flip chip method 中文意思是什麼

flip chip method 解釋
倒裝法
  • flip : vi （ pp ）1 用指頭彈；輕輕打。2 （用鞭子等）抽。3 叭嗒叭嗒地動；翻動紙張。4 跳上車。5 起強烈反應...
  • chip : n 1 碎片，削片，薄片；碎屑；薄木片；無價值的東西。2 （陶器等的）缺損（處）。3 （賭博用）籌碼；〈p...
  • method : n 1 方法，方式；順序。2 （思想、言談上的）條理，規律，秩序。3 【生物學】分類法。4 〈M 〉【戲劇】...
  1. Flip chip will be a new method of packaging technology

    倒裝晶元將成為封裝技術的最新手段
  2. In this thesis, the work on automatic alignment system is as follows : firstly, after the methods and optical systems for alignment whose are used commonly now are discussed, a new die leveling method based on auto - focus is presented for the flip chip bonder. auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations

    本文針對倒裝貼片機的自動對準系統開展了以下幾方面的工作:首先在討論了現有的對準方法和自動貼片機的對準光路系統基礎上，針對貼片機實際應用環境，提出基於多點自動對焦的晶元調平方法。
  3. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
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