package density 中文意思是什麼

package density 解釋
包裝密度
  • package : n 1 包裝，包紮。2 〈主美〉包，包裹，捆，束，組；（產品等的）（一）件，件頭。3 包裝用物；（包裝用...
  • density : n. 1. 稠密；濃厚。2. 【物理學】濃度；密度；比重。3. 愚鈍，昏庸。
  1. Plastics used for food container and package - part 2 : determination of phenolic antioxidants and erucamide slip additives in linear low - density polypropylene - liquid chromatography

    食品容器包裝用塑料原料.第2部分:線性低密度聚乙烯中酚類抗氧劑和芥酰胺爽滑劑的測定方法.液相色譜法
  2. 4. a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology

    日沁；司知『匕子封裝己經對，匕于封裝設計提出了更高的要求。
  3. Digicone will produce a kind of good package which has all the advantages of random crosswinding and precision crosswinding by controlling winding ratio. the packages have the features of good unwinding characteristics, no pattern zones, stable packages, homogeneous density and optimally suited for all processing areas

    數控卷繞方式可以控制絡筒卷繞比呈階梯狀變化，生產出的卷裝集隨機卷繞和精密卷繞的優點於一身，同時克服了它們的缺點，具有優良的退繞性能、無花紋區、卷裝穩定及密度均勻。
  4. The cotton shall be supplied in forms of universal density compressed package

    棉花須以通用密度壓縮貨包的形式供貨。
  5. The accelerometer which has simple fabricated process and high sensitivity and small parasitic capacitance and residual stress is hybrid integrated with the interface circuit using ic nude chip. so the density of the package is increased, and the noise of the sensing system is decreased. these found the base of capacitive accelerometer module using the mcm method

    該傳感器製作工藝簡單，靈敏度高，支撐梁採用u型，減小了刻蝕后的殘余應力，用玻璃作為襯底，減小了襯底和硅可動質量塊間的寄生電容，且把傳感器晶元和用ic裸片製作的介面電路集成在一起，提高了封裝密度，減小了傳感器系統的噪聲，為採用mcm技術製作電容式加速度傳感器模塊打下了基礎。
  6. Electronic device is developing toward lighter, thinner and littler volume, which demands highly on the density and functionality of package i / os. so it is important factor to assure the quality of the solder joint

    電子產品的「輕、薄、短、小」化對元器件的微型化和組裝密度提出了更高的要求，而焊點的質量和可靠性是影響電子產品質量的重要因素。
  7. Multichip module ( mcm ) is high - level mode in electronic package. mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate. mcm can meet the demands of compact packaging and high density

    多晶元組件（ mcm ）是微電子封裝的高級形式，它是把裸晶元與微型元件組裝在同一個高密度布線基板上，組成能夠完成一定的功能的模塊甚至子系統。
  8. Third, it analyzes different influences upon the life predication by comparing different models of the same package, different constitutive models of the same solder ball ' s materials, different life prediction models, different solder ball dimensions, different mesh density etc. finally, it compares some popular constitutive models of the solder ball materials, and constructs an integrated constitutive model by different curve fits

    接著，又在上述分析的基礎上，比較了同種封裝的不同模型（如條形模型， 1 4模型， 1 8模型） 、相同焊球材料的不同本構模型、不同壽命預測模型、不同焊球尺寸及網格密度等方面對壽命預測的影響。
  9. We believe that buyers will be very pleased with the package. " about the development the vineyard is in a low - density area

    位處低密度規劃區的葡萄園，提供合共160座洋房，面積由約2 ， 900至約5 ， 200平方尺，每戶均連私家花園。
  10. 60 grams / bottle ; high density polyethylene bottle package

    60克/瓶；高密度聚乙烯瓶包裝。
  11. [ package ] 60 grams / bottle ; high density polyethylene bottle package

    60克/瓶；高密度聚乙烯瓶包裝。
  12. Processing industries of large - scale engraving and cutting, such as garment, leather, clipping, cutting of template, printing, advertisement decoration, building upholster, art gift, computerized embroidery, package, paper product, acrylic product, middle density board etc. nonmetal sheet precision cutting and other industries

    本類機器適用於服裝皮革、模板切割、包裝印刷、廣告裝飾、建築裝潢、電腦繡花剪裁、工藝品、紙製品、塑膠行業的亞克力板、中密度裝飾板等非金屬薄板的精密切割行業。
  13. Zip format text and the text file compression package 2 can regulate the size and density version 3 support full - screen mode 4, 5 support the automatic winder screen functions, support bookmark function 6, 7 supports full - text search

    1支持palm doc的e - books文本格式和zip壓縮包中的文本文檔2可調節的字體大小和文本密度3支持全屏模式
  14. The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique

    為實現更高的功率密度，本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中，完成了一個半橋fc - ipem （ flipchip - integratedpowerelectronicsmodule ）模塊。
  15. Plastics used for food container and package - part 4 : determination of phenolic antioxidants in high density polyethylene - liquid chromatography

    食品容器包裝用塑料原料.第4部分:高密度聚乙烯中酚類抗氧化劑的測定.液相色譜法
  16. Package testing ; stipulation of filling rate of pre - packages, form with coefficient of variation of the density of products and of the package for cleaning products

    包裝試驗.預包裝充滿率的規定.產品密度和清洗產品包
  17. Package testing ; stipulation of filling rate of pre - packages, form with coefficient of variation of the density of products and of the package for plants protection products and similar products

    包裝檢驗.預包裝充滿率的規定.產品密度和植物防護產
  18. Package testing ; stipulation of filling rate of pre - packages, form with coefficient of variation of the density of products and of the package for washing and cleaning products and similar products

    包裝檢驗.預包裝件裝滿率的規定.洗滌清潔及類似制
  19. Testing of packaging ; determining the filling ratio of prepacks ; form relating to coefficients of variation for the density of the packaged material and for the package for adhesives and allied products

    包裝的檢驗.預包裝充滿率的測定.包裝材料密度和粘合
  20. The reduction in size of components and circuits for increasing package density and reducing power dissipation and signal propagation delays

    減少元件和電路的幾何尺寸，以達到增加電路的封裝密度、減少功耗和減小信號傳播延遲的目的。
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