熱容膨脹系數 的英文怎麼說

中文拼音 [rèróngpéngzhàngxìshǔ]
熱容膨脹系數 英文
thermal coefficient of expansion
  • 膨 : 動詞（物體的長度或體積增加） expand; swell
  • 脹 : 動詞1. （膨脹） expand; dilate; inflate 2. （脹大） swell; distend; bloat
  • 系 : 系動詞（打結; 扣） tie; fasten; do up; button up
  • 數 : 數副詞（屢次） frequently; repeatedly
  • 膨脹 : expand; swell; dilate; inflate; puff; bulge; inflation; expansion; dilatation; buckling; swelling...
  • 系數 : [數學] coefficient; ratio; modulus; quotient; factor
  1. Eev should be selected for various refrigeration systems according to the thermal properties of refrigerants ; the discharge coefficient of eev is sensitive to the aperture and impulse quantity of eev ; when the eev structure is made, the discharge coefficient goes up with the lowering of evaporation temperature or goes down with the hoisting of the condensation temperature. it is le

    對于不同工質的冷藏集裝箱製冷系統，電子膨脹閥應該根據具體製冷劑的熱力性質選取；電子膨脹閥流量系數對孔徑和脈沖數比較敏感；在結構固定時，流量系數隨蒸發溫度的降低而升高，隨冷凝溫度的增加而增大，受過冷度變化的影響較小；電子膨脹閥的容量受孔徑影響最大。
  2. Several materials with large coefficient of expansion were selected to make packaging components, and it was found that the packaging materials have good temperature sensitivity and compatibility with optical fibers. experimental accuracy and repetition of fbg temperature sensitivity and compensation were discussed. have selected several materials which has bigger coefficient of expansion to do packaging components, have made many temperature experiments, there have not flaws, such as aging, crackle, absciss layer, packaging materials have good temperature sensitivity and compatibility with optical fiber ; have designed the simple and practical packaging components, have performed a serials of experiments about accuracy and repetition of fbg wave - length, have obtained the first step conclusion ; have analyzed the result and made comparison between the result of different experiment, have summarized the best packaging effect and several rules to reduce mistskes

    本文所做的主要工作包括以下幾個內容：一、選取了常見的熱膨脹系數大的材料製作封裝元件，經過多次一80到80反復測試，封裝元件沒有出現老化開裂、封裝裂紋、空洞、離層等缺陷，封裝材料具有良好的溫敏穩定性及復用性，與光纖相容性較好；二、對光纖光柵進行簡單、實用的封裝處理，就封裝效果的優劣性、波長測量的準確度、重復性和封裝時產生的波長損失等方面進行了一系列的實驗，得出了初步的結論；三、對溫敏和溫度補償式封裝的實驗數據進行了詳細的分析和對比，從數字上對溫變過程中光纖光柵中心波長的改變及溫變曲線進行了定量的分析，在大量實驗數據分析結果的基礎上，總結出哪種材料封裝效果更好，以及如何有效的減小實驗誤差。
  3. It specifies the process of the design, simulation and experiment of liquid cooling system. main contents of the thesis are as follows : description of the present usage of liquid cooling system, presentation of a new type of liquid cooling system and description of its work principles ; design of the liquid cooling system, which mainly deals with the design and collating calculating of serpentine condenser and heat exchangers adopted in this system. meanwhile, the model chosen calculating of compressor 、 thermal expansion valve 、 plate evaporator 、 water pump and the like equipment used in the system are also carried out

    本文的主要內容如下:對液冷源使用現狀進行了描述，提出了一種新型液冷源系統並對其工作原理進行了闡述;對系統進行了設計，主要對系統中所採用的管帶式冷凝器和水側空/液換熱器進行了設計和校核計算，同時對系統中所用到的壓縮機、熱力膨脹閥、板式蒸發器、水泵等配套設備進行了選型計算;分別對製冷系統和冷卻液循環系統進行了數學建模。
  4. The results from simulation agree well with the conclusions of conference [ 21 ], and indicate that the boundary conditions have no obvious effect on the displacement and stress ; that the displacement and stress increase with linear heat expanding ratio, and those decrease with the specific heat of material ; that the displacement increases with the heat transfer ratio, but the stress does not

    數值模擬表明：邊界條件對位移和應力的影響非常小；位移隨著線熱膨脹系數、熱傳導系數的增大而增大，但是隨著比熱容的增大而減小；應力的最大值隨著線熱膨脹系數的增大而增大，而隨著比熱容的增大而減小，而熱傳導系數k對應力的影響比較小。
  5. A titanium alloys possess characteristics such as high specific strength, low thermal conductivity, good compatibility to medium and good resistant to hydrogen embrittlement, which makes a titanium alloy suitable for the use in liquid fuel tank and tube at cryogenic temperature

    鈦合金在低溫下具有比強度高、導熱率低、熱膨脹系數小、介質相容性好、抗氫脆等特點。這些性能特點使得鈦合金能很好的滿足液體燃料儲箱和低溫管道的使用要求。
  6. Temperature fluctuations caused by either power transients or environmental changes, along with the resulting thermal expansion mismatch between the various package materials, results in time and temperature dependent creep deformation of solder

    然而封裝的高密度使單位體積內容易產生更大的熱量，因此必須關注熱引起的封裝失效問題。特別是由於封裝材料間熱膨脹系數不匹配而導致的焊點失效。
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