晶元粘貼 的英文怎麼說
中文拼音 [jīngyuánniántiē]
晶元粘貼
英文
die bonding-
In the early stage of experiment, an in - material thin film manganin gauge was studied. this in situ gauge was manufactured by single - step thin film processing, namely, manganin piezoresistance element was prepared on inorganic substrates such as ceramic, microcrystalline glass, etc by sputtering
在實驗的初期，本文還研究了「在位式」的錳銅薄膜傳感器，即首先在陶瓷或微晶玻璃基板上沉積錳銅敏感元件，然後用粘貼ptfe薄膜的方法完成傳感器的封裝。While the chips are attached to near center or near a edge of subatrate, the mean, deviation and maximum are at the almost same level ; when the chip is attached near a corner, the deviation and the maximum is far larger than those of the above two positions ; during thermal treatment followed, the residual stress demonstrates a regular cycle trend when the chips are attached near center or edge of the substrate and fluctuates in a wide range when the chip is attached near a corner
當晶元粘貼在基板中心和靠近基板邊緣的位置時粘合劑固化后殘余應力的平均值、最大值和數值的分散性皆處于相接近的水平，而當粘貼在基板靠近一角的位置時應力分佈狀況則有很大不同：應力的分散性增大，應力最大值也遠大於粘貼于另外兩個位置時的值。If low residual stress and better residual stress distribution map are expected, adhesives with low cte is preferred, which could be a criteria to select organic adhesives
使用熱膨脹系數較小的有機粘合劑粘貼晶元時，可獲得較低的殘余應力和相對優越的應力分佈。該規律可以作為選擇有機粘合劑時的參照。While the chips are attached to substrates with different organic adhesives, the evolution trends of surface residual stress are alike
使用不同有機粘合劑于晶元粘貼時，應力演化過程基本相似。The thesis focuses on the stress issue induced by die attachment in mems ( namely, micro - electronic - mechanical system ) packaging
本論文主要研究對mems封裝中晶元粘貼于基板時所引起的應力問題。分享友人