copper-clad 中文意思是什麼
copper-clad
解釋
包銅的-
High performance and high precision copper and copper alloy strips, electrolytic copper foil, lead frame, copper clad and printed - circuit board, special enameled copper wire, fashioned copper bar, track contact wire, medium and high elastic copper strips for interconnecting devices, precision alloy copper pipes for ac and cooling appliance, over - long and corrosion - resistant copper alloy condenser pipe, seamless cooper water pipe in housing construction and other copper fine and deep processing products will be highly developed in jiangxi province
江西將重點發展高性能高精度銅及銅合金板帶、電解銅箔、引線框架、覆銅板及印刷電路板、特種漆包線、異型銅排、軌道接觸線、接插元件用中高彈性銅帶材、空調與製冷精密合金銅管、超長耐腐蝕銅合金冷凝管、建築用無縫銅水管等10項銅精深加工產品。 -
Epoxide cellulose paper copper - clad laminates epoxy paper ccl
環氧紙質覆銅箔板 -
Epoxide synthetic fiber fabric copper - clad laminates
環氧合成纖維布覆銅箔板 -
Epoxide cellulose paper core, glass cloth surfaces copper - clad laminates
環氧玻璃布紙復合覆銅箔板 -
Poly phenylene oxide epoxy system ppo ep and its application in copper clad laminate
環氧樹脂體系在覆銅板中的應用 -
The proximity effect of synmmetrical cable employing copper clad steel as conductor
採用銅包鋼復合線的對稱電纜鄰近效應 -
Bismaleimide triazine epoxide woven glass fabric copper - clad lamimates
雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板 -
Bismaleimide specifications - specification no. 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
規范.第19號規范.製造多層印製板用的規定可燃性能的薄比斯瑪勒米德 -
Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印製電路用基材.第2部分:規范.第18號規范:規定易燃性的比斯瑪勒米德 -
Specifications. specification no. 19. thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
規范.第19號規范:多層印製電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材 -
Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板 -
Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板 -
Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板 -
. 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1
印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板 -
Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad
印製板和其它互連結構用材料.包被和非包被增強基材.酚醛纖維素紙增強銅包被經濟級疊層板 -
Liquid and solid bonding strength of cu fe interface in copper clad steel
鋼液固相復合界面的結合強度 -
Copper - clad aluminium conductor
銅包鋁導體 -
Copper - clad aluminium wire
銅包鋁線 -
Tinned copper clad wire for electronic components
電子元器件用鍍錫銅包鋼線 -
Standard specification for copper - clad steel electrical conductor for catv drop wire
用於catv用戶引入線的包銅鋼電導線的標準規范
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