電遷 的英文怎麼說
中文拼音 [diànqiān]
電遷
英文
em-
The second section described the accounting issues brought by cyber economy environment including the impact to the accounting suppose, accounting target, the content, the means, the process of accounting checking and the impact to the accounting information system. the third section described the ideas of the innovation of cyber economy environment emphases on the accounting business process reengineering, accounting information system innovation, assets affirmance, accounting settlement under the cyber economy environment. on basis of the third section, the fourth section analyzed the cyber accounting ' s origins, developme nt, characteristic and problems occurred in the development of the cyber accounting
本文共分四章，第一章論述了網路經濟環境下會計環境的變遷，分析了網路經濟的產生與特點，概述了電子商務及虛擬企業的特徵，並指出對企業的組織、生產、管理環境帶來的巨大變化；第二章闡述了網路經濟環境引發的會計問題，包括對會計假設、會計目標、會計核算內容、方法、流程及會計信息系統的影響；第三章提出了對網路經濟環境下的會計創新的設想，重點論述了網路經濟環境下的會計業務流程重組與會計信息系統的變革，網路經濟環境下的資產與會計確認，以及會計結算等方面的創新設想；在第三章討論內容的基礎上，第四章具體分析了網路會計的產生、發展及特點，並分析了網路會計發展過程中存在的主要問題，針對這些問題，提出了相應的對策。Study on characteristic of electric transfer of so2 in corona discharge electric field
2在放電電場中的電遷移特性研究Mobility of ions
離子的電遷移率Atoms in the solder joints move as a result of both diffusion and electromigration
另一方面，擴散和電遷移效應，則造成焊點中的原子移動。As an electric current passes through, the joule heating and electromigration effects occur in the flip chip solder bumps
當電流通過焊點時，會伴隨產生焦耳熱效應和電遷移效應。There are many aspects of power grid integrity analysis, for example, analysis of ir drop and analysis of electromigration
電源網格的完整性分析包含很多方面，如irdrop分析，金屬電遷移等。Standard test method for estimating electromigration median time - to - failure and sigma of integrated circuit metallizations metric
集成電路金屬噴鍍總量和電遷移中值失效時間的評定標準試驗方法Standard guide for design of flat, straight - line test structures for detecting metallization open - circuit or resistance - increase failure due to electromigration metric
檢測由電遷移造成的噴鍍金屬開路或阻力增加失效率用的平板直線試驗結構設計的標準指南Based on the theoretical studies, a band - pass filter circuit is optimized in order to decrease current density and increase the electromigration lifetime
在理論研究基礎之上，藉助于計算機輔助設計，針對一個帶通濾波器電路進行了電路優化，以提高其電遷移壽命。About the techniques of the reliability design, a common method for 1c reliability design is introduced and the failure principles of electronmigration are studie d
在可靠性設計方面，介紹了集成電路可靠性設計的一般方法。影響鋁互連的電遷移失效的各種因素中，電流密度是主導因素。Consequently, the metal interconnects of vlsi have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes
作為vlsi互連線的金屬薄膜的截面積越來越小，其承受的功率密度急劇增加，使得電遷移成為電路的主要失效模式之一。Based on the model of the interconnect failure, taking the existence of defect into account, the influence of the open soft fault on the interconnect reliability is deeply studied, and a new lifetime model of interconnect is presented
本文從互連線失效的電遷移模型出發，考慮到缺陷存在時，由局域缺陷導致的開路軟故障對互連線可靠性的作用，給出了缺陷統計分佈情況下新的互連線壽命模型。After briefly describing the damage mechanism of electromigration, noises theories and signal processing methods, many kinds of experimental assessing methods of electromigration, such as the traditional mtf test, the test of changes of resistance and noise measurement, etc., are reviewed in this paper, and its research on the technology of noises detection has been studied emphatically
本論文在簡要介紹電遷移失效機理、噪聲理論和1 / f信號表徵方法的基礎上，對各種電遷移可靠性實驗評估方法（傳統的壽命測試法、電阻變化測量法、噪聲測量法）的特點作了分析對比。重點研究了vlsi金屬互連電遷移噪聲檢測技術。In many issues of the reliability of copper interconnection, we place the emphasis on electromigration and stress migration
在銅互連可靠性的幾個主要問題中，重點針對互連中的電遷徙和應力遷徙進行了探討。Through the electromigration experiment, the electromigration resistance of copper interconnection with different width was compared, its mtf and activated energy was calculated, and the failure mechanism was explored. then, difference between copper interconnection and aluminum interconnection was studied
通過電徙動試驗，研究比較了不同寬度的銅互連線的抗電遷徙能力，計算了其中值壽命和激活能，探討了其失效機理，並與鋁互連線進行了比較。Metal aluminium film em in general ac stress has been researched with fourier decomposition, developing a metal aluminium film em life model under in general ac stress
藉助于脈沖波形的傅里葉級數分解，研究了一般交流應力條件下金屬化電遷移的影響因素，建立了一般交流應力條件下金屬鋁膜電遷移壽命模型。In order to improve the circuit performance and reliability, the considerations of increasing influence of parasitic effects resulted from interconnect crosstalk and delay as well as the electromigration and power consumption drive the introduction of copper and low - k dielectric
為了提高電路性能及可靠性，並對連串擾及延遲引起的互連寄生效應影響的增長，電遷徙和功率損耗等方面進行綜合考慮，刺激了低電阻率銅和低介電常數介質的發展。Special attention is paid to the consequences of methanol crossover in cathode reaction and cathode over - potential. good agreement is found between simulations and experiments in regard to the v - i character of dmfcs. based on the theory of parallel electrode reaction, it becomes possible to obtain quantitatively the value of over - potential caused by methanol crossover, which is either implicit or not included in the overall cathode over - potential in previous models
該模型涵蓋了dmfc中的主要物理化學過程，包括：甲醇水溶液在膜電極內的擴散、對流和電遷移；質子在陽極催化劑層和陰極催化劑層內的傳遞；氧氣、水蒸汽在陰極的擴散；陽極催化劑層內的甲醇氧化反應動力學；以及陰極催化劑層內的氧還原和甲醇氧化反應動力學。Abstract : metal aluminium film em failure mechanism has been studied under pulsed stress, and the metal aluminium em reliability under pure ac stress has been discussed, a detailed spec - ification has been made about relative factor affecting test structures
摘要：對脈沖應力作用下金屬鋁膜的電遷移失效機理進行了研究，研究了純交流應力對金屬鋁膜電遷移可靠性的影響，對影響測試結構的相關因素作了詳細的描述。Based on the detailed investigation on the correlative fields of home and abroad, it was considered that the noises could be theoretically used to study the electromigration phenomenon
基於對國內外相關技術發展動態與現狀的研究與分析，完成了金屬薄膜的電遷移微弱噪聲信號測試系統的設計，並實現了數據的自動採集與處理。分享友人