surface mount 中文意思是什麼
surface mount
解釋
壁掛的-
At recent decade, accompany with surface mount technology printed - circuit board to produce fly of automation degree to soon develop, as to it ' s correspond of mass defect the inspection also put forward higher request, from in brief shoot to be like system to complicated " 3 - d " x optics to examine system, the automatic optical inspection is in great quantities adopt by the each production factory house
摘要在最近十年，伴隨著表面貼裝印刷電路板生產自動化程度的飛速發展，對其相應的質量缺陷檢查也提出了更高的要求，從簡單的攝像系統到復雜的" 3 - d " x光檢測系統，自動光學檢測系統大量被各生產廠家採用。 -
Design guidelines for military surface mount circuit assemblies
軍用表面組裝電路設計指南 -
During these years, the main fact of surface mount technology ( smt ) industry is the shorter produce period, the shorter time of product which put in market, the smaller produce batch, the more new technology
競爭日益激烈、產品投放市場的時間日益縮短、生產周期越來越短、生產批量越來越小、新技術不斷引入，這些是表面貼裝技術（ smt ）行業所存在的不爭的事實。 -
Usage of real - time image recognition technology in surface mount components taping machine
實時圖像識別技術在片式元件編帶機中的運用 -
Fixed capacitors for use in electronic equipment - sectional specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors
電氣設備用固定電容器.分規范:固定金屬化聚苯撐硫化膜鍍層表面固定直流電容器 -
Fixed capacitors for use in electronic equipment - blank detail specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors - assessment level ez
電氣設備用固定電容器.空白詳細規范:固定金屬化聚苯撐硫化膜鍍層表面固定直流電容器.評定級ez -
Environmental and endurance testing - test methods for surface - mount boards of area array type packages fbga, bga, flga, lga, son and qfn
環境和耐用試驗.區域陣列式包裝件表面安裝板的試驗方法fbga bga flga lga son和qfn -
Environmental and endurance testing - test methods for surface - mount boards of area array type packages fbga, bga, flga, lga, son and qfn iec 62137 : 2004 corrigendum : 2005 ; german version en 62137 : 2004
環境和耐久性試驗.區域陣列式包裝件表面安裝板的試驗 -
Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印刷電路板組件.第1部分:一般規范.使用表面安裝和相關裝配技術的焊接電氣組件和電子組件的要求 -
Resistors, rectangular, surface mount, precision
表面安裝的矩形精密電阻器 -
Taping of surface - mount components for automatic placement
自動定位用表面裝元件的系帶 -
16 - mm and 24 - mm embossed carrier taping of surface mount components for automatic handling
自動裝配用表面裝元件的16mm和24mm壓紋載帶 -
32 - mm, 44 - mm, and 56 - mm embossed carrier taping of surface - mount components for automatic handling
自動裝配用表面裝元件的32mm 44mm和56mm壓紋載帶 -
The high switching frequency allows the use of small surface - mount capacitors, saving board space and reducing cost
高的開關頻率允許選用小的表面陶瓷電容，可節省板級面積、降低成本和減小輸出電壓紋波。 -
1 fixed capacitors for use in electronic equipment - sectional specification : fixed surface mount multilayer capacitors of ceramic dielectric, class 1
電子設備用固定電容器.分規范:陶瓷介質的表面安裝多層固定電容器 -
Fixed capacitors for use in electronic equipment - sectional specification - fixed surface mount multilayer capacitors of ceramic dielectric, class 2
電子設備用固定電容器.分規范. 2級陶瓷介質的表面安裝多層固定電容器 -
Fixed capacitors for use in electronic equipment - part 20 : sectional specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors
電子設備用固定電容器.第20部分:分規范:金屬化聚苯硫醚膜介質表面安裝直流片式固定電容器 -
Fixed capacitors for use in electronic equipment - part 20 : blank detail specification : fixed metallized polyphenylene sulfide film dielectric surface mount d. c. capacitors - assessment level ez
電子設備用固定電容器.第20部分:空白詳細規范:金屬化聚苯硫醚膜介質表面安裝直流片式固定電容器.評定水平ez -
Surface mount type sm
表面黏著式 -
Semiconductor devices - mechanical and climatic test methods - part 30 : preconditioning of non - hermetic surface mount devices prior to reliability testing
半導體器件.機械和氣候試驗方法.第30部分:可靠性試驗之前不氣密的表面安裝器件的預調試
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