焊盤 的英文怎麼說

中文拼音 [hànpán]
焊盤 英文
pad
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 盤 : Ⅰ名詞1 （盤子） tray; plate; dish 2 （形狀或功用像盤的東西） sth shaped like or used as a tray pl...
  1. Quick diathermancy avoid damage to cmos chip and solder. precise design and good technics avoid damage due to attrition. vacuumize avoid alterative because of oxygenation during transportation. antistatic plastic core

    傳熱吸收快，盡可能的避免對晶元和焊盤的損壞;精確的設計和製造工藝避免磨擦對焊盤可能造成的損壞;真空包裝避免?品在運輸途中氧化變質;防靜電塑料芯;符合美國軍隊及國家宇航局各種標準
  2. This machine adopts tungsten carbidewith scraper surfacing welding and bottom plate made of diabase cast stone with simple and close structure, easy repair, economical and wearable performance and high productivity

    該機採用刮板堆焊碳化鎢輝綠巖鑄石底盤等新技術，具有結構簡單緊湊維修方便經濟耐用生產率高等特點。
  3. Study on order distribution of monolayer brazing grindingplate s grind grain

    單層釬焊砂盤磨粒分佈有序性研究
  4. To achieve the required bump heights, the solder paste is over - printed onto the wafer bond pads

    為了獲得要求的凸起高度，錫膏在晶片焊盤過焊。
  5. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure

    在下一個迴流工序，錫膏浸潤焊盤表面，形成一個固態錫膏凸起。
  6. Box packaging machine, static elimina tion machine, inverter power ageing equipment, automatic welding machine, magnet head 、 disk driver business backup of precision to clings 、 fixture etc

    彩盒包裝機；除靜電除塵機；變頻電源老化設備；自動化焊接機；磁頭、盤片行業配套的精密工裝、夾具等。
  7. The process and mechanism of ball bonding were studied in this paper, specifically, intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail

    本文在對銅絲球鍵合工藝和原理研究的基礎上，著重分析了老化過程中銅絲球與鋁合金焊盤鍵合的金屬間化合物生長及可靠性。
  8. From the design of patterns to the choice of raw material, and through unique spraying and computer carving craft, welding and minute processing technology of professional technicians ; jiashide products are leading in the pattern, quality, technology and style, which is the first choice of numerous star hotels, high - grade buildings and luxurious residential houses

    佳仕得產品從款式的設計到原材料的精選，再通過獨特的噴塗噴砂和電腦雕花工藝結合，專業技師焊接及精細加工技術，無論在款式上還是質量技術和風格上均能處于引領潮流的地位，是眾多星級酒店高檔樓盤和豪華家居之首選。
  9. Cutter adapters ' design of facing weld steel tubes

    焊管端面加工刀盤設計初探
  10. Oxygen / fuel torch sets, propane torches, electric welders, portable disk or wheel grinders, portable lead pots and tar buckets are some examples of such tools and equipment

    氧氣/燃料焊槍、丙烷氣割炬、電焊工、手提圓盤或車輪磨工、手提鉛罐和瀝青桶都是類似的工具和裝備的例子。
  11. Machine spools with large bore for processing of electric wires and cables. part 2 : steel plate welded machine spools

    電線電纜大孔徑機用線盤.第2部分:鋼板焊接機用線盤
  12. 4. the noise of the substrate and the inductors of the pads are investigated in detail

    4 .研究了襯底噪聲和焊盤寄生電感對電路的影響。
  13. Themal reliefs are sometimes also used on vias very near, or in, pads of smt components for the same reason

    基於同樣的原因，限熱槽也用於貼片元件內或離元件很近的焊盤。
  14. When human has contact to touch pad, electric charge in the human body will be accumulated through the touch pad

    當人體接觸感應焊盤時，在人體里的電荷將被通過感應焊盤積累。
  15. Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly

    在表面貼裝裝配的迴流焊接中，錫膏用於表面貼裝元件的引腳或端子與焊盤之間的連接。
  16. Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land

    需要離開線路板安裝的組件在線路板表面利用引腳形狀或其它機械支撐來防止焊盤的翹起。
  17. The algorithm can be applied to connection routing in pcbs with various pad geometry and pad sizes, with different wire widths and variable distances between wires. the basic element in routing is the search line with a given destination. the main features of the router are the target orientation of the search lines, the routing efficiency is guaranteed by rationally designed data structures and by the ability of searching around obstacles, the small amount of working storage and the reasonably short routing time

    該布線演算法適用於焊盤外形尺寸不一，線寬及線間距離可變的印刷電路板布線，其基本要素是帶有預定終點的探索線，特點是線探索具有目標針對性，設計合理的數據結構及靈活的繞障探索方式可大大提高搜索效率，所需存儲量小，布線速度快。
  18. However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper

    充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
  19. Zhang liji ( material physics and chemistry ) directed by professor xie xiaoming this paper is intended to solve problems for those who are designing, using pbgas. failure mechanism, as well as cycles to failure of two groups of pbga samples ( with / without underfill ) for thermal cycling conditions in the range of - 40 ~ 125, were presented. the experiment shows that solder ball in the samples without underfill cracked after 500 times cycle, no crack was found in the underfilled samples even after 2700 cycles

    通過一系列的實驗，得到以下實驗結果： ?在本論文設定的溫度循環條件下，未充膠pbga樣品的熱疲勞品壽命在500周左右，充膠樣品的焊點壽命高於2700周； ?對于未充膠器件，中心距（ dnp ）是決定焊點應力、應變大小的最主要因素，裂紋總是從中心距較大處萌生並向中心處擴展； ?溫度循環的過程中焊盤附近焊料組織明顯粗化。
  20. Ysialon and casialon glasses also form at the interface. if 0. 45 % wt sio2 is added in the paste, the tungsten paste has low sheet resistance and matching shrinkage of a1n green - sheet bodies. at this concentration of sio2 in the paste, a1n substrate is little porous at interface

    在陶瓷介質和導帶漿料之間的界面位置，有sio _ 2 、 aln ，以及aln的添加劑cao和y _ 2o _ 3存在，它們四種單質材料發生反應，在界面位置形成ysialon ， casialon玻璃相和casialo和ysio的晶相，提高了焊盤的附著力。
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