熱疲勞裂紋 的英文怎麼說

中文拼音 [rèpíláolièwén]
熱疲勞裂紋 英文
heat fatigue cracking
  • 疲 : 形容詞（疲乏; 勞累） tired; weary; exhausted
  • 勞 : Ⅰ動詞1 （勞動） work; labour 2 （煩勞） put sb to the trouble of; trouble sb with sth : 勞您費心...
  • 裂 : 裂動詞[方言] （東西的兩部分向兩旁分開） open
  • 紋 : 名詞（花紋; 紋縷兒） lines; veins; grain
  • 疲勞 : 1. （疲乏勞累） tired; fatigued; weary; become fagged 2. （機能或反應能力減弱） fatigue; strain 3. [物理學] fatigue
  1. Acted a pulse current to prevent the thermal fatigue crack subcritical extending

    脈沖放電截止熱疲勞裂紋的亞臨界擴展
  2. Abstract : in the light of two common failure modes in use, i. e. thermal wear and hot fatigue crack, this paper analyzes the reasons and puts forward the measures to be taken for improving the life of forging die

    文摘:針對鍛模在使用過程中常見的兩種失效形式，即熱磨損和熱疲勞裂紋，分析了其產生的原因，並提出了為提高鍛模壽命而應採取的措施。
  3. Abstract : the process of thermal fatigue crack propagation on the surface of steel bonded carbide gjw35 under the action of thermal stress has been observed

    文摘:觀察了在熱應力作用下gjw35鋼結硬質合金表面熱疲勞裂紋擴展過程。
  4. The results show that the thermal fatigue cracks after forming propagate preferentially in the hard phase, and the propagation of crack is stoped and dulled when it meet steel basic phase

    結果表明:萌生后的熱疲勞裂紋優先在硬質相中擴展，遇到鋼基體相后受阻、鈍化。
  5. During the thermal cycling cracks propagation, cracks deflection, bridge and pinning are the most predominant reasons that the improvement of thermal shock fatigue resistance of composites

    在熱震循環裂紋擴展中，裂紋偏轉、橋聯和釘扎是復合陶瓷熱震疲勞抗力得到改善的主要原因。
  6. The thermal fatigue resistance of al2o3 - 20wt. % tic is the best, it is due to high kic and pore of the material. the pore decrease the stress extension of tip of cracks and delay themal shock fatigue cracks extension. 4

    含20wt . tic的復合陶瓷具有高的k _ （ 1c ）和較多的孔隙，這些空隙在熱震疲勞時降低熱震疲勞裂紋尖端的應力集中並阻礙裂紋擴展從而提高了材料的斷裂抗力，故其具有最好的抗熱疲勞性能。
  7. The surface of the films was observed for the films heated with many times by laser beam, it was found that pzt films " interfacial crack appeared

    重復多次激光作用后，觀察其形貌，發現薄膜出現界面裂紋，這與鄭學軍用激光熱疲勞模型預測的結果一致。
  8. Zhang liji ( material physics and chemistry ) directed by professor xie xiaoming this paper is intended to solve problems for those who are designing, using pbgas. failure mechanism, as well as cycles to failure of two groups of pbga samples ( with / without underfill ) for thermal cycling conditions in the range of - 40 ~ 125, were presented. the experiment shows that solder ball in the samples without underfill cracked after 500 times cycle, no crack was found in the underfilled samples even after 2700 cycles

    通過一系列的實驗，得到以下實驗結果： ?在本論文設定的溫度循環條件下，未充膠pbga樣品的熱疲勞品壽命在500周左右，充膠樣品的焊點壽命高於2700周； ?對于未充膠器件，中心距（ dnp ）是決定焊點應力、應變大小的最主要因素，裂紋總是從中心距較大處萌生並向中心處擴展； ?溫度循環的過程中焊盤附近焊料組織明顯粗化。
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