copper deposition 中文意思是什麼

copper deposition 解釋
銅的沉積
  • copper : n 1 銅；紫銅。2 銅幣，銅錢，〈pl 〉零錢。3 銅器；銅罐，銅壺，銅鍋；銅管；銅製品。4 （紫）銅色。5 ...
  • deposition : n. 1. 免職，罷免；廢位。2. 淤積[沉積]（物，作用）。3. 耶穌從十字架上放下（的畫、雕刻）。4. 寄存，委託；委託物。5. 【法律】口供，證言；口供書。
  1. Deposition mechanism of electroless plating tin in acid chloride solutions was analyzed theoretically, and three steps were summed up, including period of replacement reaction, coexistence periods of copper - tin codeposition and self - catalyzed deposition, and period of self - catalyzed deposition

    從理論上系統地分析了酸性氯化物化學鍍錫的沉積機理，將其歸納為置換反應期、銅錫共沉積與自催化沉積共存期和自催化沉積期三個階段。
  2. Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering, tlp bonding of al mmcs with these interlays, the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil. removing the oxidation on the surface before deposition, copper was coated by magnetron sputtering as tlp bonding interlayer

    待連接表面通過磁控濺射法沉積銅膜作為中間層進行瞬間液相連接，得到的接頭強度與銅箔中間層進行瞬間液相連接得到的接頭強度相當，而使用磁控濺射法去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間液相連接的接頭強度提高7 . 6左右。
  3. In this paper, pan based metal gradient composites films ( pmgcf ) were prepared by electrochemical reduction. the effect of polymer matrix on pmgcf and preparation and its forming mechanism of pmgcf were invested, they are as follows : lacrylonitrile - methyl - methacrylate copolymer, acryonitrile - itaconic acid copolymer, acrylonitrile - methyl methacry late - sodium allyl sulfonate terpolymer have been synthesized seperately in order to analyze the effects of the mma monomer unites and the hydrophilic unites of acryonitrile terpolymer on the process of copper deposition in polyacrylonitrile - based metal gradient composite film ( pmgcf ) as well as the flexibility of the film

    其內容如下： 1通過合成的丙烯腈?甲基丙烯酸甲酯二元共聚物（ p （ an - mma ） ） ，丙烯腈?亞甲基丁二酸二元共聚物（ p （ an - ita ） ） ，丙烯腈-甲基丙烯酸甲酯?丙烯磺酸鈉三元共聚物（ p （ an - mma - as ） ）分別作為基體制備了聚合物基金屬梯度復合膜材料（ pmgcf ） ，以分析加入的mma基團和親水性基團對pmgcf沉積層中金屬銅的梯度分佈形態和膜的柔韌性的影響。
  4. This process was propitious to enrich, activate, transport the copper. in different alteration granodiorite porphyry, sio2, k2o, cu, mo are depleted in the fresh and weakly altered rock, and are enriched in the strongly altered rock, cl is also enriched in the strongly altered rock. but na2o and fe are extracted from the porphyry into the ore - forming fluid, especially the presence of fe is in favor of cu deposition

    在銅廠巖體不同的蝕變帶中， sio _ 2 、 k _ 2o 、 cu 、 mo等從新鮮斑巖甚至弱蝕變帶中帶出，而在強蝕變帶強烈富集， cl同樣有在強蝕變巖石中富集的趨勢；而na _ 2o 、 fe從斑巖體中帶出，進入流體相中，流體中大量fe的存在，有利於銅的沉澱、富集成礦。
  5. On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained

    本文是在電鍍錫、浸鍍錫工藝配方的基礎上，通過大量的試驗，確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑，抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系，成功地在銅上實現了錫的連續自催化沉積，獲得了性能優異的半光亮銀白色錫鍍層。
  6. The result showed that the interpenetration network structure between polymeric and deposited metal has been observed under a scanning electronic microscope and optical microscope. the experiments showed that copper deposition gradient distribution and crystal structure were greatly influenced by the the ph value of electrochemical reduction medium solution and the size, number and distributing of microporous in swelling cathode film

    用掃描電鏡和體式顯微鏡對制備的pmgcf進行了分析，結果表明：制備的pmgcf樣品的金屬沉積層梯度分佈均勻，在一定的電化學條件下金屬銅和聚合物基體形成了互穿的立體網狀結構。
  7. 3 the experiment showed that there is no copper deposition in the film using p ( an - mma ) as polymer matrix. but the copper deposition and gradient distributing appears in the film when using p ( an - ita ) and p ( an - mma - as ) as polymer matrix. the size and number of crystal increases as the concentration of ita in copolymer increase and the film is prone to be ruptured

    3實驗顯示p （ an - mma ）作為基體制備的pmgcf五金屬沉積，銅的沉積量為零； p （ an - mma - as ） ， p （ an - ita ）兩種共聚物為基體時均出現金屬銅的沉積，二者金屬沉積相均呈現一定程度的梯度分佈形態，但p （ an - ita ）為基體時得到的晶體比較粗大，且隨其中ita的含量的增多得到粗糙晶體的數目增大，所制的pmgcf脆而硬，受外力沖擊時容易斷裂。
  8. The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs

    化學鍍銅層的顯微結構受基體的顯著影響。
  9. Thin copper films prepared by chemical vapor deposition on glass - ceramic substrates

    玻璃陶瓷基板上銅薄膜的化學氣相沉積
  10. In this thesis, electroless plating and its deposition principle were briefly introduced. the progress of electroless plating in the past decade was summarized which includes nickel based alloys, cobalt basd alloys, copper based alloys and iron based alloys

    本文介紹了化學鍍以及化學鍍反應的機理，總結了近十年來用化學鍍方法施鍍ni基、 co基、 cu基、 fe基合金的研究進展。
  11. Significant research works have been focused on single metal, in particular copper deposition and its mechanism and kinetics, including electrochemical parameter and physical parameter measurements

    研究了單金屬特別是銅的沉積、形成機理和動力學以及採用的研究方法和分析測試手段，包括對電化學參數和物理參數等研究。
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