flip chip bump 中文意思是什麼
flip chip bump
解釋
倒裝片[焊接]凸點,倒裝片對準點-
Bump fabrication methods for flip chip
倒裝晶元凸點製作方法 -
Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
倒裝晶元中凸點與凸點下金屬層反應的研究現狀
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