熱封焊 的英文怎麼說

中文拼音 [rèfēnghàn]
熱封焊 英文
thermal heat sealing
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  1. ( 2 ) design of the implantating device : some quantity of 316l stainless steel, perform forging and thermal rolling, drawing filament ( diameter 0. 4mm and 0. 23mm respectively ), enlacing and jointing, after that assembling the products into guiding filum, a technical examination was carried out to appraise their physical capability. the second part : experimental study : animal experiments were used to screen and observe its validity and security : under general anesthesia, tracheotomy was performed on the healthy dog, the bronchus was localized using x - ray fluoroscopy fibrobronchoscope and with the help of the implanting equipment, several niti alloy occludes were implanted into the target bronchus of the dogs through the biopsy channel in the fibrobronchoscope

    （ 2 ）推送器的研製：取316l不銹鋼熱軋，分別拉製成不同直徑的不銹鋼絲分別用作製作內芯、外環及車制螺絲，再經纏繞、焊接、裝配成推送器。對上述兩者進行技術鑒定。第二部分：支氣管封堵器的實驗研究：四種形狀的封堵器分四組（上述四種封堵器各12隻）進行動物實驗，分別觀察其安全性與有效性。
  2. Glass. analysis of seals of two glasses obtained by hot welding. photo - elasticimetric method

    玻璃.熱焊雙層密封玻璃的分析
  3. Rf welding : many products require specialty bonding and our welding capabilities will accommodate these needs with specially designed state - of - the - art equipment

    在高頻焊接方面：世源科技公司經特殊設計的先進設備完全能夠滿足眾多產品需要高熱封接合要求的需要。
  4. Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design

    本論文正是針對以上情況，以採用引線鍵合工藝的三維疊層csp / bga封裝（裸晶元疊裝）為研究對象，在有限元分析軟體ansys中建立相關的有限元模型，編制了相應的apdl參數化分析程序，進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。
  5. This product is collod feathering achro, aticity and viscosity, wghhich can clear the thick oxideatice horizon hot pressed end plate or rollsteel plank which be processed or welded under hot temperature and hot pressure

    本產品為無色透明的粘稠狀膠體，針對不銹鋼熱壓封頭或用熱軋板製作工件等，經過高溫高壓處理或焊接時所產生紅、黑、黃等各種類型的較厚氧化層，清除迅速，徹底。
  6. Heater adopts high quality stainless steel, alloy heating wire, electrical melting mgo powder etc. to make the heating elements after passing advanced technology such as coiling wire, shrinking tube, removing humidity and sealing etc. the connection between flange and heating tube adopts hydrogen arc welding and vacuum lead welding to guarantee the heater without leakage under high voltage

    加熱器採用優質不銹鋼管合金加熱絲電熔氧化鎂粉等材料，經繞絲縮管排潮封口等先進的生產工藝製造而成的發熱元件法蘭與電熱管的聯接採用氬弧焊及真空釬焊，保證了加熱器在高壓下的不滲漏。
  7. The results of fe simulation shows that the mental package made abroad has lower thermal stress and higher reliability during working and manufacturing process than that made in china. it is mainly because that the two packaging structures were manufactured in different forming processes : one was punched and the other was brazed

    有限元計算的結果表明，採用沖壓一次成型的國外封裝外殼比採用異材壓焊的國產封裝外殼的工作熱應力和製造殘余熱應力要小很多，具有更高的可靠性。
  8. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  9. To our knowledge, for real flip chip packaging under the thermal loading, the paris equation obtained from experiment da / dn and simulation g is firstly reported here, and will be useful practically

    本文在熱循環加載條件下對實際倒裝焊封裝給出實驗da / dn和模擬g關系的paris方程，屬首次報導。
  10. 2. the delamination at the interface is one of typical failure mode for electronic packaging. in order to get more understanding of the propagation behaviour of [ he delamination, a series of finite element simulations related were done

    為了對界面分層及其傳播行為進行深入研究，本文對b型和d型兩種實驗倒裝焊封裝，在熱循環加載下，進行了有限元模擬。
  11. Semiconductor devices - mechanical and climatic test methods - part 20 : resistance of plastic - encapsulated smds to the combined effect of moisture and soldering heat

    半導體裝置.機械和氣候試驗方法.第20部分:塑料密封的smds抗濕氣和釬焊熱綜合影響的性能
  12. Standard practices for making heatseals for determination of heatsealability of flexible webs as measured by seal strength

    通過測量密封強度測定撓性網熱密封性能用熔焊的標準實施規范
  13. Semiconductor devices - mechanical and climatic test methods - resistance of plastic - encapsulated smds to the combined effect of moisture and soldering heat

    半導體器件.機械和氣候試驗方法.塑料包封的smds的抗濕及釬焊熱度綜合影響
  14. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
  15. It is proved that thermal fatigue is the main cause of the invalidity of the package. therefore, it is significant to research the reliability of solder ball under the thermal cycle

    實踐證明熱作用是晶元封裝組件失效破壞的主導因素，因此熱循環條件下的焊點可靠性研究有著非常重要的意義。
  16. Temperature fluctuations caused by either power transients or environmental changes, along with the resulting thermal expansion mismatch between the various package materials, results in time and temperature dependent creep deformation of solder

    然而封裝的高密度使單位體積內容易產生更大的熱量，因此必須關注熱引起的封裝失效問題。特別是由於封裝材料間熱膨脹系數不匹配而導致的焊點失效。
分享友人
分享到 Line

分享到臉書