solder ball 中文意思是什麼

solder ball 解釋
焊錫球
  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  • ball : n 鮑爾〈姓氏〉。n 1 球；球狀物。2 球戲，（特指）棒球；【棒球】壞球 （opp strike） 3 【軍事】子彈...
  1. Screen printing technology for solder ball flip chip for smt

    倒裝晶元及晶圓和基底凸起的網版印刷技術一
  2. Since solder balls do oxidize quickly and builds an oxide coat that reduces the soldering characteristic of the ball, the chips should be vacuum sealed shortly after the reball process

    因為很容易氧化並且形成一個氧化層覆蓋會降低錫球的焊接特性，所以在重新植球加工后應盡快真空封裝。
  3. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability

    在焊球合金、焊料合金、峰值溫度、液相線以上時間和焊接環境五個關鍵因素中，前四項對焊點可靠性比較重要，焊接環境對焊點可靠性的影響不很顯著。
  4. Third, it analyzes different influences upon the life predication by comparing different models of the same package, different constitutive models of the same solder ball ' s materials, different life prediction models, different solder ball dimensions, different mesh density etc. finally, it compares some popular constitutive models of the solder ball materials, and constructs an integrated constitutive model by different curve fits

    接著，又在上述分析的基礎上，比較了同種封裝的不同模型（如條形模型， 1 4模型， 1 8模型） 、相同焊球材料的不同本構模型、不同壽命預測模型、不同焊球尺寸及網格密度等方面對壽命預測的影響。
  5. Its development is based upon the solution of the reliability of solder ball, which is one of the key problems

    而焊點可靠性問題是發展bga csp技術需解決的關鍵問題之一。
  6. It is proved that thermal fatigue is the main cause of the invalidity of the package. therefore, it is significant to research the reliability of solder ball under the thermal cycle

    實踐證明熱作用是晶元封裝組件失效破壞的主導因素，因此熱循環條件下的焊點可靠性研究有著非常重要的意義。
  7. In this paper, bga / csp is simulated and analyzed as implemented in the ansys finite element simulation software tool to evaluate the affect on its reliability ; the constitutive model of the solder ball is constructed tentatively to find a better description for the solder ball

    為此，本文基於大型商用有限元軟體ansys ，對bga csp形式的封裝進行模擬，並在此基礎上對多種情況進行對比分析，以此來評價各種因素對其可靠性的影響，從而來提高該封裝的可靠性。
  8. Zhang liji ( material physics and chemistry ) directed by professor xie xiaoming this paper is intended to solve problems for those who are designing, using pbgas. failure mechanism, as well as cycles to failure of two groups of pbga samples ( with / without underfill ) for thermal cycling conditions in the range of - 40 ~ 125, were presented. the experiment shows that solder ball in the samples without underfill cracked after 500 times cycle, no crack was found in the underfilled samples even after 2700 cycles

    通過一系列的實驗，得到以下實驗結果： ?在本論文設定的溫度循環條件下，未充膠pbga樣品的熱疲勞品壽命在500周左右，充膠樣品的焊點壽命高於2700周； ?對于未充膠器件，中心距（ dnp ）是決定焊點應力、應變大小的最主要因素，裂紋總是從中心距較大處萌生並向中心處擴展； ?溫度循環的過程中焊盤附近焊料組織明顯粗化。
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