lot-by-lot testing 中文意思是什麼
lot-by-lot testing
解釋
選擇試驗-
Nondestructive testing is a very important and difficult research lesson about the defect of concrete structures. this paper mainly measures the stress waves conveying in concrete structures and the depth of surface - opening cracks in concrete plates by using impact echo method after carefully reading a lot of articles about the state and the abroad of concrete nondestructive in the field and incorporating the special conditions on the laboratory
混凝土結構物的缺陷的無損檢測是一個非常重要而又非常困難的研究課題，本論文在大量參閱了國內外關于混凝土結構物無損檢測的研究資料后，結合本實驗室的具體條件，應用沖擊反射法集中對應力波在混凝土板塊內傳播速度和混凝土結構物內部開口裂紋深度的測量等一系列問題展開了研究。 -
After completing the static and dynamic experiments on the5 electro - hydraulic component & system test unit, the author made further experiment research in the close loop system of hydraulic elevator, and get satisfying testing results. to sum up, the author build a set of theories and formulary for the design of integrated valve, change the traditional methods for the structure design of hydraulic elevator valves by the tools of pro / e, carry out a lot tests of the integrated valve on the special test platform
縱觀全文，作者對針對液壓電梯專用集成閥建立了一套比較完整的設計計算的理論依據；採用三維造型軟體對集成閥進行實體建模，改變了液壓電梯專用集成閥的傳統結構設計方法，使集成閥的結構設計達到了更好的效果；利用專門的電液元件測試平臺和液壓電梯臺架對集成閥進行了比較全面的實驗，拓展了新元件的實驗研究手段。 -
After doing a lot of testing and validating by italian experts and your engineers, we found out the main cause was that your company applied the wrong waved lines to the inverters when changing your supplier
經過義大利專家和貴司的工程師大量的測試和驗證，最後確定為貴司在更換供應商的時候，把帶著問題的波浪型排線用在了變頻器上，是造成此次事故的主要原因。 -
At present, the problem in testing sheet resistance for micro - areas is that probes must be set up at the suitable locations by handwork. in order to know the wafer ' s impurity distributing, we need test many times, so will waste a lot of time. if the wafer ' s diameter would be 300mm, this problem will be more serious. in this paper, image analysis is introduced, through pre - processing and edge picking - up, the probe tips are recognized. then probe tips will be aligned respectively in two perpendicular directions through driving stepper motors. thus the distribution of sheet resistance for whole wafer is got by automatic testing and it offers information for detecting the impurity distribution and the diffusion uniformity
這樣，完成200mm （ 8時）圓片雜質的擴散分佈需要對許多圖形進行測試，需要花費很長的時間，當測試300mm矽片時問題就更為突出。本文將圖象與視覺測量系統引入四探針測試系統中，對採集到的原始探針圖像進行預處理、邊緣提取等操作，以便實現探針針尖的識別，然後由電機控制實現探針的自動定位。這樣測試系統可以自動獲得全片的薄層電阻分佈，為超大規模集成電路檢測雜質分佈和擴散的均勻性提供信息。
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