電容電流加熱 的英文怎麼說

中文拼音 [diànróngdiànliújiārè]
電容電流加熱 英文
capacity urrent heating
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 流 : Ⅰ動1 （液體移動; 流動） flow 2 （移動不定） drift; move; wander 3 （流傳; 傳播） spread 4 （向壞...
  • 電容 : electric capacity; capacitance; capacity
  • 電流 : current; galvanic current; electric current; electricity; current flow電流保護裝置 current protec...
  1. The flow diagram of a lpg bottle paint - drying heating system using heat carrier as heat - medium, which has similar properties as other heat - carrier heating systems, has been improved, which has good effect in avoiding oil - spraying, shortening dehydration time and power - fail protecting etc. after making a series of analysis, calculational methods of expansion tank dimension have been deduced, which takes the moisture boiling - off of heat carrier into account and accords with real conditions

    對與其它熱載體加熱系統具有共性的鋼瓶熱載體加熱系統的流程圖進行了改進和完善，在防止噴油、縮短脫水時間和停電保護等方面取得了良好效果。通過分析，整理出了熱載體加熱系統膨脹器容積的計算方法，該方法考慮了熱載體所含水分汽化而帶來的影響，比原有的計算方法更加符合實際。
  2. Eev should be selected for various refrigeration systems according to the thermal properties of refrigerants ; the discharge coefficient of eev is sensitive to the aperture and impulse quantity of eev ; when the eev structure is made, the discharge coefficient goes up with the lowering of evaporation temperature or goes down with the hoisting of the condensation temperature. it is le

    對于不同工質的冷藏集裝箱製冷系統，電子膨脹閥應該根據具體製冷劑的熱力性質選取；電子膨脹閥流量系數對孔徑和脈沖數比較敏感；在結構固定時，流量系數隨蒸發溫度的降低而升高，隨冷凝溫度的增加而增大，受過冷度變化的影響較小；電子膨脹閥的容量受孔徑影響最大。
  3. Chapter 2 compares the differences of the current - fed converter and the voltage - fed converter used in induction heating power, then induces the power regulation methods of the series resonant inverter and compares the characteristic of these methods. and then, a capacitive pwm & pfm control method which is suitable for medium and small power out induction heating is given

    第二章對感應加熱電源中的電流型逆變器和電壓型逆變器作了比較分析，歸納了串聯諧振逆變器幾種常用的調功方法，對這幾種控制方法的優缺點進行了比較，提出了適用於中小功率感應加熱的容性pwm & pfm控制方法。
  4. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
  5. Calculation of thermally permissible short - circuit currents, taking into account non - adiabatic heating effects

    在考慮非絕緣加熱效應條件下的熱容許短路電流的計算
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