印製電路組件 的英文怎麼說
中文拼音 [yìnzhìdiànlùzǔjiàn]
印製電路組件
英文
printed circuit assembly- 印 : Ⅰ名詞1 (圖章) seal; stamp; chop 2 (痕跡) print; mark 3 (姓氏) a surname Ⅱ動詞1 (留下痕跡)...
- 電 : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
- 路 : 1 (道路) road; way; path 2 (路程) journey; distance 3 (途徑; 門路) way; means 4 (條理) se...
- 組 : Ⅰ名詞1 (由不多的人員組成的單位) group 2 (姓氏) a surname Ⅱ動詞(組織) organize; form Ⅲ量詞(...
- 件 : Ⅰ量詞(用於個體事物) piece; article; item Ⅱ名詞1. (指可以一一計算的事物) 2. (文件) letter; correspondence; paper; document
- 電路 : [訊] circuit (ckt); electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
- 組件 : assembler
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Requirement for soldering technology of pcb assembles
印製電路組件裝焊工藝要求Cleaning process method for welded pcb assembles
印製電路組件裝焊后的清洗工藝方法. j printed boards and printed board assemblies - design and use - part 5 - 6 : attachment land joint considerations - chip carriers with j - leads on four sides
印製電路板和印製電路板組件.設計和使用.第5 - 6部分:附件End - item dpmo for printed circuit board assemblies
印製電路板組件的末端裝置dpmoPrinted boards and printed boards assemblies - design and use - part 1 - 2 : generic requirements - controlled impedance
印製電路板和印製電路板組件.設計和使用.第1 - 2部分:總要求.控制阻抗Printed board assemblies - sectional specification - requirements for terminal soldered assemblies
印製電路板組件.分規范.端點焊接組件要求Printed board assemblies - sectional specification - requirements for surface mount soldered assemblies
印製電路板組件.分規范.表面安裝焊接組件要求Printed board assemblies - sectional specification - requirements for through - hole mount soldered assemblies
印製電路板組件.分規范.通孔安裝焊接組件要求Saxonia umformtechnik gmbh offers you pertinent information by telephone for the ranges plastic group parts, plates and guide needles in addition to biotechnology. contact saxonia umformtechnik gmbh
Saxonia umformtechnik gmbh從事塑料組合部件、塑料復合部件,片狀粉末、扁坯、板坯、薄板坯、印製電路板、印製線路板,毛坯和半成品,生物技術的製造和銷售。. printed boards and printed board assemblies - design and use - part 5 - 2 : attachment land joint considerations ; discrete components
印製電路板和印製電路板組件.設計和使用.第5 - 2部分:焊接. printed boards and printed board assemblies - design and use - part 5 - 2 : attachment land joint considerations - discrete components
印製電路板和印製電路板組件.設計和使用.第5 - 2部分:焊接. printed boards and printed board assemblies - design and use - part 5 - 1 : attachment land joint considerations - generic requirements
印製電路板和印製電路板組件.設計和使用.第5 - 1部分:附屬物Printed boards and printed board assemblies - design and use - part 5 - 1 : attachment land joint considerations ; generic requirements
印製電路板和印製電路板組件.設計和使用.第5 - 1部分:總要求.附屬物. printed boards and assemblies - design and use - attachment land joint considerations - attachment land joint considerations - generic requirements
印製電路板和印製電路板組件.設計和使用.連接方法Printed boards and printed board assemblies - design and use - part 5 - 2 : attachment land joint considerations - discrete components iec 61188 - 5 - 2 : 2003 ; german version en 61188 - 5 - 2 : 2003
印製電路板和印製電路板組件.設計和使用.第5 - 2部分Design standard for rigid printed boards and rigid printed board assemblies
剛性印製電路板和剛性列印板組件的設計標準Documentation requirements for printed boards, assemblies and support drawings
印製電路板組件和配套圖形的文件要求分享友人