熱處理裂紋 的英文怎麼說

中文拼音 [rèchǔlǐlièwén]
熱處理裂紋 英文
heat-treatment craft
  • 處 : 處名詞1 （地方） place 2 （方面; 某一點） part; point 3 （機關或機關里一個部門） department; offi...
  • 理 : Ⅰ名詞1 （物質組織的條紋） texture; grain （in wood skin etc ） 2 （道理;事理） reason; logic; tru...
  • 裂 : 裂動詞[方言] （東西的兩部分向兩旁分開） open
  • 紋 : 名詞（花紋; 紋縷兒） lines; veins; grain
  • 熱處理 : [冶金學] heat treatment; heat treating熱處理保護塗料 heat treatment protective coating; 熱處理車...
  1. Microcracks and stresses will appear if the dropping speed, aluminum content and dropping cycles are too high. high temperature heat - treatment can eliminate and help to obtain compact thick film

    當提拉速度、溶膠濃度和鍍膜次數較大時膜內易出現微裂紋和脫落等缺陷， 550熱處理5h可以消除缺陷，獲得緻密厚膜。
  2. The prevention of quenching crackles in heat - treating technology

    熱處理工藝中淬火裂紋的預防
  3. Several materials with large coefficient of expansion were selected to make packaging components, and it was found that the packaging materials have good temperature sensitivity and compatibility with optical fibers. experimental accuracy and repetition of fbg temperature sensitivity and compensation were discussed. have selected several materials which has bigger coefficient of expansion to do packaging components, have made many temperature experiments, there have not flaws, such as aging, crackle, absciss layer, packaging materials have good temperature sensitivity and compatibility with optical fiber ; have designed the simple and practical packaging components, have performed a serials of experiments about accuracy and repetition of fbg wave - length, have obtained the first step conclusion ; have analyzed the result and made comparison between the result of different experiment, have summarized the best packaging effect and several rules to reduce mistskes

    本文所做的主要工作包括以下幾個內容：一、選取了常見的熱膨脹系數大的材料製作封裝元件，經過多次一80到80反復測試，封裝元件沒有出現老化開裂、封裝裂紋、空洞、離層等缺陷，封裝材料具有良好的溫敏穩定性及復用性，與光纖相容性較好；二、對光纖光柵進行簡單、實用的封裝處理，就封裝效果的優劣性、波長測量的準確度、重復性和封裝時產生的波長損失等方面進行了一系列的實驗，得出了初步的結論；三、對溫敏和溫度補償式封裝的實驗數據進行了詳細的分析和對比，從數字上對溫變過程中光纖光柵中心波長的改變及溫變曲線進行了定量的分析，在大量實驗數據分析結果的基礎上，總結出哪種材料封裝效果更好，以及如何有效的減小實驗誤差。
  4. The reheating embrittlement of a crack - free steel during post - welding heat treatment

    無裂紋鋼的焊后熱處理與再熱脆性
  5. According to these, the paper put forward some countermeasures : select low carbon steel or low metal alloy steel with lower intensity, like 20r steel ; while welding, adopt strict craft measures with lower welding heat to input ; after jointing, proceed the whole hot dissolving on time ; control each welding joint with hardness hb 185 ; add 0. 25 % water into the liquid ammonia as decay eclipse ; enhance checking in operation, repairing equipment in time through regular interior and exterior checking

    針對上述原因提出了防止氨冷器類臨氨壓力容器產生應力腐蝕裂紋的對策：選用強度稍低，但抗裂性較好的低碳鋼和低合金鋼，如用20r鋼製造；焊接時應採用嚴格的工藝措施和較低的焊接熱輸入量；焊后應及時進行整體消除應力熱處理；控制焊接接頭各區硬度hb 185 ；在液氨中添加0 . 25 %的水作為緩蝕劑；在運行中加強檢查，及時進行停車檢修時的內外部檢查和定期檢驗。
  6. Perforation of heat exchange tube, cracks on the jointing connection of heat exchange tube and tube bundle hoard result in the leakage of the tube bundle in sulfur condenser were analyzed, proposed precautions and countermeasures were derived from a combination of the plant operation conditions and equipment conditions, the original equipment with satisfactory outcome were revamped

    摘要分析了硫冷凝器換熱管穿孔及換熱管與管板連接焊接接頭出現裂紋導致管束泄漏的原因，結合實際工況提出了預防和處理措施，並對原設備進行了改造，效果良好。
  7. After heat treatments, the granularity of powders increases and ultraf ine grains decreases. cracks appear on the surface of powders. so the rigidity of powders descends

    熱處理后粉末的粒度增大，微細顆粒的比例減小，表面出現裂紋，降低了粉末的硬度，同時粉末團聚作用減弱。
  8. At the same time, bem formulae for interface crack analysis of thermal barrier coated structures are given in this paper. the method to evaluate nearly - singular integrals over crack tip elements and the formulae for calculating stress intensity factors ( sif ) using open and slip displacements on crack faces are presented too

    基於邊界元法、斷裂力學等基本理論，本文導出了帶熱障塗層構件界面裂紋的斷裂特性分析邊界元法公式；結合先進的近奇異積分技術處理裂尖元的近奇異積分，利用位移法計算層間界面裂紋的應力強度因子。
  9. During the fabrication or service, if the applied tensile stresses exceed the probabilistic tensile strength of silicon, then failure will occur. even a tiny crack will bring tremendous damage to devices and circuits. especially nowadays, with the increasing of silicon wafer diameter, warpage in heat treatment, defects and dislocations generated in silicon often become critical problems in ulsi devices fabrication

    特別在大規模集成電路與器件生產中，一個微小的裂紋就可能導致后道工序中電路與器件的完全損壞；而且在熱處理過程引起的翹曲，使光刻精度下降；在矽片內部產生的氧沉澱及位錯等缺陷，會導致集成電路或器件的漏電流增加，使器件失效。
  10. This article will introduce the factors that cause the cracking of carbon - graphite products in the process of graphitization producing technology and give the preventive measures on the basis of analyzing the main reasons for the waste products with cracking during the best treated of graphitization

    摘要主要介紹了在石墨化生產工藝過程中，引起炭石墨製品裂紋的各種因素，分析了在石墨化熱處理過程中產生裂紋廢品的主要原因，並提出了相應的預防措施。
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