solder metal 中文意思是什麼

solder metal 解釋
焊料金屬
  • solder : n. 1. 焊藥,焊劑;焊錫。2. 結合物,聯接因素。vt. ,vi. 焊;接合;錫焊;焊接;(使)結合。
  • metal : n 1 金屬;金屬製品;金屬合金。2 【化學】金屬元素;(opp alloy);金屬性。3 【徽章】金色;銀色。4 ...
  1. A method of multi - metal - layer alternate growing is applied to develop a new type of solder structure, which prevents oxidation and creeping of the solder ( the research of this field has been published in an english journal )

    採用多層金屬交替生長的方法,研製出一種新型的焊料結構,防止了焊料的氧化和上爬(已在國外刊物發表) 。
  2. Solder bar is made from high purity metal. by means of strict qualitg control the oxide and metallic and non - metallic impnrities and effectively minimized, the available high purity solder bar is with uniform and glazed surface good wetting and spreading ability after molten bright joint and minimum oxide residue after soldering. our product is suitable for wave and handwork soldering with high quality requirement

    本公司生產焊錫條採用高純度金屬原料,在嚴格品管條件下,有效控制氧化程度以及金屬和非金屬雜質含量,焊錫條表面均勻光滑,純度極高,熔化后流動性好,潤濕性極佳,焊點光亮,氧化渣物極少發生,適用於高品質要求的各種波峰焊和手工焊。
  3. Dc testing, applying to transformer and inductor winding copper resistance 、 relay contact resistance 、 switch and socket contact resistance 、 lead resistance 、 compenent solder resistance 、 pcb line and hole resistance 、 metal detection, ect

    直流測試,適用於變壓器及電感線圈銅阻、繼電器接觸電阻、開關、接插件接觸電阻、導線電阻、元件焊點接觸電阻印製板線條及焊孔電阻、金屬探傷等。
  4. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明: ( 1 )超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐,在二維空間上呈軸對稱的雙峰分佈,負壓形成於這個倒渦流錐內; ( 2 )修正後的霧化氣體速度公式可以滿足超音速霧化的要求; ( 3 )影響超音速霧化工藝最根本的因素有氣液質量流率比( gmr )的大小、霧化氣體流量和倒渦流錐范圍,三個因素的值越大,對形成細粉越有利; ( 4 )在焊錫合金為zhl63a ,霧化介質微n _ 2 ,導液管突出高度取h = 6 . 0mm ,霧化氣體壓力取p = 1 . 0mpa ,合金過熱度取t = 167 ( t = 350 )時,所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  5. Rectangular connectors for frequencies below 3 mhz ; part 2 : detail specification for a range of connectors, with assessed quality, with trapezoidal shaped metal shells and round contacts ; fixed solder contact types

    頻率低於3mhz的矩形連接器.第2部分:帶質量評定的帶梯形金屬套和圓形接觸件的連接器系列的詳細規范.固定的的釬焊接型
  6. Rectangular connectors for frequencies below 3 mhz - part 2 : detail specification for a range of connectors, with assessed quality, with trapezoidal shaped metal shells and round contacts - fixed solder contact types ; amendment 1

    頻率低於3mhz的矩形連接器.第2部分:帶質量評定的帶梯形金屬套和圓形接觸件的連接器系列的詳細規范.固定的釬焊接型.補充件1
  7. Standard specification for solder metal

    焊料金屬的標準規范
  8. Flux : the material used to remove oxides from metal surfaces and enable wetting of the metal with solder

    助焊劑:用於除去金屬表面氧化物並使焊料能潤濕金屬表面的材料。
  9. Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for permanent polymer coating materials solder resist for use in the fabrication of printed boards

    印製電路用基材.第103部分:印製電路連接專用材料.第3節:製造印製電路板用永久性聚合物表面塗覆劑
  10. Answer : ( 1 ) prevent to splatter the metal is caused burnable with fire ; ( 2 ) avoid the harm of electric arc ray radiation to human body ; ( 3 ) prevent certain and harmful gas toxic ; ( 4 ) soldering when pressure vessel, should prevent to solder produce explosion ; ( 5 ) when headroom works, want to take safety belt and safety helmet ; ( 6 ) the attention prevents accident getting an electric shock

    答: ( 1 )防止飛濺金屬造成灼傷和火災; ( 2 )防止電弧光輻射對人體的危害; ( 3 )防止某些有害氣體中毒; ( 4 )在焊接壓力容器時,要防止焊接發生爆炸; ( 5 )高空作業時,要帶安全帶和安全帽; ( 6 )注重避免觸電事故。
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