晶元尺寸封裝 的英文怎麼說

中文拼音 [jīngyuánchǐcùnfēngzhuāng]
晶元尺寸封裝 英文
chiscale package
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 尺 : 尺名詞[音樂] （中國民族音樂音階上的一級 樂譜上用做記音符號 參看「工尺」） a note of the scale in ...
  • 寸 : Ⅰ量詞（長度單位） cun a unit of length （=1/3 decimetre）Ⅱ形容詞（極短或極小） very little; very ...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. During the course of the manufacture for packaging 2000 pixel hgcdte irfpa wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear irfpa detector ' s signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc

    在用於封裝2000元碲鎘汞焦平面晶元的分置式微型杜瓦研製中，詳細闡明了一種焦平面晶元其裝載面為斜拉式支撐結構的設計，實現了探測器外引功能線的布線優化及其輸出引線工藝改進，並提出了一種大尺寸高氣密光學窗口的焊接方法等關鍵技術。
  2. The type of packages and the methods in which it is possible to mount the finished semiconductor chip ( depending on factors such as heat dissipation, size, etc. )

    封裝的類型和方法（它們取決于熱耗散和尺寸大小等因素） ，用此種方式即可安置經過精製的半導體晶元。
  3. Ultrathin wafer level chip size package technology

    超薄型圓片級晶元尺寸封裝技術
  4. As an advanced package, 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package. meanwhile, high packaging density tends to generate more power in a package and cause serious thermal problem

    三維疊層晶元尺寸封裝（ stackedchipscalepackage ）是目前最先進的微電子封裝形式之一，具有體積小、重量輕、封裝效率高等特點。
  5. Ut - scsp ultra - thin - stacked chip size package

    超薄疊層晶元尺寸封裝
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