sputtering equipment 中文意思是什麼
sputtering equipment
解釋
濺鍍設備- sputtering : 飛濺
- equipment : n. 1. 〈常 pl. 〉設備，裝備，配件，配備物品。2. （一個企業除房地產以外的）固定資產。3. （工作必需的）知識，技能，修養。4. （火車）車輛；（汽車等）運輸配備。
-
Using jgp560c magnetron sputtering equipment, cu / ag film are deposited on cd1 - xznxte substrate by dc magnetron sputtering in order to get the influences of the main experiments parameters such as sputtering power, gas flow, vacuum air pressure, magnetoelectricity power and substrate temperature on deposition rate of film, discovered that dc sputtering power is the most key factor influencing the deposition rate
在jgp560c型超高真空多功能磁控濺射鍍膜機上，採用直流磁控濺射法在cdznte晶體上制備出cu ag合金薄膜，揭示了氣體流量、直流濺射功率、勵磁電源功率、工作氣壓和襯底溫度等工藝參數對沉積速率的影響規律。結果表明濺射功率對沉積速率的影響最大，隨濺射功率的增大沉積速率快速增大。 -
General specification for magnetic sputtering equipment
磁控濺射設備通用技術條件 -
The surface morphologies of thin films were observed by using scan electron microscope ( sem ) and atomic force microscope ( afm ). based on grazing incidence x - ray diffraction ( gixrd ) equipment, we find that residual stress exist in magnetron sputtering plct film, in addition, the ferroelectric properties of plct thin films were measured by radiant premier lc type multifunctional ferroelectric properties test system
利用廣角x射線衍射技術對不同濺射工藝下plct薄膜的相結構進行了研究;採用掃描電子顯微鏡（ sem ）和原子力顯微鏡（ afm ）分別觀察了薄膜的表面形貌;利用掠入射x射線衍射（ gixrd ）測量了薄膜的殘余應力。 -
Research on magnetron sputtering winding coating equipment for use in plastic ito films
膜磁控濺射卷繞鍍膜機的研製 -
Plasma sputtering equipment
等離子濺射設備
分享友人