fabric-base laminated sheet 中文意思是什麼
fabric-base laminated sheet
解釋
布基層壓板-
Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印製電路用基材.第2部分:規范.第18號規范:規定易燃性的比斯瑪勒米德 -
Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印製電路用基體材料.用於多層印製板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板 -
Base materials for printed circuits. part 2 : specifications. specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板 -
Base materials for printed circuits. part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板 -
. 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1
印製電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板 -
Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13
印製電路板用覆箔板.第13部分:硅酮玻璃布覆銅層壓板si - gc - cu - 13 -
Base materials for printed circuits. part 2 : specifications. specification no 4 : epoxide woven glass fabric copper - clad laminated sheet, general purpose grade
印製電路基材.第2部分:規范.第4號規范:普通級環氧化合物編織的玻璃纖維覆銅層壓板 -
Base materials for printed circuits. part 2 : specifications - specification number 17 : thin polyimide oven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印刷電路用基材.第2部分:規范. 17號規范:多層印刷電路板製作用規定易燃性的聚酰亞胺機織玻璃纖維織物包銅層壓板 -
Base materials for printed circuits ; part 2 : specifications ; specification 16 : polyimide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印製電路用基材.第2部分.規范.第16號規范:規定易燃性的聚酰亞胺玻璃纖維覆銅層壓板
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