printed wiring 中文意思是什麼

printed wiring 解釋
印刷布線
  • printed : 印好的
  • wiring : n. 1. 【電學】線路；配線；接線；布線；架線。2. 【醫學】（骨折的）金屬線縫合術。
  1. Research on cryogenic comminution of discarded printed wiring boards

    廢棄線路板的低溫粉碎試驗研究
  2. Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth

    多層印製線路板用半固化片. bismaleimide三氮雜苯環氧樹脂浸漬玻璃布
  3. Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment ; part 2 : transformers and inductors using yex - 2 laminations for printed wiring board mounting

    電信和電子設備用變壓器和電感器的外形尺寸.第2部分:印製線路板座用採用yex - 2薄片的變壓器和電感器
  4. Outline dimensions of transformers and inductors for use in telecommunication and electronic equipmemt. part 2 ; transformers and inductors using yex - 2 laminations for printed wiring board mounting

    通信和電子設備用變壓器和電感器外形尺寸第2部分:採用yex - 2系列鐵心片印製板安裝式變壓器和電感器
  5. 0. 1in connectors for frequencies below 3 mhz. part 11 : edge socket connectors with closed ends and having a contactspacing of 2. 55 mm 0. 1 in mating either with board mounted connectors or printed wiring boards with edge board contacts

    頻率低於3mhz的連接器.第11部分:與印製電板裝連接器或板邊具有接觸點的印製線路板相配用的帶封閉端的觸點間距為2 . 55mm
  6. Enthone manufactures, markets and distributes its functional, decorative and electronic processes that are used in printed wiring board ( pwb ), semiconductor, automotive, aerospace, jewelry, and hardware and plumbing applications

    樂思生產並銷售其功能性、裝飾性及電子電鍍工藝，這些工藝適用於印刷電路板、半導體、汽車、航空、珠寶、五金及衛浴等工業。 。
  7. Fundamental parameters of connectors for printed wiring boards

    印製線路板連接器的基本參數
  8. Specification for copper - clad thermosetting laminates for printed wiring

    印製線路用鍍銅熱固層壓板規范
  9. Electronic components. printed wiring. rework of printed boards

    電子元件.印刷板配線.印刷電路板的返工
  10. Copper foil for printed wiring boards

    印刷配線板銅箔
  11. Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

    印製電路板用覆箔板.第103部分:印製電路連接專用材料.第1節:多層印製電路板製造用粘結片材的半固化片規范
  12. Prepreg for multilayer printed wiring boards - modified or unmodified polyimide resin - impregnated glass cloth

    多層印製電路板的半固化片.改性和未改性浸聚酰亞胺樹脂玻璃布
  13. Prepreg for multilayer printed wiring boards - epoxy resin - impregnated glass cloth

    多層印製電路板用半固化片.環氧樹脂.浸漬玻璃布
  14. Sectional specification for capability approval of manufacture of double - sided rigid printed wiring boards of assessed quality with plated through holes

    級質量評定的帶穿透鍍膜孔的雙面硬性印刷電路板製造商性能鑒定用分規范
  15. Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for copper foil for use in the manufacture of copper - clad base materials

    印製電路板用覆箔板.第103部分:印刷電路連接專用材料.第2節:覆銅板製造用銅箔規范
  16. Printed wiring boards - guide for the production of artwork

    印製線路板.第24部分:照相原圖製作指南
  17. Adhesive coated dielectric films for use as cover sheets for flexible printed wiring and flexible adhesive bonding films

    作柔性印製線路和柔性粘合膜片覆蓋層用的塗粘合劑的絕緣膜
  18. Metallized polyethylene terephthalate film dielectric capacitors, 100 to 400 v d. c., for extended life for printed wiring

    印製電路延壽用直流100至400v金屬化的聚對苯二甲酸乙
  19. Assemblies, electrical backplane, printed - wiring, general specification for

    印製底板組裝件通用規范
  20. Polymeric materials industrial laminates, filament wound tubing, vulcanized fibre, and materials used in printed wiring boards

    聚合材料?工業用層壓板纖維纏繞管硬化紙板及印製線路板用材料
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