solder temperature 中文意思是什麼

solder temperature 解釋
焊接溫度
  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  • temperature : n. 1. 溫度，氣溫。2. 體溫。3. 〈口語〉發燒，高燒。
  1. 0 no monitoring and control requirement on solder iron temperature

    對烙鐵溫度沒有要求監測及控制
  2. Solder iron temperature data and specifications are well plotted and tracked by statistical means

    用統計方法有效繪出及追蹤有關烙鐵溫度資料和規格資料
  3. 1 solder iron temperature of every tools used is well checked by shift / by hourly basis and recorded properly, showing the specified limits and actual values

    每個工具（烙鐵）均以每班/小時為基準的方式進行有效檢測及記錄，並顯示其規限和實際數值
  4. Carefully handle the solder and ensure all the contact points and solder are clean - try different quantities of solder, make sure your soldering iron has been adjusted to the best temperature

    -不同的焊點:線路焊點的運用位置搭配，焊種不同，焊量的比例，溫度的調整
  5. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明：相關的影響因素主要包括合金的組成、純度和化學均勻性；母材的成分、性質和表面的潔凈度；液態焊料的表面張力；釬焊溫度、氣氛、助焊劑的活性；液態焊料表面膜的組成、結構和性能等。
  6. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability

    在焊球合金、焊料合金、峰值溫度、液相線以上時間和焊接環境五個關鍵因素中，前四項對焊點可靠性比較重要，焊接環境對焊點可靠性的影響不很顯著。
  7. These chip inductors provide maximum protection features for solder reflow, welding and come with precise formed caps of high temperature acrylic for perfect co - centering and vacuum pickup. they have excellent solderability and are able to withstand pull - up force, mechanical shock and pressure. available in sizes of 0402, 0603, 0805, 1008, 1206, 1210, our chip inductors have wide inductance range for virtually all broadband and rf applications

    臺達電子提供全系列之被動元件，包括0402 0603 0805 1008 1206與1210系列，可應用於行動電話基地臺寬頻通訊無線電話個人數位助理pda呼叫器搖控器電視機上盒數據機電壓控制振蕩器與高頻模組等。
  8. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明： （ 1 ）超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐，在二維空間上呈軸對稱的雙峰分佈，負壓形成於這個倒渦流錐內； （ 2 ）修正後的霧化氣體速度公式可以滿足超音速霧化的要求； （ 3 ）影響超音速霧化工藝最根本的因素有氣液質量流率比（ gmr ）的大小、霧化氣體流量和倒渦流錐范圍，三個因素的值越大，對形成細粉越有利； （ 4 ）在焊錫合金為zhl63a ，霧化介質微n _ 2 ，導液管突出高度取h = 6 . 0mm ，霧化氣體壓力取p = 1 . 0mpa ，合金過熱度取t = 167 （ t = 350 ）時，所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  9. Then the paper also study the atomizer structure ( the protrusion of the delivery tube value h ), atomizing gas pressure p, over - heat temperature of alloy a t, the component of solder alloy and atomizing medium and so on

    進一步對霧化器結構（導液管突出高度h ） 、霧化氣體壓力p 、合金過熱度t 、焊錫合金成份和霧化介質進行了研究。
  10. Through appearance testing, x 射線 testing and temperature cycling testing, the reliability of mixed solder joints and 無 鉛 solder joints which formed under various process parameters was assesed

    通過對不同工藝參數下形成的混合焊點和無鉛焊點進行了外觀檢測、 x射線檢測和溫度循環測試。
  11. Temperature fluctuations caused by either power transients or environmental changes, along with the resulting thermal expansion mismatch between the various package materials, results in time and temperature dependent creep deformation of solder

    然而封裝的高密度使單位體積內容易產生更大的熱量，因此必須關注熱引起的封裝失效問題。特別是由於封裝材料間熱膨脹系數不匹配而導致的焊點失效。
  12. Adjusted pressure / temperature ratings for joints made of copper tube and solder end valves

    在連接銅管和焊接埠閥門時要核對壓力/溫度額定值
  13. The process accelerates as the temperature is rising. recently, the failure caused by moisture and heat was often observed in package solder reflow and adhesive joints which absorbed moisture

    在電子元件高溫焊接中，受到濕汽侵入的元件常發生「爆米花」式的脫層斷裂，嚴重影響了產品的合格率。
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