電路基板 的英文怎麼說

中文拼音 [diànlùjībǎn]
電路基板 英文
pcb
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. This paper mainly aims at the characteristics of the hardware and software structure of the parallel computer on satellite, and has fulfilled researches of fault tolerant technique in three aspects of control theories and engineering : the first research of the system level fault - tolerant module is based on the system structure of the parallel computer on satellite, a kind of cold backup module and a kind of hot backup module for multiprocessor computer have been put forward. then the research of software fault tolerant technique which is based on the operate system named rtems has been carried, the mission level fault - tolerate arithmetic and the system level fault - tolerate mechanism and strategies based on the check point technique have been put forward, at the same time the self - repair technique of software which has used the technique of system re - inject has been studied. finally the technique of components level fault - tolerant based on fpga has been studied, a kind of two level fault - tolerant project which aims at the fault - tolerant module of the parallel computer on satellite has been put forward, and the augmentative of circuit that project design realization need is little, this project can avoid any breakdown of any part logic circuit of the fpga

    本課題主要針對星載并行計算機體系結構及軟體結構的特點，從如下三個方面進行了容錯控制理論研究和實踐工作:首先進行了基於星載多cpu并行計算機體系結構的系統級容錯模型研究，提出了一種多cpu冷備份容錯模型和一種多cpu熱備份容錯模型;然後進行了基於rtems操作系統的軟體容錯技術研究，提出了任務級容錯調度演算法以及基於檢查點技術的系統級容錯恢復機制和策略，同時研究了利用系統重注入進行軟體在線自修復的容錯技術;最後研究了基於fpga的部件級容錯技術，提出了對容錯模塊這一星載并行計算機關鍵部件的兩級容錯方案，實現該方案所需增加的電路少，可避免板級晶元以及fpga晶元內部任何邏輯發生單點故障。
  2. Specification and characterization methods for nonwoven cellulose based paper for printed boards

    確定印製電路板用非織物纖維素基紙板板特性的鑒定方法和規范
  3. This paper refers to several creation in compatibility with large volume of fed display and conversion of different video signal. it firstly used special central chip al300, designed correlative circuits, successfully developed vga full - color fed console system, compatible with resolution 1280 1024, achieved functions such as multi - video signal conversion and interleaving, met vga ’ s resolution of fed. it firstly designed and fabricated vga interface and separated video interface - - s - video, converting several video signals to 24 bits full - colored digital image signal in fed driving system, achieved separation of luminance signal and chromatism signal, enhanced the bandwidth of luminance signal

    首次採用平板顯示專用控制晶元al300 ，設計並製作了相關配套電路，支持的最高解析度是1280 1024 ，實現解隔行和多種視頻格式轉換的功能，滿足了fed顯示屏對vga解析度的要求。首次在基於fpga的vga級彩色fed控制系統中設計並製作了vga介面和分離電視信號s - video介面，可以將多種視頻信號變換為fed驅動系統可用的24位彩色數字圖像信號，實現亮度信號和色差信號的分離，提高了亮度信號的帶寬。
  4. It ’ s a medical treatment equipment of high capability but low price. this thesis chooses a discal peristaltic pump and put forward amelioration schemes based on analysis of trait of transfer pump in common use presently and selects stepper motor as drive motor. in order to reduce the whole volume, the pcb board integrates stepper motor drive circuit, keyset, alarm circuit and lcd

    本文在分析目前常用輸液泵的優缺點的基礎上，選擇dg - 1盤狀蠕動泵，並進行了結構改進;選擇步進電機作為輸液泵的驅動電機，為縮小整體的體積，將步進電機的驅動電路、按鍵、 lcd和報警電路集成到單板上。
  5. Research on error automatic revised method of lsi wafer honing process

    集成電路基板研磨表面誤差自動修正技術
  6. A new type thick - film circuit heatin g - element is introduced and the main technology is expounded, including the requireme nt and performance of substrate mate rial and electro - pastes. the process of heating - element is intro duced too. at last, the application a nd problem of the new type heating - element are put forward

    介紹了基於不銹鋼基板的大功率密度厚膜電熱元件的研究現狀，並對厚膜電路式電熱元件的關鍵技術進行闡述，包括大功率密度電熱元件所用基板材料和基於基板的電子漿料的使用要求，以及電熱元件的制備工藝;最後分析了該新型電熱元件的應用前景和所要解決的問題。
  7. Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

    印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板
  8. Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  9. Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test

    印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板
  10. . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1

