general drawings 中文意思是什麼
general drawings
解釋
總圖-
The main functions of the module for initializing drawing environment are to set up the scale. linetype. breadth and frame of drawings according to the characteristics of the general arrangement drawing to passenger shippings. the main functions of the second module is to establish and extend graph library, retrieve from graph library and output graph blocks. using the parameterization design method to design interactively and modify automatically graphs of the local cabin are the tasks of the third module. in the help module, the drawing specifications of passenger shipping are integrated, such as equipments of anchor and moor, arrangement of cab, cabin and baggage, measures to come through and ration of passengers, etc. there are some advantages in the proposed system, such as friend interface, operation easily, drawing conveniently and modification automatically
其中初始化繪圖環境模塊主要針對客船總布置圖繪制的特點來完成比例、線型、圖幅和圖框的設置；客船總布置圖圖庫模塊主要完成圖庫的建立和擴充、圖庫的查詢以及圖塊的輸出；局部艙室參數化設計模塊採用參數化技術完成對局部艙室圖形的自動修改以及交互設計；客船規范幫助模塊則集中了一些武漢理工大學碩士學位論文客船繪制規范，如錨泊及系泊設備、駕駛室、乘客艙室及行李的放置、脫險措施及乘客定額等規范。 -
Mechanical drawings - general principles of presentation - lines
機械制圖圖樣畫法圖線 -
Mechanical drawings - general principles of presentation - views
機械制圖圖樣畫法視圖 -
Technical drawings - general principles of presentation - views
技術制圖圖樣畫法視圖 -
Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of integrated circuits
半導體裝置的機械標準化.集成電路略圖繪制的一般規則 -
Mechanical standardization of semiconductor devices - part 3 : general rules for the preparation of outline drawings of integrated circuits
半導體器件的機械標準化.第3部分:集成電路略圖制備的一般規則 -
Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals
半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南 -
Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則 -
Article 36 the preparation and construction office is responsible for the following concrete works : examining the designs of the project, signing the project construction contract, organizing the purchase and inspection of related equipment, materials, etc., working out the general schedule of project construction, compiling the expenditure plans, controlling project financial payments and final accounts of the project, drawing up managerial methods and keeping and filing documents, drawings, files and materials, etc., during the construction period of the project
第三十六條籌建處具體負責審查工程設計，簽訂工程施工承包合同，組織有關設備、材料等物資的采購和驗收，制定有關的管理辦法，做好工程施工過程中文件、圖紙、檔案、資料的保管和整理等工作。 -
Based on advanced technology, this thesis bring forward the optimal scheme and set down general system - drawings and flow charts. using step7 - micro software, we achieve the auto - control aim in drinking water treatment. in practice, the complexity and non - linaerity exit in the system of water treatment, so we apply fuzzy control in water treatment and design a kind of controller which structure can be altered according to the using - rate of ozone and the variety of water quality
實際飲用水處理系統由於存在復雜性、非線性、時變性，本文根據臭氧生物活性炭水處理工藝存在復雜性、非線性、時變性等特點，將模糊控制應用在水處理這一不確定的非線性時變系統，針對不同水溫下臭氧利用率及水質的變化，設計一種基於系統過程狀態的變結構的模糊控制器，以單片機作為主要控制硬體，按查表方式設計軟體，對進水閥門開度進行在線控制，調節臭氧氣體與進水的比例（臭氧流量及濃度不變） ，達到氣水比最優化。 -
Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array
半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南 -
Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array
半導體器件的機械標準化.第6 - 6部分:平面式安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南 -
Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南 -
Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南 -
G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南 -
G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack
半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南 -
Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type
半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形 -
Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type
半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南 -
Technical drawings - general principles of presentation - preparation of lines by cad system
技術圖紙.表示的一般規則. cad系統繪制直線的表示 -
Make general drawings by using autocad
常用cad圖形的繪制。
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