semiconductor circuit 中文意思是什麼

semiconductor circuit 解釋
半導體電路
  • semiconductor : n. 【物理學】半導體。
  • circuit : n 1 （某一范圍的）周邊一圈；巡迴，周遊；巡迴路線[區域]；迂路。2 巡迴審判（區）；巡迴律師會。3 【...
  1. Bcd detail specification for electronic component. semiconductor integrated circuit. type ch2019 4 - line to 10 - line decoder with bcd - in

    電子元器件詳細規范.半導體集成電路ch2019型4線- 10線譯碼器
  2. A further refinement in semiconductor technology is the integrated circuit.

    在半導體工藝中，集成電路是一次革新。
  3. With the stringent requirement of low output voltage and high output current, semiconductor diode is necessarily replaced by synchronous rectifier to minimum voltage drop. because the existed driving schemes can not drive srs properly, two novel driving schemes for synchronous rectifiers in magnetic amplifier post regulating circuit are proposed in this paper

    已有的同步整流管驅動電路主要面對多路輸出的主輸出電路，而應用磁放大器調節的輔助輸出電路同步整流管的驅動，現有的方法存在磁放大器調節與同步整流管驅動的失配，降低了開關電源的效率。
  4. Detail specification for electronic components. semiconductor integrated circuit ct54h20 ct74h20 dual 4 - input positive - nand gate

    電子元器件詳細規范.半導體集成電路ct54h20 ct74h20型雙4輸入與非門
  5. Detail specification for electronic components. semiconductor integrated circuit. ct54ls00 ct74ls00 quadruple 2 - input positive - nand gate

    電子元器件詳細規范.半導體集成電路. ct54ls00 ct74ls00型四2輸入與非門
  6. Simulation for metal - semiconductor - metal - photodetector msm - pd circuit based - on pspice

    的肖特基勢壘光電探測器的模擬
  7. Detail specification for electronic component. semiconductor integrated circuit - type cd3220cp dual preamplifier with alc

    電子元器件詳細規范.半導體集成電路cd3220cp型帶alc雙前置放大器
  8. Detail specification for electronic components. semiconductor integrated circuit - cf3080 type transconductance operational amplifier

    電子元器件詳細規范.半導體集成電路cf 3080型跨導運算放大器
  9. Universal instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor, and back - end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the global electronics industry

    環球儀器公司是一家全球性的電子產品生產設備專業製造商，為全球電子行業各領域的製造廠商提供富有創新性的電路、半導體、後端組裝技術和設備、集成系統解決方案及專項工藝技術。
  10. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  11. As one kind of si nanostructures, si - rich si02 films are the important si - based light - emitting materials. moreover, silicon is the leading semiconductor in the microelectronic industry. furthermore si02 films as passitive and insular layers are widely used in si device and integrated circuit. so si - rich films are considered suitable for optoelectronic applications

    另一種觀點認為納米硅薄膜中的可見光發射來自界面或介質層中的發光中心。還有人認為對于鑲嵌在sio _ 2中的納米晶粒來說，與氧有關的缺陷可能是導致可見光或藍綠光發射的主要原因。
  12. Firstly. operation principle of induction heating is introduced and the actuality of the power supply for induction heating is summarized. then, the scheme of structure of the power supply is established : uncontrolled rectifier and buck chopper constitute dc circuit. in this part, operation principle of a kind of soft switching buck chopper is presented mainly and the conclusion that the power semiconductor devices operate in soft switching is also illustrated by analysing the operation principle of all stages ; series resonant inverter is selected as inverter circuit via comparing the advantage and shortcoming of parallel resonant and series resonant. moreover. the work principle of series resonant inverter is analysed and the calculating method of the best dead time is put forward as well

    文中首先介紹了感應加熱電源的工作原理並綜述了國內外的研究現狀。接下來分析並制定了電源主電路的構成方案：在對比幾種功率調節方式的基礎上選擇了不控整流加斬波調壓作為直流部分。在這部分里，重點研究了一種軟開關buck變換器，通過分析各階段的工作原理說明了開關器件如何工作在軟開關狀態；對于逆變器部分，在比較了串、並聯逆變器優缺點的基礎上選擇了串聯諧振逆變器，並詳細分析了串聯逆變器的工作原理，提出了最佳死區的計算方法。
  13. The housing device of this generic type for accommodating at least one circuit arrangement, in particular a power semiconductor module or the like, has housing areas which are designed for the arrangement of, in particular, live contact elements and which each provide a number of arrangement positions for this purpose

    這種通用普通類型的外殼器件至少用於裝填一個電路裝置，特別是電源半導體模塊或類似物，在該外殼器件中設計有外殼區域，該外殼區域尤其是用來放置帶電的接觸單元，並且其每個都提供有多個此類放置位置。
  14. Gaas crystal is a kind of iii - v group compound semiconductor material with good electrical performance. the semiconductor devices and integrated circuit ( ic ) fabricated on gaas substrate have such advantages of hign - speed information processing that they have drawn the researcher ' s attention

    Gaas晶體是一種電學性能優越的-族化合物半導體材料，以其為襯底製作的半導體器件及集成電路，由於具有信息處理速度快等優點而受到青睞，成為近年來研究的熱點。
  15. Detail specification for electronic component. semiconductor integrated circuit. type ch2021 4 - bit up down synchronous binary counter dual clock

    電子元器件詳細規范.半導體集成電路ch2021型4位二進制同步加減計數器
  16. With the rapid development of the semiconductor process and relevant technology, beyond the traditional integrated circuit, system - on - a - chip ( soc ) is coming up. it consists of a lot of intellectual property ( ip ) blocks and embedded processors, which require a piece of embedded software code to be composed. with design complexity beyond the traditional chips, verification difficulty is growing up

    系統晶元是隨著集成電路的發展而出現的新一代晶元，在系統晶元的設計中大量採用ip核復用技術，系統晶元中還包含有嵌入式的處理器，因而需要同時設計嵌入式的軟體程序，其設計復雜度遠遠高於傳統的ic晶元。
  17. With the development of semiconductor process technology, nowadays a system on a pcb ( printed circuit board ) which is composed of several ics can be integrated into a chip

    隨著集成電路製造工藝的飛速發展，人們已經可以將原先用各種電路搭建的板極系統集成在一塊晶元上。
  18. A tiny electronic device with standardized dimensions ( usually fabricated using semiconductor techniques ) capable of performing one or more functions in a circuit

    通常用半導體技術製作的、具有標準化尺寸的一種微型電子器件，能實現一種或多種電路功能。
  19. This thesis aims at discussing the model of manufacturing defects, the principles of soft and hard faults induced by manufacturing defects, the effects of soft fault on circuit reliability and yield and the relationship between yield loss and reliability decrease caused by manufacturing defects. the author ' s main contributions are as following : reliability and yield are two significant factors to semiconductor manufacture. based on the principles of the manufacturability engineering, the thesis discusses the effects of the manufacturing defect on the functional yield, parametric yield and the reliability for ics, and abstracts geometric models from actual chips

    本文對集成電路製造缺陷模型、由製造缺陷導致的軟、硬故障的作用機理、軟故障對電路可靠性和成品率的影響以及由製造缺陷導致的電路成品率的損失和可靠性下降之間的關系進行了系統的研究，主要研究結果如下：可靠性和成品率是影響半導體生產的兩個主要因素，本文首先從集成電路的可製造性工程理論出發，討論了製造缺陷在影響集成電路功能成品率、參數成品率和可靠性方面的作用。
  20. Blank detail specification for semiconductor integrated circuit static read write memories

    半導體集成電路靜態讀寫存儲器空白詳細規范
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