熱擴散電流 的英文怎麼說

中文拼音 [rèkuòsǎndiànliú]
熱擴散電流 英文
thermal diffusion current
  • 擴 : 動詞（擴大） expand; enlarge; extend
  • 散 : 散動詞1. （由聚集而分離） break up; disperse 2. （散布） distribute; disseminate; give out 3. （排除） dispel; let out
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 流 : Ⅰ動1 （液體移動; 流動） flow 2 （移動不定） drift; move; wander 3 （流傳; 傳播） spread 4 （向壞...
  • 電流 : current; galvanic current; electric current; electricity; current flow電流保護裝置 current protec...
  1. Thus atom diffusion is a ' key factor to pecht. how do atoms diffuse under bpec heating

    因此，原子的擴散是決定脈沖大電流熱加工的重要因素。
  2. And is it the same as under radiation heating ? do the special electric and magnetic fields produced by bpec accelerate atom diffusion ? understanding the above questions fully is a key to expose the mechanism of pecht

    在脈沖大電流加工過程中原子是如何擴散的，與一般的加熱燒結、焊接是否一樣，脈沖大電流形成的特殊電場及磁場是否對原子的擴散有大的推動作用，弄清這些問題成為進一步揭示脈沖大電流熱加工機理的關鍵。
  3. In this paper, three unique models were designed to research atom diffusion at interface, contacting line and joining point under bpec heating and compare with it under radiation heating in order to find out if bpec speed atom diffusion. the first model was aimed to research atom diffusion at interface under bpec heating. experiment condition of bpec diffusion welding sheet cu and ni : direct diffusion welding, at a pressure of l0mpa, welded at 750 ~ 900, with heat rate of 200 ~ 400 / min for 10mm, on / off of 6 / l ~ 48 / 8, with die or not, vacuum of 6pa

    本文設計出三種樣品預構件，研究脈沖大電流加熱條件下片狀材料、線狀材料和球形顆粒之間的原子擴散過程，弄清脈沖大電流加熱條件下原子擴散與一般燒結和焊接過程中原子擴散的區別，以證實特殊的電場和磁場是否對原子的擴散有推動作用，揭示脈沖大電流加熱條件下原子的擴散過程，探索脈沖大電流熱加工技術快速高效的原因。
  4. The third model was designed to investigate atom diffusion at contacting point. fe was sintered at 500, 550 > 600, 650 > 700 under bpec and radiation heating. the test results of image processing indicated that the average pore size took on wavelike with temperature under bpec heating

    脈沖大電流加熱條件下，其它條件相同時，分別在800 、 900的溫度武漢理土大學碩士學位論文下擴散連接cu絲和ni絲，結果表明接觸線處cu和ni的擴散系數隨溫度的升高而增大。
  5. Pulse electric current heat treatment ( pecht ) developed by sodick, ltd., of japan, is a recently developed material processing method which consists of spark plasma sintering and welding, plasma activated sintering and welding, big pulse electric current ( bpec ) diffusion welding etc. the following are basic merits of pecht : rapid heating and cooling ; short sintering or welding time ; lowering sintering or welding temperature

    脈沖電流熱加工（ pulseelectriccurrentheattreatment ，比如燒結，焊接等）是九十年代發展起來的一種材料快速制備新技術，它包括放電等離子燒結與焊接、等離子活化燒結與焊接、脈沖大電流擴散焊接等。它具有升溫、降溫速度快、能在較低的溫度下燒結或焊接以及時間短的特點。
  6. Effect of thermal diffusion and electrostatic force on the evolution of wind - blown sand flow

    熱擴散和電場對風沙流發展過程的影響
  7. The effects of the fabrication conditions on the crystal structure, grain size, micromorphology and electrochemical performance of these materials have been studied in depth. the reaction mechanism of the low - heating solid - state reaction method has also been investigated. in addition, a novel electrochemical method ( rpg method ) based on the concept of " ratio of potentio - galvano - charge capacity " has been for the first time developed to determine the diffusion coefficient of lithium - ion within insertion - host materials on the basis of the spherical diffusion model

    本論文較系統地考察了低熱固相反應法合成鋰離子電池正極材料的可行性問題，研究了工藝條件對材料的晶體結構、晶粒尺寸、微觀形貌及電化學性能等的影響，探討了低熱固相反應的機理，並通過引進「恆壓-恆流充電容量比」的概念，給出了一種測定鋰離子嵌入脫出固相擴散系數的新方法。
  8. As a matter of fact, pecht is achieved by atom diffusing

    實際上，脈沖大電流熱加工過程是由原子的擴散過程來實現的。
  9. The samples were welded at 750, 800, 850 and 900. the diffusion coefficients ( d ) of cu and ni at interface increased with the increase of welding temperature. and comparing with radiation heating, atom diffusion velocity at interface quickened

    其它條件相同時，分別在750 、 800 、 850 、 900的溫度下採用脈沖大電流加熱連接cu和ni片狀材料，結果表明接觸面處cu和ni的擴散系數隨溫度升高而增大。
  10. Scandate cathode has outstanding properties of high emission at low work temperature. it ’ s the only thermionic cathode which can suffice to the development of new electronic device ’ s requirement

    含鈧擴散陰極具有極其優異的低溫高電流密度的電子發射的能力，是目前唯一能滿足新型電子器件發展要求的熱陰極材料。
  11. With the finite - difference method, self - consistent solutions for the possion ' s equation, injected current density, carrier concentration, optical field and thermal conduction equations have been realized to study the thermal - field properties, the coupling of electricity, thermal and optical - fields, and the influences of n - dbr and double oxide - confining regions on the characteristics of vcsels

    本文建立了一個直接耦合的準三維理論模型，通過有限差分法求解泊松方程、載流子擴散方程、熱傳導方程和光場方程的自洽解，研究了vcsel的熱場分佈特性，並實現了電、熱和光場的耦合，同時考慮了n - dbr及雙氧化限制層對vcsel特性的影響。
  12. The performance of liquid dmfc is evaluated as a function of the composition and structure of meas, hot - pressing condition and activation process by means of v - i polarization and ac impedance spectrometry

    本研究採用電流電壓極化曲線和交流阻抗譜方法，對膜電極的熱壓條件、擴散層和催化劑層的組成與結構、電極活化過程等因素對液體進料dmfc性能的影響進行了全面的研究。
  13. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
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