plating rate 中文意思是什麼
plating rate
解釋
鍍覆速率-
We make use of double complexing agents and double quickening agents in the composite plating techniques which enable to increase the deposition rate and to obtain a more stable plating bath
在復合鍍工藝中，採用雙絡合劑、雙加速劑來提高鍍速和穩定鍍液。 -
Meanwhile, fundamental principles about electroless tin plating by reducing agent and disproportionation reaction were explained. function of every component in the bath was explained that complexing agent can effectively change the potential of copper and tin, and accelerate the beginning of replacement reaction favorably ; reducing agent can increase the rate of chemical reaction and has the effect of promoting reaction dynamics too ; antioxidant can effectively prevent sn2 + in the bath from being oxidated ; additive agent a can improve the stability of the bath ; additive agent b has such effects as refining and brightening for the tin deposits, and it enlarges the range of brightening section ; additive agent c used as leveling agent can not only make the depostis level off, but also improve the dispersive ability of the bath ; surface - active agent can solve bubble problem which gathered on the surface of the deposits, and improve the surface quality of the deposits and the bath stability
闡述了鍍液中各組分的作用：絡合劑能有效地改變銅、錫的電位，促使初期的置換反應順利進行；還原劑能加快化學反應速度，對反應動力學有積極的促進作用；抗氧化劑能有效地防止鍍液中sn ~ （ 2 + ）的氧化；添加劑a能提高鍍液的穩定性，添加劑b對鍍層能有細化和光亮作用，擴大了鍍層光亮區的范圍；添加劑c作為平滑劑，不僅能增強鍍層表面的平整性，而且能提高鍍液的分散能力；表面活性劑較好地解決了化學鍍過程中汽泡在鍍件表面聚集的問題，提高了鍍層的表面質量和鍍液的穩定性。 -
According the key factors we find, we bring forward a new conception : multilevel suppressor and design a new high performance suppressor whose ion - exchange membrane has bigger areas and using three electrodes including one cathode ( anode ) and two anodes ( cathode ), at the same time we fill the suppression compartment with one kind of ion exchange resin which has moderate exchange capacity. according to our experiment ' s results, we find the new type suppressor has quite high working current efficiency and suppressing capacity. in most cases, the suppressor ' s current efficiency is over 90 % ; the suppressor can transform the naoh ( concentration : 200mmol / l, flow rate : i. oml / min, conductance : over 10000 i - i s cm " ) to pure water ( conductance : 8. 9 it s cm in chapter 3, the high performance suppressor is applied in determination some trace - amounts ions in plating solution, sewage. in this chapter, we also have a research on the gradient ion chromatography
第二章首先以xyz - 1型電化學抑制柱為例，分析了電化學抑制柱的抑制過程得出影響抑制容量的主要因素主要是抑制柱的電流效率和離子交換膜的極限電流密度，因此採用中等交換能力的離子交換樹脂作為抑制室的填料以提高電流效率，在通常情況下電流效率可達到90以上；在選用同種離子交換膜的前提下，可通過增加離子交換膜的有效面積達到提高極限電流的目的從而提高抑制柱的抑制容量，因此提出了多級抑制的概念並據此研製了共電極式高容量電化學抑制柱，該抑制柱最高可將流速為1 . 0ml / min ，濃度為200mmol / l電導率超過10000 s ? cm ~ （ - 1 ）氫氧化鈉溶液抑制為電導率低至8 . 9 s ? cm ~ （ - 1 ）的純水，並且具有穩定性高、分析結果準確等優點。 -
When the concentration of cosc > 4 was 30g / l, the plating rate was max
絡合劑在濃度較低時對化學鍍有加速作用，濃度太高反而會延緩鍍速。 -
When the bath load was increased, the plating rate was shortened. the effects of bath composition and plating conditions on the composition were also investigated. the x - ray analysis showed that edta and the stabilization agent can effectively increase the content of the copper oxidation in the composite powders
粉體x ray分析的結果表明，絡合劑對防止鍍液中的氫氧化銅的產生起來關鍵作用，而氫氧化鋼是產生氧化亞銅的直接原因，因而選用edta作為絡合劑，以及合適的量，可以減少二射線中的氧化亞銅的饅頭峰。 -
The dispersion and diffusion of the effective nickel plating solution were enhanced by adding a small amount of rare earth compound, the depositing rate, hardness, anti - wear and the surface quality of the coating were accordingly improved
摘要通過在快速鎳電刷鍍液中加入少量稀土化合物，改善鍍液的分散能力和深鍍能力，提高鍍層刷鍍速度，從而增加鍍層的硬度和耐磨性，改善鍍層表面質量。 -
