameters, low calculation accuracy, inconvenient regulation and low integration level

    在演算法實現上，採用數字方式，即採用微處理器進行數值計算，克服了模擬電路元件參數不穩定、計算精度差、調節不方便和集成度低等缺點。
  8. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  9. Nowadays, all functions of a calculator including calculating units, display driver, keyboard interface and so on, are integrated on one single chip

    現代計算器使用一塊集成電路晶元來完成各種運算、顯示驅動和鍵盤介面等完整功能，依賴的是高度集成的動態cmos邏輯和微碼設計技術。
  10. This paper summarizes the present situation of modern microelectronic device is. with integrated degree of circuits increasing, and the characteristic sizes of technics minishing as well as the device sizes turning into sub - micron and deep sub - micron, there are many problems

    概述了現代微電子器件發展的現狀，電路集成度的不斷提高，加工工藝特徵尺寸的不斷減小，器件尺寸進入了亞微米、深亞微米階段，出現了許多不良效應。
  11. Compared with bst materials, especially in thin films, ps t has smaller ferroelectric critical size, lower crystallization temperature, and compatible fabrication with si micro - electronics, so it can meet the need of the high quality si - based integrate circuit ( ic ). moreover, it is important to promote the development of the miniaturization and integration for the modern devices

    與bst相比，特別作為薄膜材料， pst的鐵電臨界尺寸較小，晶化溫度較低，制備工藝與si微電子工藝兼容，更能夠滿足高性能的si基集成電路的需要，對推動現代器件發展的小型化和集成化具有十分重要的意義。
  12. Data parallel coprocessor dpc, which is scalable and has the powerful data processing ability, is designed for the high performance dsp application market

    隨著集成電路製造工藝的進步，微處理器的處理能力與存儲系統之間的差距越來越大，存儲系統已經成為影響微處理器整體性能的瓶頸。
  13. Eddy - current sensor conversion circuit consist amplification circuit, band - pass filter circuit, demodulation circuit, differentiation phase and data sampling circuit. these circuits are used to convert the test signal of eddy - current sensor to discrete signal tend to process. the microprocessor system that formed of dsp chip is used to data fitting of test system, data displaying and data communicating with personal computer, etc. the interference questions of hardware design and the measure of eliminating interference signal in the subject are introduced in the last of this chapter

    硬體電路的設計主要分三大部分來實現：激勵源電路部分，由分頻電路和頻率合成電路組成，產生頻率穩定的激勵信號以確保檢測任務的正常進行；傳感器變換電路部分，由放大電路、濾波電路、檢波電路、鑒相電路和數據採集電路組成，主要將電渦流傳感器檢測線圈檢測到的信號變換成只含有被測信息的離散信號，易於后續電路處理；由dsp晶元構成的微處理系統，主要完成檢測系統的數據擬合、顯示及與主機通信等功能。
  14. Normally an equipment ' s circuitry is enclosed in a metal cabinet and its ic ' s, microprocessors etc. are protected as if in a faraday cage

    通常來說，一個設備的電路是安裝在一個金屬箱內，電路上的集成電路、微處理器等處于有如「法拉第籠」的保護之中。
  15. Mjc : normally an equipment ' s circuitry is enclosed in a metal cabinet and its ic ' s, microprocessors etc. are protected as if in a faraday cage

    通常來說，一個設備的電路是安裝在一個金屬箱內，電路上的集成電路、微處理器等處于有如「法拉第籠」的保護之中。
  16. Basing on other researchers ’ work, this paper has put forward a novel type of icc ( induced current cancellation ) shielding layer for rfic / mmic performance improvement, to reduce high frequency loss, increase q value, and expand its application frequency range. and present how to realize rfic / mmic components such as i / o pad, inductors, baluns and so on by applying icc shielding layer structures. furthermore co - design methods of ic component structure and foundry process structure designs has been presented in this thesis

    在無線通信技術對cmos射頻/微波集成電路需求的大背景下，本論文提出了用於高頻集成電路（ rfic / mmic ）器件的各類新型icc （ inducedcurrentcancellation ，感應電流相消）屏蔽工藝結構，由此設計製造的ic部件解決了傳統半導體工藝無法實現射頻/微波集成電路的難題，以達到降低高頻集成電路器件的高頻損耗，提高器件q值以及擴寬器件應用頻帶的目的。
  17. Hic has been the important technical channel for realizing the small - scale, multi - functional, high - performance, highly reliable military electric equipment, for hic make good use of high - integration, high - speed and other characters of sic, and formed a new - generation advanced microelectronic assembly technique

    混合集成電路（ hic ）充分利用半導體集成電路（ sic ）高集成度、高速等特點，形成新一代高級的微電子組裝技術，並已成為實現軍用電子裝備小型化、多功能化、高性能化、高可靠性的重要技術途徑。
  18. The diagram consists of a broadband mmic amplifier and a integrated microstrip power equalizer, and can supply the twt with driving power and gain equalization

    該電路由寬帶mmic放大器和集成微帶功率均衡器構成，為寬帶行波管提供驅動功率和增益均衡。
  19. And the general procedures of these methods are summarized. finally, some practical problems are analyzed using fdtd, which include passive linear resistor element and nonlinear diode element in the microwave circuits and an integrated antenna embedded with an active gunn diode element and a dielectric cavity resonator

    最後，本文通過編程模擬了微波電路中的無源線性器件電阻和非線性器件二極體，含有有源器件gunn二極體的有源集成微帶天線以及介質腔諧振器等具體實例，來驗證各種方法的可行性和有效性，計算結果與實驗結果吻合。
  20. We have design collection circuit who is mainly made up of flash memory - 28f128 and ad - c812. collection data is stored in flash memory - 28f128 that is made by intel. chip that is used to collection data is ad c812 who is producted by analog corp

    採集存儲電路的數據採集晶元採用ad公司的與8051兼容的微控制器晶元ad c812 ，它的內部集成了一個12位的adc ，它可以尋址16mb的外部數據存儲器，使其存儲數據很方便。
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