bonding joint 中文意思是什麼
bonding joint
解釋
膠接接頭-
The diffusion welding behavior of single - crystalline cu to single - crystalline - aio with a nb film interlayer and the joint microstructure properties were studied by tem, sem / eds analyses and four - point bend testing. the nb film interlayer deposited by electron beam evaporation on the ceramic side prior to diffusion welding was found to be olycrytalline and fiber - textured after diffusion bonding, with the close - packed plane ( 110 ) being parallel to the ( 0001 ) basal plane of - aio
擴散連接技術是一門邊緣科學，涉及材料、擴散、相變、界面反應、接頭應力應變等各種行為，工藝參數多，雖然已經進行了大量的試驗研究，但卻對各種材料的連接機理尚未有明確的認識，為此人們試圖藉助于計算技術，對接頭行為進行數值模擬，以便找到共同規律，對擴散連接過程及質量進行預測與實時控制。 -
Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering, tlp bonding of al mmcs with these interlays, the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil. removing the oxidation on the surface before deposition, copper was coated by magnetron sputtering as tlp bonding interlayer
待連接表面通過磁控濺射法沉積銅膜作為中間層進行瞬間液相連接，得到的接頭強度與銅箔中間層進行瞬間液相連接得到的接頭強度相當，而使用磁控濺射法去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間液相連接的接頭強度提高7 . 6左右。 -
When tlp bonding with proper pressure, the oxidation on the surface of al mmcs was n ' t the primary effect of the properties of the joint
採用適當的壓力進行瞬間液相連接時，鋁基復合材料表面的氧化膜已不是影響接頭性能的主要因素。 -
When tlp bonding with pressure can avoid the effect of oxidation, obtain excellent joint property. oxidation was n ' t observed in the joint region by microanalysis
另外，研究表明，氧化膜在無壓瞬間液相連接時成為影響接頭性能的主要因素。 -
The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail
本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。 -
Examples of joint finishing with pp bonding series
Pp接著系列的共塑例子 -
Cast metal joint boxes for power cables up to 10 kv ; correlation of joint boxes with paper - insulated cables ; correlation of bare stranded copper bonding wire
最高可達10 kv電力電纜用金屬鑄造連接盒.第3部分 -
( 2 ) the reasonable bonding joint between load - bearing metal parts and composite for the present of a certain torpedo is decided to achieve the ideal bonding and leakproof
2 ）確定以某型號雷體為代表類型的水下兵器用金屬承力件與復合材料的合理膠接接頭方式，以達到理想的連接、防滲效果。 -
It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials
研究表明， 93w與ofc的界面連接是ofc與93w中w晶粒的連接以及ofc與93w中ni - fe粘接劑的連接共同作用的結果； ofc與tc _ 4連接界面的形成是由於ofc與tc _ 4之間發生反應擴散，並由此在二者接頭處生成了cu - ti金屬間化合物的中間相； tc _ 4 - al的連接與al - mb _ 2的連接則分別是其基體元素ti 、 al之間和al 、 mg之間元素互擴散的結果，另外，由於熱膨脹系數的差異，擴散焊接后在不同焊件的接頭處存在殘余熱應力並由此引起接頭的形變。
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