With the development of thin film science and technology, various thin film preparation techniques developed rapidly, as a result, conventional so - called filming has developed from single vacuum evaporation to many new film preparation techniques, such as ion plating, sputtering, laser deposition, cvd, pecvd, mocvd, mbe, liquid growth, microwave and mtwecr, etc., of which vacuum evaporation is the common technology for thin film preparation, because it has the distinct advantage of high quality of film deposition, good control - ability of deposition rate and high versatility
隨著薄膜科學與技術的發展，各種薄膜制備方法得到了迅速發展，傳統的所謂鍍膜，已從單一的真空蒸發發展到包括蒸鍍、離子鍍、濺射鍍膜、化學氣相沉積（ cvd ） 、 pecvd 、 mocvd 、分子束外延（ mbe ） 、液相生長、微波法及微波電子共旋（ mwecr ）等在內的成膜技術。其中電子束蒸發技術是一種常用的薄膜制備技術，它具有成膜質量高，速率可控性好，通用性強等優點。 -
The results showed that the deposition rate increases with the rise, of bath temperature and deposition thickness also increases as the plating time rises
實驗結果表明：化學鍍錫的沉積速度隨著溫度的升高而增加，沉積厚度也隨著時間的延長而增厚。 -
The orthogonal experiment has been used to optimize the electrolyte composition and the craft parameters, with the increasing of the main salt and reducing agent concentration in the electrolyte, the electroless plating coating ’ s adhesive strength and the coverage ratio also increase ; increasing the complex agent content, the electroless plating coating ’ s adhesive strength and the coverage ratio exist the maximum value ; the electroless plating deposition rate distinctly increases when the electrolyte temperature and the ph value were increased, but the increasing of temperature and ph value affects the electrolyte ’ s stability
採用正交實驗對鍍液成分、工藝參數進行了優化，隨著鍍液主鹽、還原劑添加量的增加，鍍層結合強度及其覆蓋面依次增強，隨著絡合劑添加量的增加，鍍層結合強度及其覆蓋面先增加然後減少，隨著鍍液溫度及其ph值的升高，化學鍍沉積速度明顯提高，但影響鍍液的穩定性。 -
Compared with different inducing methods by lots of experiments, a simple and effective inducing method is confirmed, the opimal technological conditions and formula about the soluton of electroless deposition ni - p alloy are also obtaned. the influence of different technological parameters on the deposition rate is studied. analyzed the pefformance of ni - p alloy on the differen substfates and its corresponding tricture, the result is shown tha the electroless plating nickel process can obtained the ni - p alloy film having brightuess - integrity sdse, strong binding energy and high rigidity at the temperatur about 350wt00oc, the electroless plating nickel film would trallsform from amorphous to crystal state
本文通過大量實驗，對幾種誘發材料與過程進行分析，研究確定了簡便有效的誘發方法，以及與之相匹配的化學鍍ni - p合金溶液優化配方和工藝條件，討論了各工藝參數對鍍速的影響，並對銅及黃銅基體上得到的ni - p沉積層進行了性能和結構分析，得到外觀光亮完整、結合力強、硬度高的鍍層。 -
All the factors studied had an effect on plating rate, i. e., weight gain per unit of time
這些因素通過影響化學鍍反應時間和粉末增重而影響鍍速。 -
However, when the concentration of them was enough higher, the in if. plating rate was decreasing
鍍液ph值升高，鍍層磷含量減少，形成非晶鍍層的趨勢增大。 -
Plating rate was determined by measuring the weight gain of powder after plating, and the ingredients of solution were determined by chemical analysis
鍍速用增重法，鍍液成分用化學滴定法確定。 -
The experiments showed that these factors could increase the plating rate which the concentration of nah2 ? o2 " t ^ o, the ph and the temperature of electroless plating had been risen
實驗表明：鍍液ph值和施鍍溫度升高，次亞磷酸鈉和緩沖劑濃度增加，鍍速提高。 -
The results showed that the factors that could shorten the plating time increased the plating rate. the plating rate was increased when the ph and the temperature of the bath were increased. it was also increased by increasing the concentration of copper sulfate and by decreasing the concentration of edta
結果表明，鍍液出值和施鍍溫度升高，鍍速提高：提高硫酸銅濃度，可以增加鍍速； nm濃度提高，鍍液穩定性增加，鍍速下降：隨甲醛濃度的提高，鍍這光增加而後下降。 -
It was found that, the high - temperature oxidation of ni - fe alloy plating obeys parabola law. furthermore, the rate of oxidation increased with fe wt % and the temperature
結果表明， ni - fe合金鍍層高溫氧化服從拋物線規律，氧化速度隨著鐵含量的增加而增加。
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