bonding technology 中文意思是什麼

bonding technology 解釋
焊接工藝
  • bonding : 冰凍膠結
  • technology : n. 1. 技術，工程，工藝。2. 製造學，工藝學。3. 術語（匯編）。
  1. Application of equipotential bonding and earthing in buildings with information technology equipment

    帶有信息技術設備的建築物中等勢連接和接地的應用
  2. Eletrical installations of buildings - part 5 : selection and evection of electrical equipment - section 548 : earthing arrangements and equipotential bonding for information technology installations

    建築物電氣裝置第5部分:電氣設備的選擇和安裝第548節:信息技術裝置的接地配置和等電位聯結
  3. Flip chip bonding technology used in modern micro - photoelectron package

    現代微光電子封裝中的倒裝焊技術
  4. By integrating all the latest information and active form gateway technology, the project connected the wireless communicating network, telephone network and internet to realize the alete bonding of information and widening the service scope of application system based on internet, thus the farmer could get the information from internet more delicacy and effectively, which will solve the " the lastly one mile " problem of fruiter information transferring

    摘要本項目綜合運用各種最新的信息技術以及主動式網關技術，將無線通訊網、固定電話網和網際網路絡連接在一起，實現信息的無縫跨接，拓寬了網際網路絡上應用系統的服務范圍，使得基層農戶能夠以靈活方便的形式獲得網際網路絡上的信息，有效的解決了果樹信息傳遞的「最後一公里問題」 。
  5. As a contrast object, gold wire ball bonding technology was also studied

    金絲球鍵合作為對比研究對象引入本文研究范圍。
  6. Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components

    銅絲球鍵合是一種有望取代現行金絲球鍵合工藝的新技術，這一技術對于降低微電子元器件的成本、提高元器件的可靠性具有重要意義。
  7. Electrical installations of buildings - part 5 : selection and erection of electrical equipment - section 548 : earthing arrangements and equipotential bonding for information technology installations iec 60364 - 5 - 548 : 1996

    建築物的電氣設施.第5部分:電氣設備的選擇和安裝.第5
  8. Electrical installations of buildings - part 5 : selection and erection of electrical equipment - section 548 : earthing arrangements and equipotential bonding for information technology installations

    建築物電氣安裝.第5部分:電氣設備的安放和選擇.第548部分:接地和與信息技術安裝接和的設備潛能
  9. Upper - year students are required to take " chemical bonding ", " transition metal chemistry ", " alcohols, ethers, carbonyl compounds ", " amines, arenes and heterocycles ", " chemical kinetics ", " molecular spectroscopy ", " instrumental analysis ", which are continuations of the courses they have taken earlier. the related laboratory courses focus on modern chemical technology

    高年級必修化學鍵、過渡金屬化學、醇，醚與羰基化合物、酉安，芳烴與雜環、化學動力學、分子光譜學等與低年級相應之延續科目，而有關的實驗課則注重近代化學技術。
  10. In this paper, for the bonding between the sling screw - thread - based and composite hull based on the underwater weapon composite, the bonding structure design, process design and leakproof technology between the load - bearing metal parts and composite hull are studied. with the further investigation on tensile test of the sling screw - thread - based the common technology of bonding between load - bearing metal parts and composite hull is obtained, which establishes the experiment and theory base for the technology of underwater and deepwater weapon in china

    本文以水下兵器為背景，以某型號雷體吊耳螺紋座與復合材料殼體的膠接為研究對象，著重進行了金屬承力件與復合材料殼體的膠接結構設計、工藝設計、膠接防滲技術的研究，並進行吊耳螺紋座拉力試驗研究，最終獲取了水下兵器用金屬承力件與復合材料殼體連接形式的共性技術。
  11. Production : ig gasket technology ( shenzhen ) is currently managing a considerably wide range of products, from natural rubber to silicones, from plastic components to rubber / metal bonding

    產品：目前，愛吉密封膠圈科技（深圳）有限公司涉及的產品類型已經相當廣泛，從天然橡膠到硅樹脂，從塑膠合成物到橡膠/金屬焊接等。
  12. Responsible for or taking part in the research projects which have been spread and received scientific and technological progress rewards, such as " prestressed strengthening technology ", " oil - proof of the composite flooring for multi - storied industrial building ", " the strengthening technology with shotcrete ", " the strengthening technology with carbon fiber material ", " the diagnosis and treatment for leakage of exterior wall ", " the testing and identifying technology of energy - saving building ", " the testing technology of the actual strength of the bonding mortar in masonry structure "

    負責和參加了"預應力加固技術" 、 "多層工業廠房抗油滲復合樓地面技術" 、 "噴射混凝土加固技術" 、 "碳纖維加固技術" 、 "外墻滲漏診治技術" 、 "節能建築檢測鑒定技術" 、 "砌體結構砌築砂漿實際強度檢測鑒定技術"等多項科研成果，並得到推廣應用和獲得科技進步獎。
  13. Abstract : in this paper a new technology for upperpunch in ceramic tile die with isostatic pressing is introduced, static - pressure area ratio and bonding area ratio are changed into independent technological parameters and can be separately designed

    文摘:本文介紹了等靜壓瓷磚模具中上模芯的一種新型工藝結構，它使靜壓比和粘貼比成為兩個互相獨立的參數，可以分開進行設計。
  14. Bonding technology for electroless ni - p alloy plating and rubber

    合金層與橡膠粘合工藝的研究
  15. Research progress in bonding technology of tini shape memory alloys

    合金形狀記憶效應的微觀機制研究進展
  16. Flip - chip bonding technology

    的柔性凸點技術
  17. An equipment for vacuum wafer bonding was developed based on the wafer bonding technology

    摘要基於圓片鍵合技術，設計了一種在真空條件下進行圓片鍵合的工藝設備。
  18. Diffusion bonding technology of mosi2 heating element

    2發熱元件冷熱端擴散接合工藝的研究
  19. The research status quo of diffusion bonding of ceramics to metals is reviewed in this paper, and the emphases are placed on the interface reaction, stress analysis and bonding technology

    本文綜述了陶瓷與金屬擴散連接的研究現狀，重點介紹了界面反應研究、殘余應力分析和連接工藝研究等內容，並在此基礎上指出了研究中所存在的問題。
  20. It is the first company in china to have developed the chemical adhesive bonding technology instead of traditional sewing technology for filter fabric connection, improving the industrialization, performances and stability of products

    採用純新聚丙烯原材料製作塑料芯板替代廢舊低質的塑料芯板，提高了排水板的力學性能和穩定性及耐久性。
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