封裝的 的英文怎麼說

中文拼音 [fēngzhuāngde]
封裝的 英文
housed
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 的 : 4次方是 The fourth power of 2 is direction
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs

    摘要結合電子封裝的現狀、電子塑封材料的發展以及電子封裝對塑封材料提出的高性能要求，介紹了新型脂環族環氧樹脂及其作為塑封材料的應用前景，其包括耐熱型液體、含磷三官能團型、有機硅多官能團脂環族環氧樹脂。
  2. A model of the capsulated antenna is presented and simulations are conducted according to different numerical values of parameters involving capsulation dimensions and dielectric constant

    建立了帶有圓柱形介質封裝的天線模型，針對介質厚度、內徑和介電常數三個封裝參數的不同取值組合進行了大量模擬。
  3. Analyzing and experimentally verifying the strain transducing characteristics of strain sensor. experiments tell that strain sensor capsulated by thin sheet metal can effectively transduce strain under certain mechanical robust with strain transducing efficiency of 97. 8 %, sensitivity of 83. 34 / kg, precision of 1. 64

    實驗結構證明，用薄金屬片封裝的應變傳感器在保證一定機械強度的基礎上實現了應變的有效傳遞，應變傳遞效率可達97 . 8 % ，應變靈敏度為83 . 34 / kg ，精度為1 . 64 。
  4. Low - voltage ac power circuit breakers used in enclosures

    封裝的低壓交流電源斷路器
  5. One of the encapsulated methods throws an exception

    封裝的方法之一引發異常。
  6. Our standard gasket is double jacketed metal

    我們標準的墊圈是雙重封裝的金屬。
  7. Thirdly, the paper discusses the driver of the peripheral equipment, how to port the uc / os - n and uclinux, h. 323 protocol and the application of the system in the digital speech classroom. also some software and hardware measure are adopted to enhance the system stability. at last, the shortcoming and the something to be improved are given. dsp can be used to realize real - time speech coding algorithm, and after porting ( ac / os - n, arm can manage the keyboard, the lcd and the ethernet peripheral etc. then the embedded network system with specific purpose can be used in others fields, such as pda, set of top, web tv, ect

    在實際設計實現中，為提高系統軟、硬體整體穩定性和可靠性，使用了以下幾種方法： （ 1 ）低電壓復位、抗電源抖動能力、增加時鐘監測電路、抗電磁干擾能力、散熱等技術； （ 2 ）多層pcb設計，線路板結構緊湊，電源部分採用數字5v 、 3 . 3v 、 3v 、 1 . 8v和模擬5v多電源供電； （ 3 ）選用表面貼和bga封裝的器件； （ 4 ）按照軟體工程的要求進行系統分析，規劃系統框圖、流程分析、模塊劃分，減小了不同模塊的相關性，從而最大限度避免了錯誤的發生。
  8. Lead - free solder bumping technology for wafer level package

    圓片級封裝的無鉛焊料凸點製作技術研究
  9. Wafer bumping technology for wlp

    圓片級封裝的凸點製作技術
  10. In this way, the envelope of a light bulb is made by a single machine at the rate of 66, 000 an hour, as compared with 1, 200 a day produced by a team of four glassblowers

    用這種方法，通過一個單獨的機器製作一個燈泡的封裝的速度是每小時66000個，相比要用一個四人吹玻璃小組吹1200天。
  11. The second part introduces concepts and knowledge of the integrate circuit ( ic ) design and package. the third part introduces the realization of the routing algorithm and the

    （ 2 ）包括第二、三章，介紹了集成電路設計和封裝的概念和知識。
  12. It indicates that under the impact of climate change, the suitable habitat for formosan landlocked salmon will be compressed temporally and spatially

