wetting balance test 中文意思是什麼
wetting balance test
解釋
潤濕稱量試驗-
Soft soldering fluxes - test methods - part 16 : flux efficacy tests, wetting balance method
軟釬焊焊熔劑.試驗方法.第16部分:焊熔劑功效試驗.濕平衡法 -
Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste
環境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置 -
Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method
環境試驗規程.第2部分:試驗方法.第69節:試驗te :潤濕平衡法試驗表面鑲嵌技術用電子元件軟釬焊 -
Environmental testing. part 2 : tests. test ta : soldering. solderability testing by the wetting balance method
基本環境試驗規程.第2部分:試驗.第54節:試驗ta :錫焊.潤濕平衡法可焊性試驗 -
Solder wire, solid and flux cored - specification and test methods - wetting balance test method for flux core solder wire efficacy
實心和管狀釬料焊絲.規范和試驗方法.管狀釬料焊絲效能的潤濕平衡法 -
Solder wire, solid and flux cored - specifications and tests methods - part 3 : wetting balance test method for flux cored solder wire efficacy
實心和管狀釬料焊絲.規范和試驗方法.第3部分:管狀釬料焊絲效能的潤濕平衡法 -
Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method
基本環境試驗規程.第2部分:試驗.第69節:試驗te :潤濕平衡法對表面鑲嵌技術用電子元件的軟釬焊試驗 -
Connectors for electronic equipment - tests and measurements - part 12 - 7 : soldering tests ; test 12g : solderability, wetting balance method
電子設備連接器.試驗和測量.第12 - 7部分:焊接試驗.試驗12g .可焊接性.濕潤平衡方法 -
Connectors for electronic equipment - tests and measurements - part 12 - 7 : soldering tests ; test 12g : solderability, wetting balance method iec 60512 - 12 - 7 : 2001 ; german version en 60512 - 12 - 7 : 2001
電子設備連接器.試驗和測量.第12 - 7部分:焊接試驗.試 -
Soft soldering fluxes - test methods - flux efficacy tests, wetting balance method
軟釬焊劑.試驗方法.釬劑功效試驗.濕平衡法 -
Environmental testing - tests - test ta - soldering - solderability testing by the wetting balance method
環境試驗.試驗.試驗2 . 1ta :釬焊.用濕平衡法進行釬焊性試驗 -
Environmental testing. part 2 : tests. test te : solderability testing of electronic components for surface mount technology by the wetting balance method
環境試驗.第2部分:試驗. te試驗:用加濕平衡法測試表面安裝技術的電子元件的可焊性 -
Solder wire, solid and flux cored - specifications and test methods - part 3 : wetting balance test method for flux cored solder wire efficacy iso 12224 - 3 : 2003 ; german version en iso 12224 - 3 : 2003
實心和管狀釬料焊絲.規范和試驗方法.第3部分:用潤濕 -
Environmental testing part 2 : tests. test ta : soldering. solderability testing by the wetting balance method
環境試驗.第2部分:試驗.試驗ta :軟釬焊.用濕平衡法測試可焊性 -
Soft soldering fluxes - test methods - part 16 : flux efficacy tests, wetting balance method iso 9455 - 16 : 1998 ; german version en iso 9455 - 16 : 2001
軟釬焊助熔劑.試驗方法.第16部分:助熔劑功效試驗.濕
分享友人