electronic package 中文意思是什麼

electronic package 解釋
電子儀器組件
  • electronic : adj. 電子的，電子操縱的；用電子設備生產的；用電子設備完成的。adv. -cally
  • package : n 1 包裝，包紮。2 〈主美〉包，包裹，捆，束，組；（產品等的）（一）件，件頭。3 包裝用物；（包裝用...
  1. Shells, roman candles, professional cakes, assortment, fountains, sky rockets, helicopters, sparklers, missiles, smoke items, snaps, wheels, confetti, birthday candle, cold flame fireworks, waterfall, remote firing system, safety fuse, fiberglass mortar, electronic ignitor, electronic firecrackers, and other specialty items. heaven fireworks carry out strict quality management from product design, purchase of raw materials and production on each working procedure to package to ensure that we provide high quality products to clients

    華洋煙花有限公司專注于花炮出口，我們能夠出口各種消費者煙花及燃放型煙花以及相關的花炮配件，如禮花彈，羅馬燭光，盆花，混合煙花，花筒，高空火箭，直升飛機，電光花，發射彈，煙球，霹靂炮，風轉輪，禮賓花，生日蠟燭，冷光煙花，瀑布，點火器，安全引，玻璃鋼炮筒，電子點火器以及其它專業產品。
  2. Medium scale and small scale that offer one - stop electronic commercial services. and an entertainment center with beautiful environment. inaddition. the hotel affords multi - floors of quiet and tastefully laid out commercial offices facilitated with a full package of communications and net equipment. among which has already settled the liwan district returned students scientific and technological pioneer park. with its high - quality complete facilities and services. xianda is a home for your business trip in guangzhou. where you live comfortably and play heartily

    酒店還設有多個樓層的商務寫字樓，寫字樓辦公環境幽雅，通訊網路設施配套全，荔灣區留學生科技創業園已入駐。仙達以高檔完善的設施，細致入微的服務，給您一個到家的感覺，讓您在仙達住得安心，玩得舒心，滿足您在廣州的商旅之需。
  3. It is widely used for packing of medicine, food, drinks, stationery, cosmetics, hardware tools and electronic package etc

    本機廣泛應用於藥品、食品、飲料、文化用品、化妝品、五金工具、電子產品等物品的中包裝。
  4. Research status and development of high silicon aluminium alloy for light weight electronic package materials

    高硅鋁合金輕質電子封裝材料研究現狀及進展
  5. Electronic industries association - product package bar code label standard for non - retail applications

    電子工業協會.非零售用的產品包裝條形碼標簽標準
  6. When the machine is working, the operations of feeding, heating, extruding, filming, forming, cooling, measuring, slitting and rolling can be carried out automatically. air bubble film is also called air bubble sheet, air cushion film, poly - cell sheet or plastic poly - cell. it s widely used as anti - shock material for the package of electronic appliance, industrial products, craftwork and so on

    氣泡膜，亦稱氣墊膜氣珠膜氣泡布氣泡紙氣泡薄膜氣墊薄膜，是採用ldpe低密度聚乙烯樹脂加工而成，是當前普遍使用的唯一透明的一種軟包裝緩沖材料，可製成氣泡袋氣泡牛皮紙信封袋汽車太陽擋隔熱座墊隔熱保溫材料等。
  7. With the accumulation of funds, we set up a new huajiang produce base of an area of 13 mu, and of the investment of 3, 500, 000 rmbyuan in xiongzhou western expressway industrial development zone of xiongxian county. factory building areas 1, 800 square meter, a 9 color high - speed intaglio press ( with the surpervision on static screen ) and a package - making machine both automatic controlled by electronic computer, a caloric partitions and a compound film machine, thus, a total process line came into being

    隨著資金不斷積累，我廠又在雄縣雄州路高速引線西側工業開發區投資350萬元建立了佔地13畝的新的華江生產基地，建築面積3800平方米，微機控制全自動九色凹印機（靜止畫面檢測） ，微機控制全自動制袋機，熱分切機、復合機、高低壓吹膜機等國內最先進的生產設備。
  8. 4. a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology

    日沁；司知『匕子封裝己經對，匕于封裝設計提出了更高的要求。
  9. Delivery notification has all the information you need to find out who received the package. to get an electronic signature image, sign up for

    遞送通知含有您需要的所有信息，可查出誰收到了該包裹。要獲得電子簽名圖像，請簽約參加
  10. Research on the electronic business logistic development in railway luggage and package transportation

    鐵路行包運輸發展電子商務物流的研究
  11. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  12. Electronic device is developing toward lighter, thinner and littler volume, which demands highly on the density and functionality of package i / os. so it is important factor to assure the quality of the solder joint

    電子產品的「輕、薄、短、小」化對元器件的微型化和組裝密度提出了更高的要求，而焊點的質量和可靠性是影響電子產品質量的重要因素。
  13. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  14. Ups has received the electronic transmission of package details from the shipper

    Ups已經從發貨人那裡收到包裹詳情的電子傳送信息。
  15. In - line package sockets for use in electronic equipment, sectional specification for

    電子設備用直插封裝插座的分規范
  16. Dual - in - line package sockets for use in electronic equipment, blank detail specification for

    電子設備用雙列直插封裝式插座的空白詳細規范
  17. Detail specification for decoupling capacitor dual - in - line package sockets for use in electronic equipment

    電子設備用去耦電容器雙列直插封裝式插座的詳細規范
  18. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
  19. Sep standard electronic package

    標準電子組件
  20. Abstract : the development of the chip ceramic capacitor, pdp ( plasma displays ), silicon solar cell and electronic package was reviewed in the present paper, and the requirements to electronic pastes and the growing trend of base metals electronic pastes were introduced

    摘要：本文評述了我國多層片式陶瓷電容器、 pdp平板顯示器、硅太陽能電池、電子封裝等的發展現狀以及對電子漿料的要求，同時還評述了賤金屬漿料的發展趨勢。
分享友人
分享到 Line

分享到臉書