片狀電容器 的英文怎麼說

中文拼音 [piānzhuàngdiànróng]
片狀電容器 英文
chicapacitor
  • : 片構詞成分。
  • : Ⅰ名詞1 (形狀) form; shape 2 (情況) state; condition; situation; circumstances 3 (陳述事件或...
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : 名詞1. (器具) implement; utensil; ware 2. (器官) organ 3. (度量; 才能) capacity; talent 4. (姓氏) a surname
  • 片狀 : schistose片狀避雷器 plate protector; 片狀電容器 chip capacitor; 片狀結構 laminated structure; 片...
  • 電容器 : capacitor; condenser; current condenser; electrical condenser
  • 電容 : electric capacity; capacitance; capacity
  1. In oilfield, feeder line of 6kv often has many branches. the pole high voltage automotive capacitor compensation system controlled by single chip computer is designed for this situation. in the system, we separate the measure position and compensation position and realize the supervision of reactive load in local area

    文章以油田6kv輸配線路為例,針對多分支樹結構線路的特點,研製出由單機系統控制的戶外術上型高壓自動補償系統。
  2. Detail specification for electronic components. multilayer ceramic chip capacitors, type ct41. assessment level e

    子元件詳細規范. ct41型多層瓷介.評定水平e
  3. Detail specification for electronic components. multilayer ceramic chip capacitors, type cc41. assessment level e

    子元件詳細規范. cc41型多層瓷介.評定水平e
  4. Fixed chip capacitors with metallized electrodes and polyethylene - terephthalate dielectric, sectional specification for

    鍍金屬引線和聚對苯二甲酸乙酯介質的固定片狀電容器的分規范
  5. Fixed metalized polyethylene - terephthalate film dielectric chip capacitors for direct current - encapsulated, blank detail specification for

    直流用封裝的固定鍍金屬聚對苯二甲酸乙酯薄膜介質片狀電容器的空白詳細規范
  6. A g reat deai of tests showthat the power suppiy circuit, the ac current and voitage circuit, communication and the binary input circuit are the main routes for transient. the filter, three - terminal chip capacitor and the capacitor can be used in the lowvoitage power suppiy circuit ( 5v. + l - 15v and 24v ) to restrain the efts affecting thedigital system

    3提出在5v 、 + / - 15v 、 24v弱源迴路中,通過增加適用於弱系統濾波、 emi濾波以及在弱源端加入等措施,可以有效地抑制瞬變騷擾對數字系統的影響。
  7. The exact design methods of switched - current filters are summarized, such as the director synthesis of z - plane, euler mapping, state variable analysis, matrix decomposition, and signal - flow - graph simulation of the lc and switched capacitor prototypes. at the same time, a modified left decomposition matrix method is proposed to overcome the usual problems of large silicon area, high sensitivity and component spreads by minimizing the input circuits. examples of switched - current low - pass, high - pass and band - pass filters are given to verify the feasibility of these methods

    總結分析了實現高精度開關流濾波設計的各種實用方法,包括z域綜合法、歐拉映射法、模擬無源lc網路和開關網路的態變量法、矩陣分解法和信號流圖轉置法,並對左分解法加以整理改進,提出一種更為簡潔的設計結構,通過減化輸入路克服一般路中存在的佔用矽面積大、靈敏度高等問題。
  8. Fixed capacitors for use in electronic equipment - part 20 : sectional specification : fixed metallized polyphenylene sulfide film dielectric chip d. c. capacitors

    子設備用固定.第20部分:分規范:金屬化聚亞苯基硫醚膜介質直流固定
  9. Fixed capacitors for use in electronic equipment - part 20 : blank detail specification : fixed metallized polyphenylene sulfide film dielectric chip d. c. capacitors assessment level ez

    子設備用固定.第20部分:空白詳細規范:金屬化聚亞苯基硫醚膜介質直流固定.評定等級ez
  10. Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability type ctk4103

    Ctk4103型有可靠性指標的非密封多層瓷介固定詳細規范
  11. Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability type cck4104

    Cck4104型有可靠性指標的非密封多層瓷介固定詳細規范
  12. Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability type cck4103

    Cck4103型有可靠性指標的非密封多層瓷介固定詳細規范
  13. Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability type ctk4104

    Ctk4104型有可靠性指標的非密封多層瓷介固定詳細規范
  14. Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability type ctk4102

    Ctk4102型有可靠性指標的非密封多層瓷介固定詳細規范
  15. Fixed capacitors for use in electronic equipment part 3 : blank detail specification ; chip capacitors assessment level e

    子設備用固定.第3部分:空白詳細規范.鉭固定
  16. Abstract : the development of the chip ceramic capacitor, pdp ( plasma displays ), silicon solar cell and electronic package was reviewed in the present paper, and the requirements to electronic pastes and the growing trend of base metals electronic pastes were introduced

    摘要:本文評述了我國多層式陶瓷、 pdp平板顯示、硅太陽能池、子封裝等的發展現以及對子漿料的要求,同時還評述了賤金屬漿料的發展趨勢。
  17. Fixed capacitors for use in electronic equipment part 10 : sectional specification : fixed multilayer ceramic chip capacitors

    子設備用固定.第10部分:分規范:多層陶瓷固定
  18. Fixed capacitors for use in electronic equipment - part 10 : blank detail specification : fixed multilayer ceramic chip capacitors assessment level e

    子設備用固定.第10部分:空白詳細規范:多層陶瓷固定.評估等級e
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