ic module 中文意思是什麼

ic module 解釋
集成電路組件
  • ic : 1. integrated circuit 【無線電】積體[集成]電路。2. interior communications 內部通訊聯絡。
  • module : n. 1. 測量流水等的單位〈1秒100升〉。2. 【建築】圓柱下部半徑度。3. 【物理學】模，系數，模數，模量。4. 【無線電】微型組件；組件；模塊。5. （太空船上各個獨立的）艙。
  1. Supervisory policy manual : module ic - 4 complaint handling procedures

    監管政策手冊： ic - 4處理投訴的程序
  2. This noncontact distributor assembly, which deletes mechanical breaker contact, utilizes ic ignition module assembly free of burn out of contact. therefore it has a higher ignition voltage, higher ignition volume, as well as functions of overvoltage protection, low speed & low voltage protection and power cut upon shut down. these functions are of benefit to improvement to the motive performance, economical efficiency and start up ability of engine while reduce waste exhaust

    該無觸點分電器總成取消了機械斷電器觸點，採用了集成電路組成的點火模塊總成，不存在觸點的燒蝕，因此點火電壓高，點火能量大，並具有過壓保護、低速低壓啟動、停車斷電等多項功能，有利於改善發動機的動力性，經濟性和起動性能，減少了排氣污染。
  3. The ic modulation circuits and microprocessor are used in the control unit. on the side of input of inverter, the maximum power point tracking of solar module is well realized by using a kind of thought of self - optimizing control ; on the side of output of the inverter, a kind of approximate optimum v / f control strategy is used in order to optimize the match between the output of the inverter and load of motor - pump

    在逆變器輸入側，採用自尋優控制思想實現太陽能電池最大功率點跟蹤（ mppt ） ；在輸出側，採用了v / f近似優化的控制策略，以優化逆變器輸出與機泵負載之間的匹配。
  4. The company ' s primary business is ic component packaging and test and memory module assembly

    公司的主要業務是集成電路封裝測試和內存模塊裝配。
  5. The accelerometer which has simple fabricated process and high sensitivity and small parasitic capacitance and residual stress is hybrid integrated with the interface circuit using ic nude chip. so the density of the package is increased, and the noise of the sensing system is decreased. these found the base of capacitive accelerometer module using the mcm method

    該傳感器製作工藝簡單，靈敏度高，支撐梁採用u型，減小了刻蝕后的殘余應力，用玻璃作為襯底，減小了襯底和硅可動質量塊間的寄生電容，且把傳感器晶元和用ic裸片製作的介面電路集成在一起，提高了封裝密度，減小了傳感器系統的噪聲，為採用mcm技術製作電容式加速度傳感器模塊打下了基礎。
  6. This paper aims at the request of distribution automation and the disadvantages of existent ttu products and puts forward a scheme of ttu design : dsp ic tms320lf2407a of ti ltd. is chosen as a controller because of its high performance ; a three - phase power / energy ic developed by sames ltd. is used as a measure module to simplify the hardware circuit and software program ; the embedded modem and rs485 / rs232 mode communication interfaces are designed to make the data transfer more flexible and effective ; the 101 communication protocols of international electric power standard are adopted to improve its compatibility

    本文針對配電自動化的要求及現有ttu產品的不足，提出了一種基於dsp的配電變壓器遠方終端單元的研製方案：微控制器選用ti公司高性能定點dsp晶元tms320lf2407a ；使用sames公司推出的三相電能計量晶元sa9904a作為測量模塊，簡化了硬體電路和軟體編程；採用siliconlaboratories的嵌入式modem 、 rs485 rs232等多種通信方式，使數據傳送變得靈活、高效；為了提高設備兼容性及通用性，通信協議採用國際電力標準101規約。
  7. Hybrid ic multi chip module

    混合icmcm通信器材用dcdc轉換器obp
  8. Based on s698 technology, obt - devsys - s698 is one of the serial s698 - mil application development systems including 32 - bit embedded processor with 32 64 - bit fpu 160mhz processing speed sram memory controller flash memory controller uart ps 2 led interrupter controller, etc. the bus interfaces is composed of i2c spi magnetic card interface and ic card interface. obt - devsys - s698 carries on the advantages of s698 serial module such as compact structure and reasonable composition

