table feed wheel 中文意思是什麼

table feed wheel 解釋
工作臺進給輪
  • table : n 1 桌子；飯桌，餐臺。2 手術臺；工作臺；游戲臺；賭臺；寫字臺。3 （飯桌上的）食物，酒菜，伙食；一...
  • feed : feed1fee 的過去式及過去分詞。vt 1 給…飲食，給…東西吃；給（嬰兒）餵奶。2 喂養，飼養，使吃草，放牧...
  • wheel : n 1 輪，車輪；輪狀物。2 〈口語〉腳踏車；【造船】艙輪；（汽車的）方向盤，駕駛盤；（制陶）轉盤；紡...
  1. The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement

    研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。
  2. By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated

    摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
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