bonding process 中文意思是什麼

bonding process 解釋
粘結法
  • bonding : 冰凍膠結
  • process : n 1 進行，經過；過程，歷程；作用。 2 處置，方法，步驟；加工處理，工藝程序，工序；製作法。3 【攝影...
  1. Powder materials can be made into even granules customer needs without adding any bonding anent when they run througnh the machine. as density of granules are larger, no any afterward process is needed so as to reduce technological process, reduce granulation cost and powder pollution and improve labor environment as well

    粉體物料經本設備，無需添加任何粘結劑即可直接製成用戶所需的均勻顆粒產品，顆粒密度大，城無需再進行后續加工處理，減少了工藝流程，不僅降低了造粒成本，並且減少了粉塵污染，改善工人的勞動環境。
  2. Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.

    133節的內容既涉及熱壓連接工藝本身，也涉及了自動連接的傳送帶技術。
  3. Cpk study of bonding process in hic production

    混合集成電路鍵合工序能力指數探索
  4. The fem analysis for the three structures of sling screw - thread - based, namely the circle, rectangle and that with strengthen plate, and the tensile test for sling screw - thread - based in torpedo body show, that the bonding with strengthen frp plate between load - bearing metal parts and frp hull with hatch can reduce the stress concentration and significantly decline the local stress in frp hull with hatch. this structure can also be used in the similar produces. ( 3 ) the effects of parameters for bonding process on the adhesive strength and leakproof are discussed, such as the bonding interface reduce, bonding surface treatment, match of adhesive surface, protect for adhesive seam and so on

    本文通過某型號雷體吊耳螺紋座結構的三種方案，即圓形昂耳螺紋座、長方形吊耳螺紋座、具有增強板的吊耳螺紋座的有限元分析及雷體吊耳螺紋座拉力試驗結果證明：金屬承力件與開口玻璃鋼殼體粘接採用玻璃鋼增強板補強，緩和了應力集中，使開口殼體局部應力明顯降低，類似的水下兵器用金屬承力件與開口復合材料殼體膠接均可採用此種結構形式。
  5. In the dissertation, the effects of the air slide - film damping on the capacitive accelerometers having different slot structures which are completely or partly etched, and fabricated by the anodic bonding between silicon and glass and bulk silicon micromachining process are researched by changing the distance between the moving structure and substrate, the thickness of the structure, the width of the completely etched slot structure, the depth of the partly etched slot structure according to the two well known air slide - film damping models

    對于橫向運動的體微機械器件，其周圍空氣表現為滑膜阻尼。本文基於滑膜阻尼的兩個模型，通過改變振子與襯底的間距、振子的厚度、刻透的柵槽的寬度、沒有刻透的柵槽的深度等參數，研究了這些參數對硅?玻璃鍵合工藝製作的體硅微機械電容式傳感器阻尼特性的影響。
  6. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。
  7. The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed, and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process, separately

    本文首先對比分析了銅絲球鍵合和金絲球鍵合的全過程，採用實驗設計分別對燒球工藝參數和鍵合工藝參數進行了優化。在此優化參數下，獲得了連接良好的銅絲球鍵合點和金絲球鍵合點。
  8. The external wall thermal insulation series dispersion products prepared by basf functional polymers division involve latest developed dispersion of base coat and bonding mortar specific for the exterior insulation finishing system, and the dispersion for external wall decoration system ( such as the exterior coating specific for the base plane to process putty, primer and coating decorative surface ) as well as ceramic tile adhesive specific for decorative surface of ceramic tile

    巴斯夫功能性聚合物部推出的外墻外保溫系列乳液產品，不僅包括最新開發的專用於外墻外保溫體系的抹面膠漿和粘結砂漿的聚合物乳液，還包括用於外墻飾面體系的聚合物乳液，如專用於基面處理膩子、底漆和塗料飾面的外墻塗料，以及專用於瓷磚飾面的瓷磚膠粘劑。
  9. Experiments were conducted to modify the bonding process to reduce the effects of the critical events

    實驗證實，改進的鍵合工藝可以降低關鍵事件對晶片偏轉的影響。
  10. Mechanics properties of metal materials strengthened by accumulative roll bonding process

    累積疊軋焊強化金屬材料的力學性能
  11. The interfacial microstructure and properties for ti ni in diffusion bonding process

    擴散焊接界面的組織和性能
  12. Survey of progress on the bonding process of beryllium and other materials

    超高強鋁合金的研究現狀及發展趨勢
  13. Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding

    13 3節的內容既涉及熱壓連接工藝本身，也涉及了自動連接的傳送帶技術。
  14. In addition to improvements in wire bonder hardware, it is necessary to develop a steady wire bonding process which satisfies the requirements for ultra - fine - pitch wire bonding

    目前除了需要不斷提高鍵合機硬體性能外，開發滿足超細間距引線鍵合要求且性能穩定的鍵合工藝十分必要。
  15. This product design for ic assembly die bonding process on die bonder machine

    本產品是為ic封裝自動貼片機及其貼片工藝而設計。
  16. With bonding process, thin wall magnet and magnet with complex shapes can be obtained

    各向同性，可多極和輻向充磁。能製成薄壁形狀復雜的磁體。
  17. Tem, sem, dsc, and x - ray method were used to study the microstructures and their transformation of the laser melted layer, and superplastic forming bonding process of - tial was investigated. the results are as follows

    採用光學金相、 sem 、 tem 、熱分析和x射線等方法，對激光快凝組織及其轉變過程和機理，以及超塑連接過程進行了研究。
  18. Are the ambient conditions controlled for the bonding process

    周圍是情況嗎受約束的為會接程序
  19. Chemical bonding process

    化學粘合法
  20. Microstructure and mechanical properties of ultrafine grained copper prepared by asymmetrical accumulative roll - bonding process

    異步疊軋制備超細晶銅微觀組織與力學性能
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