heat distortion test 中文意思是什麼

heat distortion test 解釋
熱變形試驗
  • heat : n 1 熱；熱力；熱度；熱量。2 體溫；發燒。3 （氣候的）高溫，暑氣。4 【冶金】熔煉的爐次；裝爐量；一...
  • distortion : n. 1. 歪扭，扭曲。2. 【電學】（信號、波形等的）失真；【物理學】（透鏡成像產生的）畸變；【醫學】扭轉，變形。3. 竄改，歪曲，曲解。adj. -al
  • test : n 1 檢驗，檢查；考查；測驗；考試；考驗。2 檢驗用品；試金石；【化學】試藥；（判斷的）標準。3 【化...
  1. Martens heat distortion temperature test

    馬頓斯耐熱試驗
  2. Test results show that that the breakcown voltage and heat distortion temperature the encapsulating materials of epoxy resin with hgh are famously improved, but the the addition of hgh, the viscosities of the epoxy resin - hgh system is higher compared with that of the others and the encapsulating process is effected. nano - sio2 improves the mechanical properties of encapsulating materials of epoxy resin, impact strength reaches 27. 64kj / m2 from 13. 95 kj / m2, flexural strength reaches 136. 68mpa from64. 95 mpa. by addition of the montmorillonite, glass transition temperature and heat distortion temperature of the encapsulating materials are 13. 2 and 16 higher than that of epoxy re

    結果表明，活性硅微粉對環氧灌封材料的熱變形溫度和電學性能提高較為顯著，尤其在浸水后，電學性能降低幅度很小，西北工業大學碩士學位論文但活性硅微粉用量較大，材料的工藝性能明顯降低;納米5102對環氧灌封材料具有顯著的增強和增韌作用，沖擊強度、彎曲強度由原來的13 . 95kj / mz和64 . 95mpa分別提高到27 . 64kjzm2和136 . 68mpa 。
  3. Long - term heat distortion test method of polypropylene pall ring packing

    聚丙烯鮑爾環填料長期熱變形試驗方法
  4. Fire hazard testing - part 10 - 3 : abnormal heat ; mould stress relief distortion test

    著火危險試驗.第10 - 3部分:不正常熱.模型應力釋放扭變試驗
  5. Fire hazard testing - part 10 - 3 : abnormal heat - mould stress relief distortion test

    著火危險試驗.第10 - 3部分:不正常熱.模型應力釋放扭變試驗
  6. Fire hazard testing - part 10 - 3 : abnormal heat ; mould stress relief distortion test iec 60695 - 10 - 3 : 2002 ; german version en 60695 - 10 - 3 : 2002

    著火試驗.第10 - 3部分:不正常熱.模型應力釋放扭變試驗
  7. The modified epoxy resin materials with hg and hgh have first been preformed. properties test results show that the electricity properties and heat distortion temperature are improved by addition of hg or hgh in the epoxy resin materials, and the materials containing hg or hgh have lower linear thermal expansion coefficiency compared with neat epoxy resin

    首先通過共混技術，分別用普通硅微粉和活性硅微粉制備出填充改性環氧材料，實驗結果表明，填充改性后，耐熱性和電性能明顯提高，線膨脹系數顯著降低。
  8. Curing agents and mixing conditions were two important factors that effected on exfoliation behavior of organophilic montmorillonite in diglycidylether of bisphenol a matrix. the organophilic montmorillonite was exfoliated completely and there were no d001 diffraction peaks with methyltetrahydrophthalic anhydride as curing agent and benzyldimethylanine as catalyst. properties test results show that mechmical properties, electricity properties, heat distortion temperature of the exfoliated nanocomposites were all improved by addition of the montmorillonite, and the nanocomposites had lower linear thermal expansion coefficiency and water absorption compared with neat epoxy resin

    結果表明，環氧樹脂與有機蒙脫土的相容性好；混合條件和固化劑是影響有機蒙脫土在環氧樹脂中剝離的兩個重要因素，在一定的混合條件下並選用合適的固化劑可以使蒙脫土在環氧樹脂中完全剝離；剝離型環氧樹脂蒙脫土納米復合材料的力學性能、電性能、熱性能以及吸水性能與純環氧樹脂固化物相比均有不同程度的提高和改善。
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