    印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板
  11. Then, after the circuit is placed wholly into margin within the case of gyroscope, electromagnetic interference which affects circuit itself is analyzed, designing for board level electromagnetic compatibility is discussed, approaches with which reducing electromagnetic interference are bring forward, at same time, the request of every circuit routing is required, and a part of circuit layout is improved

    其次，分析了電路安裝在陀螺殼體內后的電磁干擾對電路本身的影響，探討了電路板級的電磁兼容性設計，提出了減小電磁干擾的途徑，在此基礎上提出了電路各模塊的布線要求，並改進了部分電路布局。
  12. Electronic assembly process planning, especially the pca ( print circuit assembly ) process planning concerns much skill and knowledge. to enhance the efficiency of process planning and to improve the condition of the process management, a knowledge - based capp ( computer aided process planning ) system was established in this paper

    電子裝配工藝設計，尤其是印製電路板組裝（ pca ）工藝設計是一項知識性、經驗性很強的工作，為提高電子裝配工藝編制效率、改善工藝管理狀況，本文建立了基於知識的電子裝配capp系統。
  13. This paper first begin with the connotation of virtual instrument technology, study and discuss the criterion and the working theory of usb deeply. on the principle of usb1. 1criterion, using usb interface chip usbn9604 and low consumption mirochip c8051f231, we designed the available interface of usb bus and its controlling software, turn the communicating function based usb bus between computer and testing device. second based on the developed interface of usb bus, using microchip pic16c62 and a mount of relays, we designed the multiswitching scanner and its controlling software to complete the funtion of accesses swithing in testing system. third calling the api function inside the windows using vb programming language, communicat with the impelling program of selected hid, achieve the function of testing instrument with usb interface, complete the development of upside software faced testing. at last, based on the deep studying of pcb testing method, used the developed multiswithing scanner and software faced testing, combinated with necessary testing instrument, we constructed the pcb testing system and analized the testing result simply

    論文首先從虛擬儀器的技術內涵出發，深入研究和討論了通用串列總線usb規范及工作原理，並依據usb1 . 1規范，採用usb介面晶元usbn9604和低功耗微處理器c8051f231設計開發了通用的usb總線介面及其控制固件，實現了通用計算機與測試設備之間基於usb總線的通信功能；其次，在所開發的usb總線介面的基礎上，使用微處理器pic16c62和多路繼電器開關，設計開發出實現測試系統中測試通道切換功能的多路通道掃描器及其控制固件；再次，採用vb語言編程，調用windows內部api函數，與選定hid類驅動程序進行通信，實現usb總線介面測試儀器功能，完成面向測試的上層軟體開發；最後，在深入研究印刷電路板測試方法的基礎上，利用已開發的多路通道掃描器和面向測試軟體，結合必要測試儀器組建印刷電路板測試系統，並對測試結果進行了簡要的誤差分析。
  14. Advances in research on low cte polyimides used in flexible printed circuit board applications

    用於撓性印製電路基板的低熱膨脹系數聚酰亞胺研究進展
  15. Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade

    印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板
  16. Mathematical program based on physical insight of em - theory wiil be applied to the circuit board emc analysis and design

    課程概述與目標：貫通數學程式與電磁理論之物理觀念、應用於電路基板之電磁相容分析及設計。
  17. Advanced copper thick film material has excellent microwave performance and the thick film module can easily realize large - scale production, so the copper thick film technology is a high performance and low cost substrate production technology

    先進的銅厚膜工藝具有微波性能好、便於大批量生產等特點，是一種高性能、低成本的電路基板製造技術。
  18. Base materials for printed circuits - epoxide woven e - glass laminated sheet of defined flammability vertical burning test

    印製電路基本材料.規定可燃性的環氧編織e型玻璃纖維疊層板材
  19. Test method for relative permittivity dielectric constant and dissipation factor of polymer - based microwave circuit substrates

    塑料基微波電路底板的相對介電常數
  20. In this thesis, a convenient designing method for the microwave broadband power equalizer has been proposed, with a circuit template based on the microstrip resonators loaded resister is designed and optimized by cad, and finally achieve the practice broadband microwave power equalizer that satisfies the target

    本文對mpm中的微波寬帶功率均衡器進行了研究，提出了一種切實可行的設計方法。該方法以電阻加載的微帶諧振器枝節為基本結構組成電路拓撲結構，用計算機優化方法對該電路模板進行優化設計，並且最終實現滿足要求的寬帶微波功率均衡器。
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