晶元疊積 的英文怎麼說
中文拼音 [jīngyuándiějī]
晶元疊積
英文
die stacking-
As an advanced package, 3 - d stacked csp assembly provides significant size and performance advantages than traditional single chip package. meanwhile, high packaging density tends to generate more power in a package and cause serious thermal problem
三維疊層晶元尺寸封裝（ stackedchipscalepackage ）是目前最先進的微電子封裝形式之一，具有體積小、重量輕、封裝效率高等特點。
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