焊洞 的英文怎麼說

中文拼音 [hàndòng]
焊洞 英文
vacuoles
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 洞 : Ⅰ名詞（物體上穿通的或凹入較深的部分; 窟窿; 洞穴） hole; cavity Ⅱ形容詞（深遠; 透徹） profound; thorough; clear
  1. Results show that the brittle fracture is mainly caused by hydrogen brittleness that results from the oxidation arid absorbing hydrogen of copper tube during braze welding

    同時在加熱和冷卻時，由於異種材料的熱脹系數差別過大，產生的較大熱應力作用於已存在的裂紋，促使裂紋二次擴展，甚至使得晶粒脫落產生空洞，最終導致焊接接頭漏氣失效。
  2. This could cause a variety of solder defects, ranging from solder balling to non - wetting to damaged devices to voiding to charred residues

    這樣會產生許多焊接缺陷，諸如錫球、潤濕不良、破壞元器件、空洞、碳化等。
  3. The reduction factors derived from curve fitting based on calculation results by the finite element program ( ansys ) considering all kinds of damages such as cutouts, corrosion, cracks, denting, initial deflection and residual stress are introduced to modify the effective width of perfect panel in the present paper

    本文考慮板中可能存在孔洞、腐蝕、裂縫、局部撞損和初始焊接變形或殘余應力等損傷和初始缺陷，對不同的損傷形式用有限元程序（ ansys ）進行大量的計算，通過曲線擬合的方法引入折減系數對完好板格的有效寬度進行修正。
  4. It is also found that the geometry of a flip - chip joint and void formation have stronger effects upon current crowding than the multi - phase nature of solder bumps does

    在本研究亦發現，覆晶接點的幾何形狀和孔洞對于電流聚集有很大的影響，其效應遠勝于焊料中的多相結構。
  5. The forward compatibility, backward compatibility, tin whisker, voids, micro - voids and surface finishes were emphasized and how to avoid the lead free transfer problems were reviewed

    重點論述了前向兼容與後向兼容、錫須、空洞與微空洞、可焊性塗層以及如何避免無鉛轉移中出現的問題。
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