solder balling 中文意思是什麼

solder balling 解釋
錫球
  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  • balling : 巴蘭
  1. Often confused with solder balling, solder beading is a defect recognized by one or a few larger balls, generally located around chip caps and resistors

    錫珠經常會和錫球混淆，錫珠一個或幾個大的球，通常會位於小電容或電阻旁邊。
  2. This could cause a variety of solder defects, ranging from solder balling to non - wetting to damaged devices to voiding to charred residues

    這樣會產生許多焊接缺陷，諸如錫球、潤濕不良、破壞元器件、空洞、碳化等。
  3. As with balling, the solution to solder beading occurring during the rts profile is to raise the ramp rate until the problem is resolved

    和解決錫球的方法一樣，在rts曲線中將升溫斜率適當的升高直到解決問題。
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