bonding tape automated 中文意思是什麼
bonding tape automated
解釋
卷帶自動接合技術-
Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding.
133節的內容既涉及熱壓連接工藝本身，也涉及了自動連接的傳送帶技術。 -
Tape automated bonding
膠帶自動接合 -
Tab mechanical standardization of semiconductor devices - part 5 : recommendations applying to tape automated bonding of integrated circuits
半導體器件的機械標準化第5部分:用於集成電路載帶自動焊 -
Section 13. 3 covers the thermocompression bonding process itself and also tape automated bonding
13 3節的內容既涉及熱壓連接工藝本身，也涉及了自動連接的傳送帶技術。 -
Andorin optoelec technology inc. established in 1999. as lcd module manufactory our capcapabilities are cob ( chip - on - board ), and tab ( tape automated bonding ). we provide extensive and complete solutions based on customer needs
安的利光電科技有限公司成立於1999年，主要產品是液晶顯示模組，包括cob及tab產品系列。我們可根據客戶要求提供方案，以滿足客戶的需要。 -
Mechanical standardization of semiconductor devices - recommendations applying to tape automated bonding of integrated circuits
半導體器件機械標準化.第5部分:集成電路膠帶自動粘合推薦標準 -
Mechanical standardization of semiconductor devices - part 5 : recommendations applying to integrated circuit packages using tape automated bonding
半導體器件的機械標準化.第5部分:使用自動粘結裝置用於集成電路包裝的推薦規程
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