solder on 中文意思是什麼

solder on 解釋
焊上
  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  • on : adv 1 〈接觸、覆蓋〉上去；開（opp off）。 turn on the light [radio water gas] 開電燈[收音機、自來...
  1. Research on the processing technology of ag - cu - in - sn solder

    釬料加工工藝的研究
  2. Study on plastic deformation resistance of sn - pb - re solder

    釬料的塑性變形抗力研究
  3. We didn t cook none of the pies in the wash - pan - afraid the solder would melt ; but uncle silas he had a noble brass warming - pan which he thought considerable of, because it belonged to one of his ancesters with a long wooden handle that come over from england with william the conqueror in the mayflower or one of them early ships and was hid away up garret with a lot of other old pots and things that was valuable, not on account of being any account, because they warn t, but on account of them being relicts, you know, and we snaked her out, private, and took her down there, but she failed on the first pies, because we didn t know how, but she come up smiling on the last one

    我們並沒有在洗衣盆里烘餅，深怕盆的焊錫見火會化。西拉斯姨父有一把珍貴的銅暖爐，是他珍愛之物，因為這有木頭長把子的爐，是他的一個祖先隨著征服者威廉坐「五月花」之類早先的船隻從英格蘭帶來的，他一直把它和其它珍貴的古物藏在頂樓上。珍藏的原因倒不是因為有什麼價值，它們並無什麼價值，但卻是因為這些是古董。
  4. On the other hand it is a wrong way of opening the cover frequently or not covering the solder paste

    不要取一點用一點，頻繁開蓋或始終將蓋子敞開著。
  5. 0 no monitoring and control requirement on solder iron temperature

    對烙鐵溫度沒有要求監測及控制
  6. Pall very spacious, may tune, rock nie inscribed on the corner of the open - life memoirs, it was introduced, the memoirs of a total of more than 2, 600 characters, all with iron solder stonemason the current time

    墓內很寬敞，人可進退自如，墓壁上密密麻麻地刻著聶開鏡生平的回憶錄，據介紹，該回憶錄一共2600多字，全是石匠用鐵釬刻下。
  7. Based on the analysis and practice of the ultrasonic soldering process, the results show that it is important to procure high soldering quality on controlling submersion depth, the ultrasonic soldering time, assembling clearance and solder composition

    根據對超聲波釬焊工藝的分析和實踐，結果表明控制產品在釬焊時的浸沒深度與產品裝配間隙、超聲波釬焊時間和釬劑成分是獲得高釬焊質量的重要條件。
  8. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明：相關的影響因素主要包括合金的組成、純度和化學均勻性；母材的成分、性質和表面的潔凈度；液態焊料的表面張力；釬焊溫度、氣氛、助焊劑的活性；液態焊料表面膜的組成、結構和性能等。
  9. Investigation and countermeasures on hand contamination of solder workers with electron profession

    電子行業手工焊錫工人手部污染情況調查及對策研究
  10. In - circuit testers can now also test for solder opens on surface - mounted devices ( smds ), a common manufacturing defect on boards with smds

    對于表面安裝設備來說，焊接開路是一個很普遍的製造缺陷，在線測試設備可以將其測試出來。
  11. Industries with particularly high potential exposures include : construction work involving welding, cutting, brazing or polishing on lead surfaces and application of lead solder ; most smelter operations either as a trace contaminant or as a major product ; secondary lead smelters where lead is recovered from batteries ; and firing ranges

    有機會接觸鉛的工作包括：在建築業中，在含鉛的表面上進行焊接切割鍍焊或打磨粉飾以及使用鉛錫作焊接在采礦業中，提煉鉛或其他元素的工種在回收業中，把電池中的鉛再循環利用以及彈藥製造工作。
  12. According to recognition of solder fog, can assist with determination of lead - free process ( on the certification )

    透過錫霧狀況辨別，可輔助無鉛製程之判定（功能認證中） 。
  13. Magic pads, use attached pin - head and female - head solder on

    的魔術焊墊上，再將排針與母座，分別焊在
  14. However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper

    充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
  15. Then the paper also study the atomizer structure ( the protrusion of the delivery tube value h ), atomizing gas pressure p, over - heat temperature of alloy a t, the component of solder alloy and atomizing medium and so on

    進一步對霧化器結構（導液管突出高度h ） 、霧化氣體壓力p 、合金過熱度t 、焊錫合金成份和霧化介質進行了研究。
  16. Figure 5. transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co - planarity

    圖5 ，錫高轉移的效率與孔面積比率及它對迴流峰共面度的影響。
  17. Inspection methods on solder joints quality include two types : destructive testing and non - destructive testing

    焊點質量的檢測方式，宏觀上可分為兩類:有損檢測和無損檢測。
  18. There are two hard problems in solder joints inspection based on structured illumination. one is how to extract features of solder joints effectively, and the other is how to classify the features of solder joints effectively

    在基於結構式光源的焊點質量檢測方法中有兩個難點:一個是如何提取有效的焊點圖像特徵;另一個是如何對焊點圖像特徵進行有效的分類。
  19. Electronic device is developing toward lighter, thinner and littler volume, which demands highly on the density and functionality of package i / os. so it is important factor to assure the quality of the solder joint

    電子產品的「輕、薄、短、小」化對元器件的微型化和組裝密度提出了更高的要求，而焊點的質量和可靠性是影響電子產品質量的重要因素。
  20. Inventory of special ics having tin - lead solder on / in leads / balls, used in specialist / professional equipment

    用於專業設備，含有鉛錫焊料的積體電路。
分享友人
分享到 Line

分享到臉書