common substrate 中文意思是什麼
common substrate
解釋
共襯底-
The common method used by domestic and foreign scientists is removing the cobalt from the surface of the substrate by etching substrate using thin acid solution at room temperature. but the internal co will still overflow during mpcvd
為降低成核及成膜過程中鈷的副作用，國內外通常採用的方法是將硬質合金基體在室溫下用稀酸溶液浸泡一定時間，從而除去基體表面的鈷。 -
Rhodium plating technology on palladium substrate was compared with the common technology on nickel substrate by man - made sweat corrosion test, coating binding force test and cost accounting
摘要通過耐蝕性人工汗試驗、鍍層結合力測試、鍍層厚度測試以及電鍍成本的核算等方法，研究和比較了以鈀為基材的鍍銠新工藝和以鎳為基材的常規鍍銠工藝。 -
The tio2, cds and cds - tio2 films on the common glass substrate were prepared, respectively, using ti ( oc4h9 ) 4, cd ( cooch3 ) 2 and scn2h4 as raw materials by sol - gel method. the influences of manifold preparing parameters ( such as the concentration of sol, the amount of the peg. the number of coatings, the heat - treated temperature and time ) on the structure and performance were studied
本文採用溶膠-凝膠技術，以鈦酸丁酯、乙酸鎘和硫脲為原料，以普通玻璃片為載體，制備了納米tio _ 2薄膜、 cds薄膜和cds - tio _ 2復合半導體薄膜，研究了制備過程中多種制備參數（如溶膠的濃度，聚乙二醇（ peg ）的加入量，鍍膜層數，熱處理溫度及時間）對薄膜結構和性能的影響，採用x -射線衍射（ xrd ） 、掃描電鏡（ sem ） 、能譜分析（ edxa ） 、紫外-可見吸收光譜（ uv - vis ）等測試手段對各薄膜進行了結構和物性表徵。
分享友人