    研究結果顯示櫻花?吻鮭的適當棲地，在時間與空間的尺度上，均有被封裝的情形出現。
  13. Several materials with large coefficient of expansion were selected to make packaging components, and it was found that the packaging materials have good temperature sensitivity and compatibility with optical fibers. experimental accuracy and repetition of fbg temperature sensitivity and compensation were discussed. have selected several materials which has bigger coefficient of expansion to do packaging components, have made many temperature experiments, there have not flaws, such as aging, crackle, absciss layer, packaging materials have good temperature sensitivity and compatibility with optical fiber ; have designed the simple and practical packaging components, have performed a serials of experiments about accuracy and repetition of fbg wave - length, have obtained the first step conclusion ; have analyzed the result and made comparison between the result of different experiment, have summarized the best packaging effect and several rules to reduce mistskes

    本文所做的主要工作包括以下幾個內容：一、選取了常見的熱膨脹系數大的材料製作封裝元件，經過多次一80到80反復測試，封裝元件沒有出現老化開裂、封裝裂紋、空洞、離層等缺陷，封裝材料具有良好的溫敏穩定性及復用性，與光纖相容性較好；二、對光纖光柵進行簡單、實用的封裝處理，就封裝效果的優劣性、波長測量的準確度、重復性和封裝時產生的波長損失等方面進行了一系列的實驗，得出了初步的結論；三、對溫敏和溫度補償式封裝的實驗數據進行了詳細的分析和對比，從數字上對溫變過程中光纖光柵中心波長的改變及溫變曲線進行了定量的分析，在大量實驗數據分析結果的基礎上，總結出哪種材料封裝效果更好，以及如何有效的減小實驗誤差。
  14. The type of packages and the methods in which it is possible to mount the finished semiconductor chip ( depending on factors such as heat dissipation, size, etc. )

    封裝的類型和方法（它們取決于熱耗散和尺寸大小等因素） ，用此種方式即可安置經過精製的半導體晶元。
  15. The minimal usage means the usage in the welding sealed iron container, if in the humidity or inner liner plastic bag sealed package wooden container, should use double

    注：最少使用量指在焊封鐵容器內的使用量，凡是在潮濕環境和採用木箱內襯塑料袋封裝的包裝，應採用加倍的量。
  16. Notice : the minimal usage means the usage in the welding sealed iron container, if in the humidity or inner liner plastic bag sealed package wooden container, should use double

    注：最少使用量指在焊封鐵容器內的使用量，凡是在潮濕環境和採用木箱內襯塑料袋封裝的包裝，應採用加倍的量。
  17. Fixed metalized polyethylene - terephthalate film dielectric chip capacitors for direct current - encapsulated, blank detail specification for

    直流電用封裝的固定鍍金屬聚對苯二甲酸乙酯薄膜介質片狀電容器的空白詳細規范
  18. According to package characteristics of long linear hgcdte irfpa detector, difficulties of the metal split micro dewar manufacture are discussed in the paper

    摘要針對長線列碲鎘汞紅外焦平面探測器封裝的特點，文章討論了分置式微型杜瓦研製的難點。
  19. With the accumulation of product development experience in the last years, axcen photonics corp can provide the clients the high quality, high coupling - efficiency and cost - effective osa products. the products include sc - type, lc - type and pigtailed - type osas with the speed ranging from 155mbps to 2. 5gbps. in order to meet the specific request for high power and high coupling efficiency osas, axcen photonics corp also can offer the customized service to this kind of products

    創威光電目前亦可提供客戶光學次模組封裝的產品及服務，藉由本公司技術研發人員過去多年來累積的開發經驗，本公司已可為客戶提供高品質高耦合效率及具市場競爭價格的光學次模組產品，其產品包括: sc - type ， lc - type及pigtailed - type光學次模組封裝，就傳輸速率而言，目前創威光電可提供從155mbps至2 . 5gbps等不同速率的產品，以迎合顧客需求，另外，本公司亦可提供客制化，特殊規格，符合高功率，高耦合效率要求之元件封裝。
  20. This prototype is written with java and c + +, it behaves better because of the excellence of the two languages. message encapsulation is also used in this prototype. the client encapsulates the captured message and serialize it for net transmission and decapsulate the package and receive the message

    為了實現兩種語言的混合編程，系統引入了消息封裝的概念，將截獲的系統消息進行封裝並序列化為可以在網路中傳輸的對象，在到達目的地后在解開封裝將消息重現。
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