切屑變形 的英文怎麼說
中文拼音 [qiēxièbiànxíng]
切屑變形
英文
chip deformation-
The results show that the process of concrete sawing with diamond tools is that the impact of diamond sawblade induces the rupture and break of concrete surface layer during high speed sawing ; cement and carpolite become micro chips by the cutting of diamond grits ; steel fiber and steel wire are broken by plastic deformation or pulled out by forces
結果表明：金剛石鋸片鋸切混凝土的過程表現為高速據切過程中金剛石據片的沖擊引起混凝土表層斷裂破碎，水泥石子等在切削區內層受到金剛石磨粒的微切削作用形成粉屑，以及鋼纖維和鋼絲發生金屬塑性變形斷裂或被拔拉而斷裂的過程。It is considered as the main reason that the fine silicon is easier to be pressed into the matrix and to cooperate with the matrix deformation in the machining of alloy, but the coarse silicon breaks, drops out and displaces usually during the machining, which results in strenuous friction between the tool and the work and various defects in machined surface
造成這種影響的主要原因在於細小的硅粒比較容易協同基體塑性變形和被刀具壓入切屑和已加工表面，而粗大的硅塊往往發生解理破碎、脫落和位移，直接與刀具發生強烈摩擦並使已加工表面存留許多缺陷。In this paper, molecular dynamics simulation is carried on the nanometric cutting of defect - free monocrystalline silicon. based on simulations, a reasonable explanation is given to the forming mechanism of chip and surface machined in the cutting process of monocrystalline silicon. moreover, the feasibility of brittle - ductile transition of monocrystalline silion is studied with the method of first principle stress
對內部無缺陷的單晶硅的納米切削過程進行了分子動力學模擬.通過模擬結果，對單晶硅納米切削中的切屑形成過程和加工表面的形成過程做出了合理的解釋.並用第一原理應力計算方法對單晶硅納米切削過程中的脆塑轉變的可行性進行了研究
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