電化學濺射 的英文怎麼說
中文拼音 [diànhuàxuéjiànshè]
電化學濺射
英文
electrochemical supttering-
The zircondri filin wtut rirconia wa prepared and the removing technology of the zirconia on the zirconium sdrices was obtalned. the methods of chemistry and magnetron sputtring plating were used in order to platc a palladium film, which is characteristic of self catalysis for hydrogen and the sole h - permselectivity on the clean rirconium sdrices prepared by the methods of electrochemitw and ( or ) high temperatur vacuum hydrgenization, which was firstly studied. the plating tedrilogy was obained and the surface modified zirconium membran was prepared
在利用電化學法和真空高溫除氧加氫法去除了鋯表面氧化膜的基礎上，分別採用化學法、磁控濺射法兩種鍍膜技術在其表面上鍍上了一層對氫具有自催化分解、唯一選擇滲透性的金屬鈀膜，首次獲得了鋯基材膜表面上鍍鈀的制備工藝，成功制備了鋯表面改性選擇滲氫膜。Manufactures pressure sensors, transducers, load cells, accelerometers, force sensors and strain gages from stock. specialist in micro - miniaturization and applications of semiconductor, thin film, metallic foil and hybrid circuit technologies for the measurement of acceleration, force, and pressure in a multitude of environments
-提供薄膜制備微粉制備真空冶金分子束外延磁控濺射化學氣相沉積電子束鍍膜激光鍍膜甩帶機磁控電弧爐空間環境模擬等設備With the development of thin film science and technology, various thin film preparation techniques developed rapidly, as a result, conventional so - called filming has developed from single vacuum evaporation to many new film preparation techniques, such as ion plating, sputtering, laser deposition, cvd, pecvd, mocvd, mbe, liquid growth, microwave and mtwecr, etc., of which vacuum evaporation is the common technology for thin film preparation, because it has the distinct advantage of high quality of film deposition, good control - ability of deposition rate and high versatility
隨著薄膜科學與技術的發展，各種薄膜制備方法得到了迅速發展，傳統的所謂鍍膜，已從單一的真空蒸發發展到包括蒸鍍、離子鍍、濺射鍍膜、化學氣相沉積（ cvd ） 、 pecvd 、 mocvd 、分子束外延（ mbe ） 、液相生長、微波法及微波電子共旋（ mwecr ）等在內的成膜技術。其中電子束蒸發技術是一種常用的薄膜制備技術，它具有成膜質量高，速率可控性好，通用性強等優點。5. manganin thin films with low temperature coefficient of resistance were prepared by magnetron sputtering. the changes of tcr under difference deposition and heat treatment conditions were studied
首次採用磁控濺射法沉積了低電阻溫度系數的錳銅薄膜，研究了在不同電子科技大學博士學位論文沉積及熱處理條件下薄膜tcr的變化。Coating metal such as cu, ni, ti, mo, w or compound coating on diamond grain ( dg ) surface by coating ( chemical, electronic plating ) and vacuum plating method ( evaporating, sputtering, ionization ) was studied
摘要採用濕法鍍（化學鍍、電鍍）或真空鍍（蒸發鍍、濺射鍍、離子鍍）方法，在金剛石表面鍍覆一層銅、鎳、鈦、鉬、鎢等金屬，或者它們的復合鍍層。Many processes are used to prepare transparent conductive films, such as magnetron sputtering, vacuum reactive evaporation, chemical vapor depositions, sol - gel, laser - pulsed deposition
多種工藝可以用來制備透明導電薄膜，如磁控濺射真空反應蒸發、化學氣相沉積、溶膠-凝膠法以及脈沖激光沉積等。分享友人