silicon wafers 中文意思是什麼

silicon wafers 解釋
非接觸式
  1. Afm investigations of process of cu thin films deposited on silicon wafers

    基上沉積成核的演化過程
  2. Silicon slices and wafers - measuring of diameter - micrometer method

    矽片直徑測量方法千分尺法
  3. Visual inspection for silicon wafers with specular surfaces

    鏡面矽片的目視檢查
  4. Building directly on these 2 - d technologies, we have made 3 - d circuits by coating standard silicon wafers with many successive layers of polysilicon ( as well as insulating and metallic layers ), polishing the surface flat after each step

    利用這些傳統的二維晶片技術，我們已做出三維電路：在標準的矽晶圓上，連續鍍上好幾層的多晶矽及絕緣層與金屬層，每一層鍍完后，都磨光晶圓表面。
  5. The fishkill fab is so up - to - date that it is capable of producing chips with all of the latest acronyms, from copper cmos technology to silicon - on - insulator and low - k dielectrics - all on 300mm wafers

    Fishkill工廠如此先進，可以生產幾乎所有最新的晶元：從銅cmos xs到絕緣硅、硅鍺合金以及low - k絕緣體，所有這些都可以在300mm的晶片上生產。
  6. Testing method of resistivity for silicon crystals and silicon wafers with four - point probe

    用四點探針法對硅晶體和矽片電阻率的測試方法
  7. The processing characteristics and some material properties of silicon wafers depend on the orientation.

    矽片的工藝性質與某些材料特性均與晶向有關。
  8. Silicon wafers are zapped with ions, which form tiny islands with either an excess or a dearth of electrons

    矽晶圓用離子轟擊，而在其上形成微小的島，各自具有過量或是不足的電子。
  9. We found that the cz silicon wafers preannealed by rtp in nitrogen atmosphere are significantly characteristic of ncz silicon wafer, that is, the n - o complexes related stds are also generated in the cz wafer subjected to rtf in na and subsequent proper heat treatments

    研究發現，氮氣氛下高溫rtp處理的cz硅樣品在後續熱處理中表現出了摻氮硅的退火特性，進而證明了在氮氣氛下rtp處理中氮發生了內擴散。
  10. In this process, a standard stencil printing technique is used to print solder paste directly onto silicon wafers ( figure 4 )

    在這個過程，標準印刷技術用來把錫膏直接印刷到硅晶片上。
  11. Offers the manufacture of products which are non - ferrous metal, cement, metals fabrication, aluminum beverage cans, silicon wafers and electronic components

    -主要經營鋼材黑色金屬礦產品鐵合金鑄鐵製品鑄鍛件有色金屬非金屬礦產品及製品煤炭及製品等進出口業務
  12. Bonded wafers - two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer

    綁定晶圓片-兩個二過通片圓晶氧化硅層結合到一起，作為絕緣層。
  13. Test method for measuring resistivity of silicon wafers using spreading resistance probe

    矽片電阻率測定擴展電阻探針法
  14. Visual inspection for sliced and lapped silicon wafers

    切制矽片及磨光矽片的目視檢查
  15. In this paper, stable perylene and phthalocyanine monolayers were obtained through modifying silicon wafers by chemical reaction between organic macrocycle molecules and functional silicon surface. the surface morphology, aggregation and optical - electric properties of these monolayers were characterized by xps, ftir, uv - vis spectrum, afm, raman, xrd and surface photovoltaic spectrum

    通過紅外光譜，紫外?可見光（ uv ? vis ）吸收， x光電子能譜，激光拉曼光譜，原子力顯微鏡（ afm ） ，表面光電壓譜等表徵手段研究了單層膜的表面形貌、聚集態結構和光電性能等等。
  16. The plant would be able to produce chipsets with details as fine as 90 nanometres across on 300mm silicon wafers, the ndrc said

    國家發改委表示，大連工廠將能在300毫米晶圓片上，製造精度高達90納米的晶元組。
  17. Oxygen precipitation characterization of silicon wafers by measurement of interstitial oxygen reduction

    矽片氧沉澱特性的測定-間隙氧含量減少法
  18. Test methods for oxygen precipitation characterization of silicon wafers by measurement of interstitial oxygen reduction

    通過測量間隙氧含量的減少表徵矽片氧沉澱特性的方法
  19. An improved angle polishing method for measuring subsurface damage in silicon wafers

    一種改進的測量矽片亞表面損傷的角度拋光方法
  20. Dopants for silicon wafers are found in groups iii and v of the periodic table of the elements

    晶圓片攙雜劑可以在元素周期表的iii和v族元素中發現。
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