    Obt - devsys - s698是s698系列嵌入式處理器開發板中的一員，其上包括：具有32 64 - bit浮點運算單元的32 - bit嵌入式處理器，主頻160mhz ， sram存儲器， flash存儲器具有三路uart介面，一路ps 2介面， led發光二極體控制電路，中斷操作按鈕其外擴總線包括i2c總線介面spi總線介面磁卡介面智能卡介面等。
  9. The special ic, a2si, is the core unit of transmission module, which lies in the bottom of the network structure. so the thesis introduces the framework and frequently emergent problems of it specially

    A2si專用晶元是asi系統的底層通信的核心部件，因此本文專門對它的結構和使用時需要注意的問題進行了描述。
  10. 3. in the face of analog channels design, we took use of the ic chip to design the signal modulation module, data acquisition and peripheral circuits

    3 .前端模擬通道設計，採用集成電路晶元，對信號調理模塊、數據採集和外圍電路進行設計，完成相關硬體pcb版圖繪制。
  11. Alternative learning module can automatically generate ic reverse check program

    輔助學習模組可檢測
  12. The research contents of this paper includes as follows : firstly, design a new type reader based on ti s6700 reader ic and try to enhance the reading distance through adding power amplifier ; secondly, adopt the idea of gpio simulation to produce spi timings to drive s6700. secondly, overcome the shortcoming of general mcu spi port ; thirdly, design the rs232 / rs485 full duplex conversion module, mmi interface in the system ; fourthly, analyze the rfid system communication protocol iso15693 and find out the working processes and realization of the instruction ; lastly, discuss the communication safety and accidental factors including the checkout and collision design, illustrate the realization of crc and anti - collision arithmetic theory

    本論文的主要研究內容包括: （一）設計基於s6700閱讀器晶元的新型閱讀器，通過使用對中高頻閱讀器外加功率放大模塊的方法，實現較遠距離通信。 （二）採用單片機通用口三線模擬的方法模擬通用spi口時序，克服其不可位操作的缺點，實現對s6700的驅動。 （三）在rfid系統中集成設計了rs232 / rs485通訊模塊、液晶顯示模塊等，著重說明了其軟硬體實現方法。
  13. The paper analyzes the status in quo and existing problems of the medical insurance information system and will prove the advantage of three - tire structure by applying it in ic module of medical insurance information system

    本文對醫療保險系統的現狀和存在的問題進行分析，並且將通過三層架構在醫療保險系統ic卡模塊的應用實例來證明其優越性。
  14. The company s product lineup includes signal processing chips for various sensors, ics for optical communication, analog ic products, and module design services

    公司發展以各式感測器所需之訊號處理晶片光通訊ic產品類比ic產品與模組設計服務為主軸。
  15. In the paper, we will focus on the digital module backend design, which is one of important application fields of ic

    本文詳細介紹了，數字機頂盒晶元的數字模塊後端設計工作，從得到門級網表到交出gdsii研究開發的全過程。
  16. Each of ic cad and the module unit is, specially, a computer system constituted from a microprocessor, rom, ram and the like

    翻譯成：每個ic卡和模塊單元是，特別的，一個由微處理器、 rom 、 ram等組成的計算機系統，總感覺挺別扭的，大家有什麼好的建議？
  17. The international standards about the radio frequency ic cards - iso / iec14443 are introduced too, it refers to the difference about the type a and type b standard. where after introduces the card mf1 ic s500 what is usually used in the cards of type a, the design method and the circuit of the card reader device ( the device use the radio frequence chip reader module rc500 )

    介紹了射頻ic卡所必須符合的國際標準iso / iec14443的要求，以及typea和typeb兩種標準的區別。緊接著介紹了typea型常用的卡片mf1ics50和對應讀卡器的設計方法和電路（使用專用射頻讀卡集成晶元rc500 ） 。
分享友人
分享到 Line

分享到臉書